TWI410287B - 液處理裝置及處理液供給方法 - Google Patents

液處理裝置及處理液供給方法 Download PDF

Info

Publication number
TWI410287B
TWI410287B TW97135006A TW97135006A TWI410287B TW I410287 B TWI410287 B TW I410287B TW 97135006 A TW97135006 A TW 97135006A TW 97135006 A TW97135006 A TW 97135006A TW I410287 B TWI410287 B TW I410287B
Authority
TW
Taiwan
Prior art keywords
chemical solution
solvent
supply
unit
additional chemical
Prior art date
Application number
TW97135006A
Other languages
English (en)
Chinese (zh)
Other versions
TW200930469A (en
Inventor
Yuji Kamikawa
Shigenori Kitahara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200930469A publication Critical patent/TW200930469A/zh
Application granted granted Critical
Publication of TWI410287B publication Critical patent/TWI410287B/zh

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
TW97135006A 2007-09-26 2008-09-12 液處理裝置及處理液供給方法 TWI410287B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007249371 2007-09-26
JP2008219340A JP5198187B2 (ja) 2007-09-26 2008-08-28 液処理装置および処理液供給方法

Publications (2)

Publication Number Publication Date
TW200930469A TW200930469A (en) 2009-07-16
TWI410287B true TWI410287B (zh) 2013-10-01

Family

ID=40701260

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97135006A TWI410287B (zh) 2007-09-26 2008-09-12 液處理裝置及處理液供給方法

Country Status (2)

Country Link
JP (1) JP5198187B2 (ja)
TW (1) TWI410287B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5203435B2 (ja) * 2010-09-17 2013-06-05 東京エレクトロン株式会社 液処理方法、その液処理方法を実行させるためのプログラムを記録した記録媒体及び液処理装置
JP6212253B2 (ja) 2012-11-15 2017-10-11 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
US10780461B2 (en) 2015-05-15 2020-09-22 Taiwan Semiconductor Manufacturing Co., Ltd Methods for processing substrate in semiconductor fabrication
US10935896B2 (en) 2016-07-25 2021-03-02 Applied Materials, Inc. Cleaning solution mixing system with ultra-dilute cleaning solution and method of operation thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW447026B (en) * 2000-05-24 2001-07-21 Nagase & Co Ltd Substrate surface treating apparatus
TW550630B (en) * 2000-06-26 2003-09-01 Applied Materials Inc Method and apparatus for wet processing wafers
US6799883B1 (en) * 1999-12-20 2004-10-05 Air Liquide America L.P. Method for continuously blending chemical solutions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608040A (ja) * 1983-06-27 1985-01-16 Nippon Telegr & Teleph Corp <Ntt> 熱収縮チユ−ブ作製方法
JPS60165560A (ja) * 1984-02-08 1985-08-28 Tokyo Electric Power Co Inc:The 導電率測定方法
JPS628040A (ja) * 1985-07-05 1987-01-16 Hitachi Ltd 洗浄装置
JPH0641664B2 (ja) * 1986-03-14 1994-06-01 東洋紡績株式会社 薬液処理装置
JP2658919B2 (ja) * 1994-11-14 1997-09-30 日本電気株式会社 薬液組成モニタ方法およびその装置
JP2677263B2 (ja) * 1995-07-20 1997-11-17 日本電気株式会社 薬液組成モニタ方法およびその装置
JPH1070101A (ja) * 1996-08-27 1998-03-10 Hitachi Ltd 半導体装置の製造方法ならびに製造装置、洗浄方法ならびに洗浄装置、加工装置、流体混合用配管、および、洗浄用液体供給部材
JP3537976B2 (ja) * 1996-11-22 2004-06-14 大日本スクリーン製造株式会社 基板処理装置
JP2000208471A (ja) * 1999-01-11 2000-07-28 Kurita Water Ind Ltd 電子材料用洗浄水の調製装置
JP2005189207A (ja) * 2003-12-26 2005-07-14 Dainippon Screen Mfg Co Ltd 基板処理装置およびそれに用いられる処理液濃度測定装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6799883B1 (en) * 1999-12-20 2004-10-05 Air Liquide America L.P. Method for continuously blending chemical solutions
TW447026B (en) * 2000-05-24 2001-07-21 Nagase & Co Ltd Substrate surface treating apparatus
TW550630B (en) * 2000-06-26 2003-09-01 Applied Materials Inc Method and apparatus for wet processing wafers

Also Published As

Publication number Publication date
TW200930469A (en) 2009-07-16
JP2009098128A (ja) 2009-05-07
JP5198187B2 (ja) 2013-05-15

Similar Documents

Publication Publication Date Title
KR100904452B1 (ko) 오존수혼합액 공급장치 및 방법, 그리고 이를 구비하는기판 처리 설비
US6762832B2 (en) Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy
US10276408B2 (en) Flow-rate regulator device, diluted chemical-liquid supply device, liquid processing apparatus and its operating system
TWI410287B (zh) 液處理裝置及處理液供給方法
US6261845B1 (en) Methods and systems for determining chemical concentrations and controlling the processing of semiconductor substrates
US20060021634A1 (en) Method and apparatus for creating ozonated process solutions having high ozone concentration
KR101263537B1 (ko) 사용 지점 공정 제어 블렌더 시스템 및 상응 방법
JP2010253471A (ja) 連続式混合装置を用いた化学組成物の製造装置
US8491726B2 (en) Liquid processing apparatus and process liquid supplying method
WO2018179503A1 (ja) 規定濃度水の供給方法及び装置
JPH0737851A (ja) 洗浄装置
KR20090032649A (ko) 처리액 공급장치 및 그 방법
JPH0634890B2 (ja) 薬液調合方法
TW202101567A (zh) 基板處理裝置及基板處理方法
JP3773390B2 (ja) 基板処理装置
KR101043715B1 (ko) 기판 처리 장치
JP4253914B2 (ja) ガス溶解洗浄水の評価装置
JP2001009257A (ja) 混合装置
JP3673400B2 (ja) 基板処理装置
JP2020145217A (ja) 流体評価用装置及び基板処理装置
JPH11340186A (ja) 半導体処理装置
JP2024101855A (ja) 基板処理方法及び基板処理装置
KR20230104496A (ko) 오염 시료 제작을 위한 약액 공급 장치
JPH043425A (ja) 洗浄液の清浄度評価方法および装置
JP2002181690A (ja) 粒径分布測定装置