TWI406736B - Tool having sintered-body abrasive portion and method for producing the same - Google Patents

Abstract

An efficiently processible polishing tool, particularly used for a CMP pad conditioner, capable solving problems in a fixing strength for fixing abrasive grains to a base plate and problems in nonuniform polished surface and a method of effectively manufacturing the polishing tool. The polishing tool (1) comprises a polishing part formed of a super abrasive grain sintered body sintered integrally with the lining material of a cemented carbide. The polishing part comprises a plurality of polishing units (2) with top parts. The top parts are positioned on an approximately same plane. The polishing units (2) are formed by forming a linear groove (3) group in the polishing part.

Description

Tool having sintered body polishing portion and method of manufacturing the same

The present invention relates to a tool having a sintered body polishing portion and a method of manufacturing the same, and more particularly to a chemical-mechanical polishing (CMP) liner for high-flatness. And an abrasive tool for processing various semiconductor materials and an efficient manufacturing method thereof with high efficiency.

In recent years, with the development of multilayer wiring of LSI devices, CMP has been used to planarize metal film wafers such as interlayer insulating films and germanium. In order to maintain the high flatness and wafer polishing speed of the abrasive pad (usually a rigid foamed polyurethane) used in CMP, the surface of the polishing pad must be continuously or intermittently trimmed.

When the polishing pad was previously trimmed, a tool for fixing the diamond particles to the substrate by electrodeposition was used. Such a electrodeposition finishing tool, for example, is known as a rotary grinding tool which is configured such that a hollow field in which no particles are disposed is disposed in the center of a circular surface of a circular plate-shaped abutment, respectively a first layer of granules is disposed, and a second layer of granules is disposed on the outer side thereof; in the field of the first layer of granules, a plurality of layers of small granules are arranged at predetermined intervals; each layer of granules is super The ruthenium particles are fixed on the surface of the slightly spherical portion of the ridge portion by means of a metal coating layer; in the field of the second ruthenium layer, the ruthenium particles are fixed to the ring by means of a metal coating layer. On the circumferential ridge portion (Patent Document 1).

In such an electrodeposition type tool, since the cerium particles are fixed to the substrate only by the physical fixation of the electrodeposited nickel, the holding force may not be satisfied, and the diamond granules may fall off during use, and the life of the tool remains to be awaited. improve.

In addition, there is also a conventional abrasive tool comprising a enamel layer which is fixed by a resin adhesive to a circular rotating plane, and has a radial and concentric shape on the surface of the enamel layer. Seam (Patent Document 2).

However, it is not always possible to achieve the degree of retention of the granules by the resin adhesive, and it is not possible to achieve a sufficient tool life due to the use, and the electrodeposition tool cannot be satisfied.

Further, a dresser in which a polycrystalline diamond thin film is formed by a vapor phase synthesis method on a working surface of a metal base having a convex portion is also known (Patent Document 3).

However, when a diamond thin film is formed by a vapor phase synthesis method, it is difficult to faithfully form a small uneven portion of a metal base portion, and sufficient precision is not necessarily obtained, and the bonding strength between the film and the metal base portion is also insufficient.

The above-described conventional polishing tool (pad conditioner) has a structure in which a plurality of particle particles having different particle diameters are fixed on a substrate (metal base), and thus it is difficult to obtain the same grain (vertex) plane. In the trimming process, only the particles that are most prominent on the substrate (metal base) are used, and the particles that cause excessive load are consumed intensely, often resulting in failure to use the tool before it reaches the original life.

For example, a polishing pad made of a foaming urethane and a tool for fixing a super-fine particle such as a diamond to a surface of a metal base made of a rigid metal without depending on the free granules can be used. In the wafer, the time and cost of the trimming can be achieved. However, in order to achieve the above-mentioned purpose, the super-grain layer of the diamond or the like which is disposed on the metal base to form the blade must have a high-precision plane. And need to be maintained. But these tools are not fully achieved.

[Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei.

In view of the above problems, an object of the present invention is to provide an abrasive tool which can be efficiently processed and an effective manufacturing method thereof, which solves the problems of the strength of the ruthenium particles fixed to the substrate, the unevenness of the polishing surface, and the like. In particular, an abrasive tool for processing a surface of a semiconductor wafer or the like with high precision and high efficiency as a CMP pad conditioner is provided.

The inventors of the present invention have intensively studied in order to solve the above problems, and have found that the polishing tool having the polishing portion composed of the super-sintered sintered body can be solved by forming a specific plurality of polishing units by the polishing portion. The problem is further sustained by the results of the study, and the present invention has been completed.

That is, the present invention relates to an abrasive tool which is an abrasive tool having a polishing portion composed of a super-sintered sintered body, wherein the polishing portion includes a plurality of polishing units having a top portion, each of which is located on the same plane with respect to each other.

Further, the present invention relates to the above-mentioned polishing tool, wherein the polishing portion is composed of a super-sintered sintered body integrally sintered with a primer material of a super-hard alloy; the polishing unit is formed by a straight line on the polishing portion Formed by a group of grooves.

Further, the present invention relates to the aforementioned abrasive tool, wherein the top is edged.

Further, the present invention relates to the aforementioned grinding tool, wherein the polishing unit is in the shape of a quadrangular pyramid or a quadrangular frustum.

Further, the present invention relates to the above-described polishing tool, wherein the polishing unit is in the shape of a quadrangular frustum, and at least one side of the top is edged.

Furthermore, the present invention relates to the above-described polishing tool, wherein the polishing unit is in the shape of a triangular pyramid or a triangular frustum.

Further, the present invention relates to the above-described polishing tool, wherein the polishing unit has a triangular frustum shape, and at least one side of the top is edged.

Further, the present invention relates to the above-described abrasive tool, wherein the shape of the top of the polishing unit is a linear ridge line.

Further, the present invention relates to the polishing tool described above, wherein the polishing unit is a quadrangular pyramid shape or a triangular pyramid shape, and the pitch of the polishing unit is 1500 μm or less and 200 μm or more.

Furthermore, the present invention relates to the polishing tool described above, wherein the polishing unit has a quadrangular pyramid shape or a triangular pyramid shape, and the height of the polishing unit is 200 μm or less and 30 μm or more.

Further, the present invention relates to the aforementioned grinding tool, wherein the super granule is a diamond.

Further, the present invention relates to the aforementioned grinding tool, wherein the diamond has a nominal particle size of 40 μm to 60 μm or less.

Moreover, the present invention relates to the above-described polishing tool, wherein the super-sintered sintered body has a thickness of 0.1 mm or more.

Further, the present invention relates to the aforementioned abrasive tool, wherein the abrasive tool is in the form of a disk or an annular shape.

Further, the present invention relates to the above grinding tool, wherein the polishing portion is in the form of a disk or an annular shape.

Further, the present invention relates to the above polishing tool, wherein the polishing portion has an outer diameter of 90 mm or more.

Further, the present invention relates to the above-mentioned polishing tool, wherein the height of the groove bottom to the top of the polishing portion is 1 mm or less.

Furthermore, the present invention relates to the above-described polishing tool, wherein the polishing portion is composed of two or four divided polishing portions, and the divided polishing portions are fan-shaped with the same central angle.

Furthermore, the present invention relates to the above grinding tool, wherein the divided grinding portion has two groove groups; the first groove group is disposed in a radial direction parallel to the edge of the divided polishing portion; and the second groove group is formed vertically. In the first group of grooves.

Further, the present invention relates to the above-described polishing tool, wherein the polishing portion is composed of three or six divided polishing portions, and the divided polishing portions are fan-shaped with the same central angle.

Furthermore, the present invention relates to the above-mentioned polishing tool, wherein the divided polishing portion has three groove groups; the first groove group is disposed in a radial direction parallel to the edge of the divided polishing portion; the second groove group and the third groove group , respectively, are formed to intersect with the first groove group at an angle of 60° and 120°

Further, the present invention relates to the aforementioned grinding tool, wherein the groove is formed by wire-cut electric discharge machining.

Further, the present invention relates to the aforementioned grinding tool which is a CMP pad conditioner.

Further, the present invention relates to a method for producing an abrasive tool having a polishing portion composed of a super-sintered sintered body, comprising: (1) sintering super-fine particles on a base material of a super-hard alloy to be integrated; a step of obtaining a super-sintered sintered body; (2) a step of flattening a polished portion of the obtained super-sintered sintered body; and (3) providing a linear groove group on the flattened super-grained abrasive body to form The step of making a plurality of grinding units to form a polishing portion.

Moreover, the present invention relates to a method for producing an abrasive tool having a polishing portion composed of a super-sintered sintered body, comprising: (1) sintering super-fine particles on a primer material of a super-hard alloy to be integrated; a step of obtaining a super-sintered sintered body; (2) a step of cutting out a sector-shaped divided polishing portion from the obtained super-sized sintered body; (3) obtaining a sector-shaped division obtained in the above step (2) a step of dividing a plurality of sector-shaped divided polishing portions having the same central angle of the polishing portion; (4) bringing the plurality of segment-shaped divided polishing portions obtained in close proximity to each other and fixing the surface of the flat substrate to a flat plate shape or a ring shape And (5) providing a step of forming a plurality of polishing units by forming a groove between the divided polishing portions of the disk-shaped or annular polishing portion obtained in the above step (4).

Furthermore, the present invention relates to a method for regenerating a polishing tool according to any one of the above, comprising the step of regenerating the top of the groove and the polishing unit by wire-cut electrical discharge machining.

In the polishing tool of the present invention, the polishing portion formed of the super-sintered sintered body is sintered at a temperature equal to or higher than the melting temperature of the bonding material, so that the fixing strength of the super-fine particles is increased, and the polishing strength is not substantially removed. advantage. In particular, when diamond particles are used as super granules, in the process, the diamond is supplied under the temperature and pressure conditions in which the bonding material metal is melted and the thermodynamics of the diamond is stable; the diamond granules are partially dissolved by the bonding material metal However, it is strongly integrated with the metal of the bonding material, so that the fixing strength becomes larger and does not substantially fall off.

Further, in general, unevenness may occur during sintering in a large area, and it is difficult to produce a uniform large-diameter polishing portion. However, in the polishing tool of the super-sintered sintered body produced by the plurality of divided polishing portions, the super-fine sintered body of small diameter which does not cause unevenness in sintering is cut, and the divided-grinding portion of the large-diameter sector is cut and combined. A plurality of sectors are formed into a large radius of the grinding portion, so that a uniform and high-precision grinding tool can be produced.

Further, a polishing portion having a polishing unit is formed, and the surface thereof is formed of a super-sintered sintered body having a sufficient thickness, whereby even if the polishing unit is worn out by use, it can be easily processed by wire-cut electrical discharge or the like. The groove and the polishing unit are regenerated and reused as the polishing tool of the present invention.

Further, each of the polishing units of the present invention is arbitrarily cut out from a super-sintered sintered body such as a diamond sintered body by wire-cut electric discharge machining or the like; and the bottom surface of the triangular pyramid and the quadrangular pyramid is leveled. It is easy to control and is a tool with a high-precision grinding surface (horizontal surface) compared with conventional grinding tools. In particular, when used as a CMP pad conditioner, the surface of a wafer or the like can be processed with high precision and high efficiency.

[Best form of implementing the invention]

The super-granule sintered body which is a material of the polishing tool of the present invention is obtained by subjecting a super-powdered powder such as diamond or c-BN (cubic boron nitride) to an ultrahigh-pressure high-temperature process by a usual method. Since the sintered system in this state has a large-sized sintered body of a super-small grain, the film is substantially flattened by die discharge machining or the like in advance. Next, the grinding unit, that is, the protruding portion that is in direct contact with the object to be polished, is formed by the step of forming the groove of the specific aspect and the side of the protrusion. Further, when a commercially available product is used as the super-sintered sintered body, the above treatment differs depending on the specifications, and if the surface is flattened, the pre-processing step of planarization can be omitted.

The method for forming the trench may be wire-cut electrical discharge machining, die electrical discharge machining, other types of precision electrical discharge machining, or laser processing, but wire-cut electrical discharge machining is preferred; in particular, the top of the polishing unit is sharpened. In the case of time and so on, wire cut discharge machining is particularly good. The wire-cut electric discharge machining method drives a metal wire for electric discharge machining along the surface of the super-sintered sintered body, and the material is removed by discharge between the metal wire and the super-sintered sintered body material, and is usually executed by a program.

In the polishing tool according to the present invention, the polishing unit is, for example, a circular or sintered annular sintered body layer having a concentric center circular hole, and is cut into a plurality of groove groups (hereinafter referred to as a division groove group) for distinguishing the polishing surfaces. Or, it is manufactured by die electrical discharge machining using an electrode having a correspondingly shaped electrode surface. It is convenient to form a line group on the surface of the super-grain layer or the electrode surface, in order to form a line.

The above-mentioned division groove group can be configured in various forms. For example, on a circular surface of the superfine grain layer, two sets of parallel straight line groups extending from one outer edge to a predetermined interval of the opposite side outer edges are formed perpendicularly to each other (Fig. 1); or, in three groups The above-mentioned straight line group is formed at 60° intersection (Fig. 2). In these cases, a square or triangular grinding unit is formed.

Further, the polishing unit may have a shape in which a straight ridge line is formed at the top (the polishing unit shown in Fig. 3 presents a ridge line from one end to the other end of the polishing portion, and the polishing unit shown in Figs. 4 and 5) The base is rectangular) and so on. When the polishing unit has a rectangular shape, the groove and the inclined surface of the adjacent polishing unit are formed by wire-cut electrical discharge machining. Therefore, substantially the ridge line is formed parallel to the long side. Further, although the pitches of the quadrangular pyramid-shaped polishing units may not be equal, the squares are preferable as the CMP conditioner.

In the above examples, in order to effectively exhibit the function of the polishing portion of each polishing unit, it is necessary to sufficiently make the top of each polishing unit sufficiently small, and to maintain a sufficient interval between adjacent polishing units. Regarding the top area of the polishing unit, an example of the polishing tool 1 of Fig. 1 is enlarged as an example, and is schematically shown in Fig. 6, for example, the ratio of the top area Y, and the area X of the base of the polishing unit 2 ( That is, the area of the cross section of the superfine grain layer minus the area of the groove 3 around the polishing unit is preferably 50% or less, more preferably 2% to 25%. Further, the apex angle of the top of the polishing unit is preferably 30° to 120°, more preferably 60° to 90°, and still more preferably 70° to 80°.

The depth of the groove (the height from the groove bottom of the polishing unit) is preferably 0.1 mm or more and 1 mm or less, and particularly preferably 0.15 mm or more and 0.3 mm or less. When the groove is too shallow, the chipping of the material to be cut cannot be efficiently discharged, and the polishing resistance tends to excessively increase. Conversely, if the groove is too deep, the strength of the grinding unit is insufficient and there must be an excessive thickness of the super-layer.

The polishing unit has a rectangular column shape formed in a straight line, a line segment shape, a triangle shape, a quadrangular angle or a more angle; each side surface is formed perpendicular to the substrate, so that the overall height of the horizontal section is uniform, but by at least one side, It is about the front side of the rotation direction of the tool, and when it is inclined backward with respect to the surface parallel to the axis, the cutting property can be improved.

As the polishing unit shape, each side surface of the polishing unit is inclined to form a truncated cone shape, and for example, a quadrangular frustum shape or a triangular frustum shape is preferable. Further, the tip is made into a sharp point, for example, a quadrangular pyramid shape or a triangular pyramid shape, and the cutting property is further improved.

In addition, for the grinding unit of the entire column, the pyramid shape, the pyramid shape, and the like, the surface of one of the rectangle, the triangle or the plural direction is polished with a special tool to sharpen the edge or the apex of the top, that is, the so-called "blade" ", can achieve better cutting performance. In particular, the grinding unit is a polygonal column and a polygonal frustum. When the top is polygonal (such as a typical triangle or a quadrangle), at least one side of the top surface is edged; and the polishing unit is a quadrangular pyramid or a triangular pyramid. When the blade is not edged, sufficient cutting performance can be achieved.

The polishing site of the present invention is configured such that the outer diameter thereof is 90 mm or more, and the thickness of the superfine granule layer is 0.1 mm or more and 1 mm or less. As the sintered super-ruthenium layer, a surface of one side of a diamond sintered body (PCD) or a c-BN sintered body (PcBN) is used, and a superhard alloy, that is, a tungsten carbide composite material, or a metal of a Group 6A of the periodic table is used. The composite block of the carbide as the main component is the structure of the base after reinforcement; and the composite material side is fixed to the tool substrate by an adhesive or the like, and the opposite side forms a division groove, and is used as a polishing portion.

Such a sintered body is commercially available as a disk-shaped sintered body which is typically pulverized by a uniaxial pressing type high-temperature ultra-high pressure equalizing machine. When the sintered body having a predetermined diameter cannot be obtained, in particular, when the flatness is not strictly required, each part of the polishing tool of the present invention can be separately produced and combined into a single polishing tool.

When the polishing portion is formed by a plurality of divided polishing portions, it is appropriate to arrange the polishing unit as a whole in the polishing portion as much as possible, and to form the groove in the boundary portion of the divided polishing portion. In this case, in the two or four divided divided polishing portions, if two sets of parallel groove groups intersecting each other perpendicularly are formed, and the polishing unit is formed into a quadrangular pyramid shape or a quadrangular pyramid shape, it is possible to obtain a disorder other than the outer edge portion. Arranged grinding units. On the other hand, in the case of the three or six divided divided polishing portions, three sets of equidistant parallel straight line groups that intersect each other at 120° are formed, and three pyramidal side faces are formed to form a triangular pyramid or a triangular frustum. The grinding unit column is the same.

In other words, in the case of a quadrangular pyramid, a metal wire for electric discharge machining is fed along the surface of the polishing portion, and a linear groove is formed on the surface of the polishing portion by discharge first. Next, the metal wire is driven in the Z-axis direction of the polishing portion, and the polishing portion is cut along the side profile of the quadrangular pyramid to form the side surface of the cone-shaped body adjacent to the groove. This operation is repeated to form a parallel groove group.

In the present invention, the top of the cone is composed of one or a plurality of diamond particles. However, even with the use of fine particles, since the size of the diamond is limited, the cone in the geometric sense cannot be obtained. Therefore, the diameter of the top is compared to the bottom edge, and if it is sufficiently small, it is called a cone. Similarly, the larger size of the top in each direction is called a frustum than the cone.

The production of the quadrangular pyramid-shaped polishing unit is as shown in FIGS. 7 and 8 , and a parallel groove group in which the first direction 11 is formed at a predetermined groove interval (pitch) on the surface of the polishing portion 10 (one of them) After being represented by the symbol 12, the same applies hereinafter, and the two sides of the cone (stationary body) (one of which is representative, the reference numerals 13 and 14, and the same applies hereinafter), the entire substrate of the polishing portion 10 is fixed. By rotating 90° around the central axis of the ring, and then forming the parallel groove group 16 of the second direction 15 at the predetermined interval and the inclined surface 17 and 18 of the cone adjacent to each groove, the vertical cross can be obtained. A group of parallel groove groups and a quadrangular pyramid (stage)-like polishing unit 19 arranged along the groove. The section of the portion of A-A of Fig. 7 is as shown in Fig. 8.

In the case of the triangular pyramid, as shown in Figs. 9 and 10, after the parallel groove group 22 of the first direction 21 and the inclined surface inclined faces 23 and 24 adjacent to the groove are formed, the polishing portion 25 is wound around the polishing portion. The circumference of the central shaft is rotated by 120°, and the parallel groove group 27 in the second direction 26 and the adjacent inclined side faces 28, 29 are formed by wire-cut electric discharge machining at predetermined intervals. Thereafter, the polishing portion is rotated by 120°, and the same operation is performed, whereby the parallel groove group 31 in the third direction 30 intersecting by 120°, the adjacent inclined side faces 32, 33, and the triangular pyramids arranged along the groove can be obtained. Shape grinding unit 34.

In the above polishing unit, the protrusion height from the top of the tapered body or the frustum body to the bottom surface of the groove is preferably 200 μm or less and 30 μm or more in both the triangular shape and the square shape. When the protrusion is too shallow, the body of the polishing portion is in direct contact with the workpiece such as the spacer, and there is a tendency that the trimming cannot be performed efficiently. Conversely, if the protrusion is too large, the strength of the polishing unit is insufficient, and it is necessary to have an excessive thickness of the super-layer. On the other hand, the interval (pitch) between adjacent grooves is 1500 μm or less, and the lower limit of the separation distance depends on the diameter of the wire for wire-cut electrical discharge machining, for example, 200 μm.

The polishing performance of the above-mentioned polishing unit depends on the particle size of the super-size particles contained in the top of the cone-shaped body. When the superfine granules of diamond particles are used, that is, the sintered system sintered diamond (PCD) layer constituting the polishing site, the particle size (nominal particle size) of the diamond particles can be 40 μm to 60 μm or less and 8 μm to 16 The PCD layer of each particle size such as μ m and 0 to 2 μ m is preferably 8 μm to 16 μm or less, more preferably 0 to 2 μm.

The diamond sintered body used in the polishing portion of the present invention is a composite metal of a diamond particle and a superhard alloy as a primer and, if necessary, cobalt, and is supplied to a thermodynamically stable ultrahigh pressure and high temperature condition of the diamond. And can be obtained. The processing of the polishing portion of the present invention from the sintered body is performed by precision electric discharge machining, typically by wire-cut discharge machining and by surface processing. In the wire-cut electric discharge machining, generally, the electric wire for electric discharge machining is brought into contact with the super-sintered sintered body to discharge, the metal wire is horizontally moved to have a predetermined groove width, and the metal wire is moved to form a side surface of the polishing unit.

Further, as shown in Fig. 11, after the electric discharge machining wire 41 contacts the super-barium sintered body 42, it does not move horizontally, but moves in the direction of the arrow in the figure, and the adjacent polishing units 43 and 44 The two inclined surfaces are formed to form a groove so as to be in contact with the metal wire 41. The plane may be used as a reference surface to form side faces on both sides. When the groove is formed by this method, the cross-sectional shape of the groove is a curved surface having a slightly circular arc, and the stress concentration during polishing is reduced and the strength (durability) of the polishing unit is improved as compared with the case where the bottom of the groove is flat or folded.

As exemplified in Figures 12 to 17, the tool of the present invention can be made in a variety of shapes. As shown in FIGS. 12 and 13, as for the smaller type of tool, the polishing site can be formed, for example, as a single continuous circle and a ring shape, but as shown in FIGS. 14 to 17, in the present invention, The polishing portion can be formed of a plurality of divided polishing portions without any problem. In particular, in this case, a large-diameter annular polishing portion having an outer shape of 95 mm or more can be easily formed.

In the annular configuration, the width in the radial direction is preferably 15 mm or more. In particular, when the center hole is not required in the design, the polishing portion may not have an annular shape and may be formed into a disk shape (without a center hole). Further, as shown in FIGS. 12 and 13, in order to prevent damage due to contact between the workpiece and the sharp edge, the outer edge portion of the circular polishing portion, and the outer and inner edges of the annular polishing portion It is preferable that the inclined portions 58, 68 and 69 each having a distance of 1 mm (radial width) or more are provided.

When the plurality of divided polishing portions constitute the polishing portion, as illustrated in FIGS. 14 to 17 , the polishing unit is set such that the boundary portion (joining portion) of the adjacent two-division polishing portion becomes a groove. According to the arrangement, it is possible to avoid the unevenness of the polishing unit arrangement due to the division of the polishing portion, and the adverse effect on the workpiece (grinding pad) due to the irregularity of the arrangement, or to minimize it. At this time, the number of divisions of the polishing portion is related to the shape of the available polishing unit, and the polishing portions of the two divisions (center angle of 180°) or four divisions (center angle of 90°) are quadrangular pyramids (Fig. 14 and Fig. 15) The three-divided (central angle 120°) polishing portion has a triangular pyramid shape (Fig. 16 and Fig. 17).

When a large-diameter grinding tool is produced, a small-diameter super-sintered sintered body (preferably a diamond sintered body) which can be uniformly sintered is cut into a predetermined size and shape to form a divided polished portion. Then, by using a bonding agent, a plurality of divided polishing portions are bonded to a flat disk surface or an annular surface of a rigid substrate made of a material such as various steels, thereby forming a large-diameter disk shape or an annular shape ( A polishing portion having a shape of a concentric circular hole in the center of the circular plate.

Regarding the split grinding portion, a fan shape of six, four, three or two center angles of 60°, 90°, 120°, and 180°, respectively, is provided adjacent to each other in the radius (side contact arrangement), but regarding 60 The fan shape of ° can also be replaced by two fan blades of the same shape of a 60° fan shape. At this time, the fan shape of 120° is arranged in point symmetry with respect to the center of the two 60° sectors.

Each of the polishing portions 51, 61, 71, 81, 91, and 101 is joined to the flat circular surface of the circular substrates 52, 62, 72, 82, 92, 102 on the cemented carbide side to make the whole circular or ring-shaped. Grinding parts.

The super-barium sintered body bonded to the substrate is subjected to wire-cut electric discharge machining, and is subjected to electric discharge machining between the wire for electric discharge machining and the super-sintered sintered body at a predetermined interval on the surface of the super-sintered sintered body. A group of straight groove groups 53, 63, 73, 83, 93, 103 are formed in parallel. At this time, the metal wire is driven in parallel with respect to the substrate surface or the bottom surface of the substrate, and enters the sintered body layer (such as a typical sintered diamond (PCD) layer) from the surface which has been previously planarized, and is etched into the sintered body layer; When the sintered body layer is thinner, it is further etched down to the superhard alloy layer.

At this time, the driving wire is cut into the thickness direction (Z-axis direction) of the super-sintered sintered body to form a groove. The formation of the first groove in a groove group, in a continuous circular or annular surface of 360°, can be started from any position in either the triangular pyramid or the quadrangular pyramid, but the polishing portion is plural In the case of dividing the polishing portion, it is necessary to provide grooves in the joint portions 54, 64, 74, 84, 94, and 104 of the divided polishing portion, and then to form the grooves in parallel at a predetermined pitch on both sides thereof.

After forming a parallel groove group in one direction on the surface of the super-sintered sintered body, the super-sintered sintered body and the substrate are rotated around the central axis of the substrate to rotate only the groove group crossing angle α, and similarly, at the predetermined interval The second linear parallel groove groups 55, 65, 75, 85, 95, 105 and the inclined side faces adjacent to the respective grooves are formed. Here, in the case of a fan shape of 180° and 90°, the angle of α is 90°, and the polishing unit has a quadrangular pyramid shape or a truncated cone shape. On the other hand, in the case of a fan shape of 120° and 60°, the angle of α is only rotated by 60° (or 120°), and similarly, the second linear parallel groove group and the inclination adjacent to each groove are formed at the predetermined intervals described above. Lateral, then rotated 60° (or 120°) (240° relative to the initial groove group) to form a third linear parallel groove group 56, 66, 76, 86, 96, 106 and adjacent to each groove Slanted side. Regarding the continuous circular and annular material, the angle of α may be any of 90° and 60°.

In the operation of the wire-cut discharge, the groove group and the triangle, the quadrangular pyramid shape, or the truncated cone shape can be formed by driving the discharge metal wire at a height (horizontal plane) which is equal to each other in the thickness direction from the bottom surface of the substrate. The top is formed on a horizontal plane parallel to the bottom surface of the substrate.

In the present invention, the triangular or quadrangular pyramid of the polishing unit does not need to be entirely composed of a super-sintered sintered body, and a portion (height) of about 60 μm including at least the apex of the cone-like body is a super-sintered sintered body. Even if the lower part is a superhard alloy. Next, a specific embodiment of the present invention will be described.

[Example 1]

The polishing tool 1 of the structure shown in Fig. 1 was produced. A sintered diamond layer having a thickness of 0.6 mm was sintered at the same time as the super hard alloy to form a PCD block having a diameter of 90 mm as a tool material.

In the PCD block, the surface of the sintered diamond layer is flattened by electrical discharge machining (EDM), and a parallel linear groove 3 having a width of 560 μm is formed by wire-cut electrical discharge machining to form a top side of 260 μm. Square grinding unit 2. At this time, the area of the top (not shown) of the polishing unit 2 corresponds to about 10% of the cross-sectional area of the super-sintered sintered layer except for the peripheral portion (the portion of the groove 3).

The top edge is edged for use as a CMP conditioner.

[Embodiment 2]

The polishing tool 4 of the structure shown in Fig. 2 is produced. A sintered c-BM layer having a thickness of 0.6 mm is sintered into a PcBN block by simultaneous sintering with a super hard alloy, and then cut by a wire cutting electric discharge machining from the PcBN block to have a radius of 60 mm of the outer edge and a radius of 24 mm of the inner edge. The fan shape of ° is used as a tool material.

The above-mentioned sectors were bonded to a SUS stainless steel substrate to form a complete circular shape. The surface of the sintered diamond layer is ground to be flattened, and then a wire-cut electric discharge machining process is performed to engrave a group of parallel linear grooves 6 having a width of 560 μm to form a polishing unit 5 having a top portion having a side length of 350 μ. The regular triangle of m. At this time, the area of the top of the polishing unit was 7% of the entire super-sintered layer.

In the same manner as in Example 1, the obtained tool was edged to polish the surface of the tantalum wafer.

[Example 3]

An abrasive tool of the structure shown in Fig. 12 is produced. A PCD layer having a thickness of 0.5 mm and a superhard alloy (WC-8% Co) formed by diamond particles having a nominal particle size of 40 μm to 60 μm is simultaneously sintered to form a diamond sintered body having a diameter of 100 mm as a polishing portion. It was fixed on a circular substrate made of SUS316 stainless steel having a diameter of 108 mm with an epoxy resin adhesive.

Next, the surface of the PCD layer was planarized by die electrical discharge machining, and the PCD layer was cut by wire-cut discharge machining to form a straight groove having a width of 200 μm passing through the center of the material. The metal wire is driven to the side or moved in a direction away from the substrate (Z-axis direction) to form a groove having a predetermined width and a side surface on which the tapered body is cut.

By repeating this operation, a parallel groove group having a groove interval of 800 μm and a roof-like protrusion having a vertex angle of 90° are formed on the entire material surface. Next, after rotating the entire circumference along the central axis by 90°, the wire-cut electrical discharge machining is performed under the same conditions to form a second straight groove group perpendicular to the groove group, and the vertical tapered body side is cut at the same time. , a quadrangular pyramid group shown in Fig. 7 and Fig. 8 having a height of 200 μm is formed.

[Example 4]

A diamond sintered body having an outer diameter of 100 mm and an inner diameter of 70 mm formed by a PCD layer having a thickness of 0.5 mm and a diamond particle having a nominal particle size of 0 to 2 μm is integrated as a polishing portion, and the operation of the third embodiment is repeated. A grinding tool having a quadrangular pyramid-shaped grinding unit is produced.

First, the surface of the planarized PCD layer was processed by wire-cut electrical discharge to form a straight groove passing through a material center width of 140 μm. Further, by the operation of the metal wire, the groove is expanded to a predetermined width and the side surface of the tapered body is cut. As a result of this operation, a parallel groove group having a groove interval of 200 μm and a roof-like protrusion having a vertex angle of 60° were formed on the entire material surface.

Then, after rotating the whole circumference along the central axis by 90°, the second straight groove group is formed by performing wire-cut electrical discharge machining under the same conditions, and the side surface of the second tapered body is cut to form a height of 200 μ. A quadrangular pyramid of m.

[Example 5]

Various types of tools are produced by using various divided polishing portions shown below. Diamonds in diamond sintered bodies have a nominal particle size of 20 μm to 30 μm. The wire cutting operation is carried out in addition to the fact that the grinding unit is rotated by 60° twice when the grinding unit is triangular, and the difference is substantially the same when the grinding unit is a quadrangular pyramid. The operating conditions and results are shown in the table below.

Good performance is obtained by using any of the obtained tools as a CMP pad conditioner.

[Industry use possibility]

The abrasive tool of the present invention can be used as a variety of abrasive tools, and is particularly suitable for use as a disk-shaped rotary abrasive tool. It is particularly suitable for use as a CMP pad conditioner, and is also suitable for direct polishing of the surface of a semiconductor wafer or the like. In addition, it is also suitable for high-precision grinding of various cut materials.

The present invention is not limited to the above-described embodiments, and the above-described embodiments are merely illustrative, and those having the same constitutional principles as those described in the scope of the present invention can achieve the same effects and are included in the present invention. In the technical idea of the invention.

1. . . Grinding tool

2. . . Grinding unit

3. . . ditch

4. . . Grinding tool

5. . . Grinding unit

6. . . ditch

7. . . Grinding tool

8. . . Grinding unit

9. . . ditch

10. . . Grinding site

11. . . First direction

12. . . First direction parallel groove group

13. . . Cone side

14. . . Cone side

15. . . Second direction

16. . . Second direction parallel groove group

17. . . Cone slope

18. . . Cone slope

19. . . Quadrangular pyramid grinding unit

twenty one. . . First direction

twenty two. . . First direction parallel groove group

twenty three. . . Triangular cone

twenty four. . . Triangular cone

25. . . Grinding site

26. . . Second direction

27. . . Second direction parallel groove group

28. . . Inclined side

29. . . Inclined side

30. . . Third direction

31. . . Third direction parallel groove group

32. . . Inclined side

33. . . Inclined side

34. . . Triangular pyramid grinding unit

41. . . Electric wire for electric discharge machining

42. . . Grinding site

43. . . Grinding unit

44. . . Grinding unit

51. . . Grinding department

52. . . Circular substrate

53. . . Straight groove group

55. . . Second groove group

58. . . Rim of the outer edge

61. . . Grinding site

62. . . Circular substrate

63. . . Straight groove group

65. . . Second groove group

66. . . Third groove group

68. . . Rim of the outer edge

69. . . Inner edge slope

71. . . Grinding site

72. . . Circular substrate

73. . . Straight groove group

74. . . Joint

75. . . Second groove group

81. . . Grinding site

82. . . Circular substrate

83. . . Straight groove group

84. . . Joint

85. . . Second groove group

91. . . Grinding site

92. . . Circular substrate

93. . . Straight groove group

94. . . Joint

95. . . Second groove group

96. . . Third groove group

101. . . Grinding site

102. . . Circular substrate

103. . . Straight groove group

104. . . Joint

105. . . Second groove group

106. . . Third groove group

1 is an explanatory view (top view) showing an embodiment of an abrasive tool according to the present invention (Example 1); and FIG. 2 is an explanatory view showing an embodiment (Example 2) of an abrasive tool of the present invention. (top view); Fig. 3 is an explanatory view (top view) showing an embodiment of the grinding tool of the present invention; and Fig. 4 is an explanatory view (top view) showing an embodiment of the grinding tool of the present invention; Fig. 6 is a partial enlarged view of Fig. 4; Fig. 7 is a partially enlarged view of Fig. 1; Fig. 7 is an explanatory view (top view) showing one example of a polishing unit of the polishing tool of the present invention; FIG. 9 is an explanatory view showing a cross section between A and A of FIG. 7, and FIG. 9 is an explanatory view (top view) showing another configuration example of the polishing unit of the polishing tool of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 11 is a view showing an aspect of wire-cut electrical discharge machining used in the method for manufacturing an abrasive tool of the present invention; and FIG. 12 is a view showing a grinding tool of the present invention. An explanatory view of an embodiment (top view); Fig. 13 shows a grinder of the present invention 1 is an explanatory view (top view) of an embodiment of the present invention; FIG. 14 is an explanatory view (top view) showing an embodiment of the abrasive tool of the present invention; and FIG. 15 is a view showing an embodiment of the abrasive tool of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 16 is an explanatory view (top view) showing an embodiment of an abrasive tool according to the present invention; and FIG. 17 is an explanatory view (top view) showing an embodiment of an abrasive tool of the present invention. .

1. . . Grinding tool

2. . . Grinding unit

3. . . ditch

Claims (17)

An abrasive tool is an abrasive tool having a polishing portion composed of a super-sintered sintered body, wherein the polishing portion includes a plurality of polishing units having a top portion, each of the top portions being approximately in the same plane, and the polishing portion is super The granules and the bonding metal are combined with the super-sintered sintered body of the super-hard alloy base material; the polishing unit is formed by linear cutting electric discharge machining on the grinding portion to form a straight groove group The shape of the top of the polishing unit is a linear ridge line. The abrasive tool of claim 1, wherein the top is edged. The abrasive tool of claim 1, wherein the super granule is a diamond. The abrasive tool according to claim 3, wherein the diamond has a nominal particle size of 40 μm to 60 μm or less. The abrasive tool according to claim 1, wherein the super-sintered sintered body has a thickness of 0.1 mm or more. The abrasive tool of claim 1, wherein the abrasive tool is disc-shaped or annular. The abrasive tool of claim 6, wherein the abrasive portion is disc-shaped or annular. The abrasive tool according to claim 7, wherein the abrasive portion has an outer diameter of 90 mm or more. The abrasive tool according to claim 1, wherein the height of the groove from the bottom to the top of the polishing portion is 1 mm or less. The polishing tool according to claim 6, wherein the polishing portion is composed of two or four divided polishing portions, and the divided polishing portions are fan-shaped with the same central angle. The grinding tool according to claim 10, wherein the divided grinding portion has two groove groups; the first groove group is disposed in a radial direction parallel to the divided grinding portion; the second groove group, Then formed perpendicular to the first group of trenches. The abrasive tool according to claim 6, wherein the polishing portion is composed of three or six divided polishing portions, and the divided polishing portions are fan-shaped with the same central angle. An abrasive tool according to claim 12, wherein the The divided polishing portion has three groove groups; the first groove group is disposed in a radial direction parallel to the edge of the divided polishing portion; and the second groove group and the third groove group are respectively formed with respect to the first groove group , crossed at an angle of 60° and 120°. The abrasive tool of claim 1, which is a CMP pad conditioner. A method for producing an abrasive tool having a polishing portion composed of a super-sintered sintered body, comprising: (1) sintering a super-antimony particle and a bonding metal together with super-fine particles on a primer material of a super-hard alloy a step of obtaining a super-sintered sintered body; (2) a step of flattening a polished portion of the obtained super-sized sintered body; and (3) providing a linear groove group to planarize by wire-cut electrical discharge machining The super-grain abrasive body is formed by forming a plurality of polishing units to form a polishing portion. A method for producing an abrasive tool having a polishing portion composed of a super-sintered sintered body, comprising: (1) sintering a super-antimony particle and a bonding metal together with super-fine particles on a primer material of a super-hard alloy a step of obtaining a super-sintered sintered body; (2) a step of cutting a sector-shaped divided polishing portion from the obtained super-sized sintered body; (3) obtaining the obtained in the aforementioned step (2) Sector-shaped segmentation grinding section a step of dividing a plurality of sector-shaped divided polishing portions having the same central angle; (4) making the plurality of obtained segment-shaped divided polishing portions closely adjacent to each other and fixed on the surface of the flat substrate to be a disk-shaped or annular-shaped polishing And (5) forming a plurality of boundaries between the divided polishing portions of the disk-shaped or annular polishing portions obtained in the above step (4) by wire-cut electrical discharge machining to form a plurality of The step of grinding the unit. A method for regenerating a polishing tool, which is an abrasive tool having a polishing portion composed of a super-sintered sintered body, wherein the polishing portion includes a plurality of polishing units having a top portion, each of which is located approximately at the same time In the same plane, wherein the regeneration method comprises the step of regenerating the top of the trench and the polishing unit by wire-cut electrical discharge machining.