CN112677062B - Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof - Google Patents
Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a special abrasive grain landform for polishing a steel grinding disc, a diamond grinding disc and a preparation method thereof. The abrasive particles are diamond abrasive particles which are distributed in a continuous linear or strip-shaped arrangement mode, and more than 2 closed heat dissipation areas are formed by surrounding adjacent linear or strip-shaped diamond abrasive particles; the heat dissipation area is axially symmetrical in shape; the heat dissipation area is uniformly distributed around the axis of the grinding disc made of polished steel. The special abrasive grain landform of the steel grinding disc for grinding can optimize the arrangement of diamond abrasive grains on the surface of the grinding disc, and when the steel is processed, the high heat dissipation effect is achieved, the abrasive grain adhesion abrasion and graphitization degree are reduced, the processing efficiency is improved, the diamond grinding disc is more economical when being applied to the processing of the steel, and the high economic value is achieved.
Description
Technical Field
The invention belongs to the field of preparation of superhard abrasive tools, and particularly relates to a surface topography scheme and a preparation method of a diamond grinding disc for grinding steel materials. The prepared millstone can be applied to the grinding and polishing procedures of metals including cast iron, cast steel, general strength steel, alloy steel and other steel products.
Background
At present, the conventional method for polishing and cleaning welding seams and welding scars is that a polisher carries out manual polishing by using a manual grinding machine provided with a resin grinding wheel. The resin grinding wheel is made of resin as adhesive material, metal powder, metal oxide and common abrasive as filler. Mixing the abrasive and the bonding agent according to the concentration requirement to prepare a molding material, preparing a product blank by hot pressing and curing, and then processing the product.
The resin grinding wheel for grinding the steel material is manufactured by solidifying the superhard grinding materials such as silicon carbide and the like into a disc shape by utilizing the principle of resin solidification. The grinding wheel is widely applied to the grinding industry, but long-term application and research show that the resin grinding wheel has larger defects in the using process, and the defects are exactly inseparable with the preparation principle and characteristics of the resin grinding wheel. The disadvantages are as follows:
1. the resin grinding wheel has poor water resistance and alkali resistance and short storage life.
2. The bonding strength is low, and the abrasive material is consumed quickly.
3. The polishing process has the disadvantages of large sparks, large smell and large dust, and has great harm to the environment.
4. The grinding efficiency is low.
Based on the above problems and environmental requirements, a novel grinding and polishing tool with high grinding and polishing efficiency, no dust, little pollution and convenient operation of operating personnel is needed. The grinding disc abrasive needs to be selected according to the efficiency and the service life of steel processing and the economical efficiency of the abrasive.
At present, the industrial production of artificial diamond and CBN (cubic boron nitride) is mature, the cost is continuously reduced, and the superhard tools of diamond and CBN are rapidly developed in recent decades. In order to achieve the aim of efficiently polishing steel materials, the available abrasives, in addition to silicon carbide and corundum, become ideal choices of super-hard abrasives represented by artificial diamond and CBN.
Cubic Boron Nitride (CBN) tools are suitable for hard-to-machine materials such as work-hardened steel, high-hardness alloy steel, gray cast iron, nickel-based superalloy, and the like, and have the biggest disadvantages of low strength and poor toughness, and are mostly used for fine machining with good equipment rigidity.
The steel material grinding and polishing equipment is low in rigidity, abrasive particles required by the grinding and polishing process are large in granularity (30-60 meshes), and large-granularity CBN abrasive particles are long in edge angle, are easy to break compared with diamond abrasive particles, and obviously increase the cost. Therefore, it is not preferable to use CBN as the abrasive grain for main machining in grinding work of iron and steel materials.
At present, there are three main bonding modes of electroplating, sintering and brazing.
The sintered metal bond diamond tool is mainly used in the grinding and cutting process of hard and brittle materials due to low bonding strength of abrasive particles and small exposure height.
Electroplated diamond tools are made by electroplating a layer of metal (typically nickel or nickel-cobalt alloy) onto a substrate and consolidating diamond grit within the deposited metal. Since diamond is mechanically embedded, the coating has low holding strength to diamond, and in order to firmly hold the diamond, the diamond needs to be embedded to 50% or more of its own height. Due to the disadvantages of the electroplated diamond tool, the diamond abrasive particles are easy to fall off when a load is ground. Therefore, the grinding disc is prepared by firmly welding the diamond on a steel substrate in a brazing mode.
The brazing diamond technology is a technology for brazing connection by using a welding flux which can generate chemical reaction with diamond abrasive particles and generate metallurgical bonding with a steel matrix. Because the solder contains active elements which can react with the diamond, the diamond and the solder interface are combined chemically and metallurgically, so the bonding strength is high, and the diamond is not easy to fall off from the substrate. Compared with the electroplating tool, the abrasive grain exposure is higher than that of the electroplating tool with 1. 2. The space for containing the scraps is large. 3. Good heat dissipation and the like.
However, when the diamond tool is applied to grinding of steel materials, the diamond surface is graphitized due to the high temperature when the diamond contacts with iron materials, so that the diamond tool is adhered to the steel materials, and the processing efficiency and the service life of the diamond tool are greatly reduced. This is also the main reason why diamond tools are rarely used in ferrous materials.
In addition, the brazed diamond grinding disc needs to dry polish steel materials under the condition of no cooling liquid under the limitation of grinding and polishing conditions and processing environment. Because the cooling and lubricating actions of the cooling liquid are not available, the abrasive particles of the grinding disc are more easily abraded, and the surface of a workpiece is more easily burnt.
Research shows that diamond graphitization and broken mechanochemical abrasion phenomena exist when a diamond tool processes a steel material, instantaneous high temperature of more than 1000 ℃ is generated at the end point of a grinding edge when diamond abrasive particles are contacted with a ferrous metal material, iron elements in ferrous metal convert local micro-areas at the top end of diamond to graphite at high temperature, but heat instantaneously accumulated in the contact area of the grinding edge of the abrasive particles can be conducted out by diamond with excellent heat conductivity, the temperature of the diamond abrasive particles can be maintained at a lower level under the condition that the exposure of the abrasive particles is high, and the abrasive particles are not easy to graphitize and convert except the interface part where the top end is contacted with the ferrous metal material. When the temperature of the abrasive particles can be conducted rapidly, the thermal abrasion of the iron element to the diamond and the reaction degree of the iron element and the diamond can be greatly reduced. Under the condition of controlling a certain temperature, the abrasion of the diamond when processing ferrous metal is controllable. Therefore, on the basis of combining the advantages of high exposure and high heat dissipation space of the brazed diamond abrasive particles, the mechanical and chemical abrasion of the diamond abrasive particles is controllable under the condition of effectively controlling the grinding force and the temperature of a grinding area. The brazing diamond grinding disc is applicable to grinding steel materials under the conditions that abrasive grains are held by high strength and exposed.
The abrasive grain topography specially designed for steel materials is not described in detail in documents at present, most of existing diamond tools are related to stone processing, the topography of the surface of abrasive grains is also directed at the field, the problem that the abrasive grain topography of a grinding wheel is optimized during external grinding is researched and analyzed for nickel-based high-temperature alloy, titanium alloy and the like, the existing diamond surface topography is mostly designed into structures such as points, clusters and the like during steel grinding processing of the grinding wheel, the distribution of diamonds is discrete and discontinuous, and a heat dissipation space is continuous and non-discrete, and when steel with toughness and strength is actually processed, the problems of cutting discrete stress, grinding vibration, point region adhesion and the like easily occur. Patent CN 201210246917.0-method for optimizing topography of diamond-impregnated wheel for brazing of high-speed rail track slab proposes that grinding is performed by utilizing banded abrasive distribution with a certain angle, the banded structure is mainly designed for solving the problem of grinding stone materials by diamond grinding tools, a chip removal groove and a grinding direction keep a certain inclination angle, the problem of topography for chip removal during grinding stone materials in a single direction is mainly solved, and when a diamond millstone is used for grinding steel materials, a workpiece is diversified in structure and changeable in grinding direction, heat dissipation on the surface of the millstone can be uniformly dissipated in all directions of movement, namely uniform heat dissipation topography is possessed.
Disclosure of Invention
In order to solve the problems, the invention analyzes the characteristics of steel material processing and the heat dissipation requirements during diamond abrasive particle processing, and the requirements of comprehensive grinding efficiency and heat exchange, designs a novel grinding disc geomorphology for grinding steel by a grinding disc, and provides a diamond grinding disc process for preparing the geomorphology.
The invention provides a special abrasive grain landform of a steel grinding disc for grinding a diamond grinding disc, wherein diamond abrasive grains are distributed in a continuous linear or strip-shaped arrangement manner, and more than 2 closed heat dissipation areas are surrounded by adjacent linear or strip-shaped diamond abrasive grains; the heat dissipation area is axially symmetrical in shape; the heat dissipation area is uniformly distributed around the axis of the grinding disc made of polished steel. The abrasive grain landform can optimize the arrangement of diamond abrasive grains on the surface of the grinding disc, achieves a high heat dissipation effect when steel is processed, reduces the adhesive wear and graphitization degree of the abrasive grains, is beneficial to improving the processing efficiency, enables the diamond grinding disc to be more economical when being applied to processing steel, and has higher economic value.
Regular heat dissipation areas refer to heat dissipation areas formed by diamond abrasive grains surrounded by regular shapes, and the regular shapes refer to the areas formed in a generally axisymmetric pattern, that is, the center of the heat dissipation area is an axis, and the shapes of the whole areas are axisymmetric, such as a circle, a triangle, a square, a hexagon and the like, including but not limited to the patterns. On one hand, the pattern is beneficial to ensuring the chip removal of the grinding chips during processing under the condition of symmetrical tool surfaces, and on the other hand, the pattern is also beneficial to uniform heat dissipation.
Because the processing of the diamond to the steel is easy to generate adhesion under the condition of instantaneous high temperature, the key for solving the problem is to adopt a reasonable scheme to quickly dissipate the heat on the surface of the diamond grinding disc.
The heat on the surface of the diamond grinding disc comes from the grinding dust on one hand and the friction conduction between the diamond and the workpiece on the other hand, and the heat dissipation of the surface of the diamond grinding disc is extremely high. The traditional diamond tool solves the problem that the heat dissipation mode is that the spacing of abrasive particles is determined through calculation or tests, and the diamond abrasive particles are arranged in an even or sequential mode so as to achieve the purpose of uniformly discharging heat. However, in these methods, a certain heat dissipation difficult area may still exist for diamond grinding steel, most of the traditional diamond abrasive grain sequence arrangement features are distributed in a particle or cluster shape, and gaps are formed between adjacent diamonds to dissipate heat. Therefore, the diamond grinding disc is more suitable for grinding the surface of steel materials by continuously distributing the diamonds in a belt shape or a line shape on the surface of the grinding disc and forming a plurality of uniform and closed regular heat dissipation areas on the surface of the grinding disc, and the toughness of the steel materials and the instant high temperature generated in the grinding process of the steel materials do not influence the service performance of the diamond grinding disc while the high-hardness and high-cutting performance of the diamond grinding disc are kept.
In conclusion, the invention adopts the novel landform that the abrasive particles are continuously and orderly arranged, creatively provides that the novel heat dissipation area is uniformly distributed on the surface of the grinding disc to discharge heat, no abrasive particles exist in the heat dissipation area, and a part of the abrasive dust cut by the abrasive particles directly flies out of the grinding area and can be discharged through the area, so that excessive heat collection is avoided, and the heat damage of the workpiece to the diamond is reduced.
According to the special abrasive grain landform of the steel grinding disc for grinding of the diamond grinding disc, diamond abrasive grains on the surface are uniformly distributed in a linear or strip shape, and a plurality of uniform closed regular heat dissipation areas are formed by surrounding adjacent linear or strip-shaped diamond abrasive grains.
The diamond abrasive particles on the surface of the diamond grinding disc can be distributed in a linear mode or in a belt mode, and no more than three abrasive particles are distributed in the width direction of the linear distribution or belt distribution area.
The particle size distribution of the diamond abrasive particles is 20-120 meshes, and the diamond particle size on the surface of the grinding disc is a single particle size interval.
The shape of the heat dissipation area can be any simple geometric shape, and the simple geometric shape is an axisymmetric figure. Including but not limited to circles, triangles, quadrilaterals, hexagons, diamonds, etc.
The range of the maximum length L1 in the geometrical shape of the heat dissipation area is as follows: d < L1<12D, D is the average grain size of the diamond abrasive grains.
The surface of the heat dissipation area is covered by an alloy solder layer which can generate chemical metallurgical reaction with diamond. The alloy solder layer is selected from Ni-Cr-B-Si alloy solder or Cu-Sn-Ti solder.
The diamond landforms distributed in a linear or strip shape can be uniform, and also can be non-uniformly distributed according to the state of a processing area of the grinding disc, but the overall topography is symmetrical around the central axis of the grinding disc.
The outer diameter range of the grinding disc specification is 70 mm-230 mm.
The invention relates to a preparation method of special abrasive grain landform of a steel grinding disc of a diamond grinding disc, which comprises the following steps:
(1) And (4) coating the adhesive on the surface of the grinding disc matrix.
(2) Adhering the net-shaped separator designed according to the requirement with a specific shape.
(3) And arranging the alloy solder.
(4) The net separator is removed.
(5) Diamond abrasive grains are distributed.
(6) And spreading solder.
(7) And (4) brazing preparation.
After welding, the diamond on the surface of the grinding disc is firmly welded, abrasive particles are uniformly distributed in a linear or strip shape and surround a uniformly distributed heat dissipation area.
The adhesive is adhesive sticker, such as acrylate adhesive sticker, diluted to a certain concentration by organic solvents such as acetone, ethyl acetate and the like, and then brushed.
The reticular clapboard is made of soft material with certain strength and can be tightly attached to geometrical shapes such as a plane, a cambered surface, a bent angle curved surface and the like.
The meshes of the mesh-shaped partition plate correspond to the heat dissipation areas with axisymmetric simple geometric shapes;
the alloy solder covers the heat dissipation area, diamond abrasive particles are sprinkled on the surface of the grinding disc which is exposed in a linear or strip shape and is not covered with the alloy solder,
the solder is distributed on the surface of the whole diamond grinding disc, one part of the solder is filled in the gaps of the diamond abrasive particles, and the other part of the solder is filled in the gaps of the previous alloy solder.
The alloy solder is heated through a vacuum brazing process or a high-frequency induction brazing process to be melted, and is subjected to chemical metallurgical reaction with diamond and metallurgical diffusion with a steel matrix, so that the alloy solder and the diamond are firmly connected together.
The novel diamond grinding disc with special abrasive grain landform for grinding the steel grinding disc can be prepared by the steps, and the main technical characteristics are as follows:
the invention also provides a diamond grinding disc with the special abrasive grain topography for grinding the steel grinding disc, wherein the diamond abrasive grains on the surface of the diamond grinding disc are uniformly distributed in a linear or strip shape, and the uniform, closed and regular heat dissipation area formed by the abrasive grains surrounded on the surface of the linear or strip-shaped grinding disc is uniformly distributed.
The preparation process of the diamond grinding disc with the special abrasive grain landform for grinding the steel grinding disc comprises the following steps:
(1) And (4) coating the adhesive on the surface of the grinding disc matrix.
(2) A specially shaped mesh separator designed according to the requirements is adhered.
(3) And arranging the alloy solder.
(4) The net separator is removed.
(5) Diamond abrasive grains are distributed.
(6) And spreading solder.
(7) And (4) brazing preparation.
After welding, the diamond on the surface of the grinding disc is firmly welded, abrasive particles are uniformly distributed in a linear or strip shape and surround a heat dissipation area which is uniformly distributed.
When the novel process is used for preparing the diamond tool, the key is how to obtain the diamond in net-belt-shaped distribution, and the surface of a non-diamond distribution area is covered by a solder alloy layer.
The conventional diamond soldering tool preparation mostly relates to the adhesion of a binder to diamond, or the arrangement of diamond particles through a certain template, but the mode is limited by the structure of the template, only the distribution of points or clusters can be obtained, the continuous arrangement of diamond abrasive particles is difficult, and after the diamond particles are arranged according to the mode, the blank area at the periphery of the diamond is continuous, so that the friction force between the abrasive particles and a workpiece is easily increased when the diamond particles are contacted with a tough steel material.
The invention creatively provides a method for arranging the net-shaped partition plates firstly. The surface of the net-shaped partition board is provided with a designed sequence of holes. Due to the adhesive, the separator is adhered to the surface of the tool base body, but the hollow portion is exposed. Then, alloy solder is sprayed, and the alloy solder can only be sprayed into the holes due to the action of the partition plate, so that the alloy solder particles cover the surfaces of the holes. After the net-shaped partition plate is removed, the part shielded by the partition plate is exposed, diamond abrasive particles are distributed at the moment, and only the part shielded by the partition plate originally is bonded with the diamonds, so that the surface landform of the diamonds distributed according to the appearance of the partition plate can be obtained.
In order to further ensure the welding strength of the diamond, alloy solder is further arranged to obtain a complete part to be welded, and then the diamond grinding disc for grinding steel can be prepared by vacuum brazing.
The novel diamond grinding disc with special abrasive grain topography for grinding the steel grinding disc can be prepared by the steps, and the main technical characteristics are as follows:
the abrasive particles on the surface of the diamond grinding disc can be distributed in a linear mode or in a belt mode, and the number of the abrasive particles in the linear distribution or the belt distribution area is not more than three. Due to the high requirement of heat dissipation when steel materials are ground, the continuous strip-shaped or linear distribution of the diamonds is as narrow as possible, and the width of the diamonds is not more than the average particle size of three diamond abrasive grains, so that chips generated by cutting the abrasive grains on the surface of a workpiece can be effectively discharged, and the chips are prevented from being adhered and accumulated on the surface of a tool. According to the distribution of the geometric shapes, the adopted geometric shapes must be in an axisymmetric pattern in order to ensure that the width of the abrasive belt between two adjacent heat dissipation areas with specific geometric shapes is consistent. Therefore, the equal distance of the adjacent areas can be ensured, and the condition that the heat dissipation is influenced by the overlarge width of the abrasive particles in partial areas is avoided.
The particle size distribution of the diamond abrasive particles is 20-120 meshes, and the diamond particle size on the surface of the grinding disc is a single particle size interval. Diamond grinding steel belongs to rough machining and semi-finishing field, and is not high to the requirement of surface quality, but is higher to grinding efficiency and stability, generally selects 20 meshes-120 meshes of regional scope, and when preparing diamond instrument, the diamond grit of selection is narrow interval as far as possible, can effectively prevent local region grit like this and too high leads to excessive wear.
Preferably, the granularity and the contour of the diamond abrasive grains arranged on the surface of the grinding disc are controlled within the range of 15 percent, namely, the highest size of the diamond on the surface of the same grinding disc is larger than the lowest size by the amplitude of not more than 15 percent.
The shape of the heat dissipation area can be any simple axisymmetric geometric shape, including but not limited to a circle, a triangle, a quadrangle, a hexagon, a rhombus, and the like. The process of the invention can realize the relief distribution of net-shaped diamond with any shape, including simple round, regular triangle, quadrangle, hexagon, etc., and can also have other complex shapes. In particular, the invention also includes arranging different abrasive grain topographies on the same grinding disc surface according to different processing regions, and in general, the process can realize different abrasive grain topographies according to design requirements.
The range of the maximum length L1 in the geometrical shape of the heat dissipation area is as follows: d < L1<12D (D is the average particle size of the diamond grit). The heat dissipation area is holes in the net-shaped landform, and alloy solder layers are distributed in the area, so that heat dissipation of the grinding area can be performed on one hand, and abrasion of cutting to a tool base body can be effectively prevented on the other hand. The size of the hole area is limited, so that not only is effective heat dissipation required, but also the heat dissipation area cannot be too large, so that the workpiece is prevented from contacting the heat dissipation area excessively to cause adhesion abrasion, and in addition, the grinding efficiency is affected due to the fact that the number of diamond particles is reduced due to the fact that the heat dissipation area is too large. The maximum length dimension of the geometry of the heat sink region is therefore generally no less than the average particle size of one diamond particle but no greater than the average particle size of 12 diamond abrasive particles.
The surface of the heat dissipation area is covered by an alloy solder layer which can generate chemical metallurgical reaction with diamond. The alloy solder layer must effectively cover on the heat dissipation area surface, except the effect of above-mentioned covering, the alloy solder layer can flow when melting, effectively imbeds diamond grit root, forms effectively to climb, combines the solder of subsequent compound cloth, can realize the optimization brazing to the diamond.
It should be noted that the procedure of re-distributing the solder is not necessary, and this procedure needs to be determined by combining the size and topography of the abrasive particles, when the abrasive particles are small, the fluidity of the alloy solder layer in the heat dissipation area can effectively solder the diamond, but when the abrasive particles are large, the existing alloy solder layer cannot solder the diamond ideally, and at this time, the solder needs to be re-distributed, and the small-particle solder is distributed around the diamond to fill the surface gaps.
The diamond landforms distributed in a linear or strip shape can be uniform and symmetrical, and can also be non-uniformly distributed according to the state of a processing area of the grinding disc. According to the process, the appearance of the net-shaped template is the appearance of the arrangement of the diamond abrasive particles, and then the appearance can be determined through the joint design according to the processing requirements of the grinding disc, the structure of the grinding disc and the quality of the processed surface, so that the determined structure can be a single structure appearance or a composite appearance of a plurality of appearances, but all the appearances can be realized through net-shaped partition plates. The efficient implementation of this design also accounts for the effectiveness and stability of the process.
The outer diameter range of the grinding disc specification is 70 mm-230 mm.
The reticular clapboard is made of soft material with certain strength and can be tightly attached to geometrical shapes such as a plane, a cambered surface, a bent angle curved surface and the like. In order to better realize the pasting and processing of the reticular clapboard, the clapboard can be made of soft materials with certain strength, and particularly, the materials such as a mask plate, a silicon film and the like can be selected.
According to the diamond grinding disc prepared by the invention, diamond abrasive particles on the surface are distributed in a continuous porous net shape, the diamond abrasive particles are uniformly distributed in a mesh area, the grinding heat is easy to dissipate under the condition of grinding steel, the abrasive particles are less damaged, the service life is long, and the grinding efficiency is high. The preparation process is simple and stable, batch stable preparation can be realized by assisting relevant process equipment, the problems of polishing and material removal of the surface of steel can be effectively solved, the spark is small during processing, the dust is less, the operation environment is improved, and the economic benefit and the social efficiency are higher.
Drawings
FIG. 1: schematic process diagram, wherein: 1-tool substrate surface, 2-adhesive coating, 3-mesh partition plate placing, 4-solder particle spreading, 5-diamond spreading and 6-small-particle-size solder re-spreading.
FIG. 2: and (5) the landform of the square heat dissipation area.
FIG. 3: landform of circular heat dissipation area
FIG. 4: the landform of the triangular heat dissipation area.
FIG. 5 is a schematic view of: hexagonal heat dissipation area landform
Detailed Description
Specific embodiment example 1:
a brazing diamond grinding disc for grinding and polishing the surface of the marine steel is developed. The specification of the grinding disc is 125mm, and the inner hole is 22.23mm
Because the marine steel has high strength and high toughness, the diamond tool is easy to have surface adhesion during processing, and on the other hand, because the surface is polished, the diamond tool needs to reach certain surface quality and cannot be too rough, the diamond with 45-mesh granularity and yellow river cyclone HSD80 grade are designed.
Because the surface of the grinding and polishing process is stable, a simple round hole structure is adopted as a heat dissipation hole, the diameter of the round hole is 3.5mm, and the width of the abrasive grain is 1.2mm.
The preparation steps are as follows:
(1) And adopting a silicon adhesive film with the thickness of 0.2mm to prepare the reticular partition plate by laser cutting.
(2) And coating the adhesive on the area to be distributed on the surface of the grinding disc.
(3) And (3) pasting the reticular clapboard so that the clapboard is tightly adhered to the surface of the matrix.
(4) And spraying 40-60 mesh BNi2 nickel-based alloy solder particles to fill the holes of the reticular clapboard with the alloy solder particles.
(5) Removing the net-shaped partition plate, and spreading 45-mesh artificial diamond particles
(6) And spraying-80-mesh BNi2 nickel-based alloy solder particles to fill gaps among the diamonds and between the diamonds and the 40-60-mesh nickel-based alloy solder.
(7) After cleaning, vacuum brazing preparation is carried out, the maximum temperature is 1025 ℃, and heat preservation is carried out for 22 minutes.
Specific embodiment example 2:
a brazed diamond grinding disc for grinding cast steel surfaces is developed. The specification of the grinding disc is 180mm, and the inner hole is 22.23mm
Because cast steel has high hardness and large surface grinding removal amount, a diamond tool has small requirement on vibration during processing and high efficiency, and on the other hand, because the surface cannot have an obvious burn area after surface grinding and polishing, the diamond with 35 meshes is designed and adopted, and the quality of the middle and south ZND2290 grade.
Because the grinding and polishing profile is complicated, a hexagonal structure is adopted as a heat dissipation hole, the length of the longest edge of the hexagon is 3mm, and the abrasive particle bandwidth is 1.5mm.
The preparation steps are as follows:
(1) And adopting a silicon adhesive film with the thickness of 0.2mm to prepare the reticular partition plate by laser cutting.
(2) And coating the adhesive on the area to be distributed on the surface of the grinding disc.
(3) And (3) pasting the reticular clapboard so that the clapboard is tightly adhered to the surface of the matrix.
(4) And spraying 40-60 meshes of BNi2 nickel-based alloy solder particles, and then spraying 60-80 meshes of BNi2 nickel-based alloy solder particles to ensure that the holes of the reticular clapboard are fully filled with the alloy solder particles.
(5) Removing the net-shaped partition plate, and spreading 35-mesh artificial diamond particles
(6) And spraying-80-mesh BNi2 nickel-based alloy solder particles to fill gaps among the diamonds and between the diamonds and the 40-60-mesh and 60-80-mesh nickel-based alloy solder.
(7) After cleaning, vacuum brazing preparation is carried out, the maximum temperature is 1025 ℃, and heat preservation is carried out for 22 minutes.
Claims (8)
1. A diamond grinding disc for grinding steel with special abrasive grain topography is characterized in that the diamond abrasive grains are distributed in a continuous linear or strip-shaped arrangement mode, and more than 2 closed heat dissipation areas are formed by surrounding adjacent linear or strip-shaped diamond abrasive grains; the heat dissipation area is axially symmetrical in shape; the heat dissipation areas are uniformly distributed around the axis of the grinding disc for grinding the steel materials;
the surface of the heat dissipation area is covered by an alloy solder layer which can generate chemical metallurgical reaction with diamond;
the range of the maximum length L1 in the geometrical shape of the heat dissipation area is as follows: d < L1<12D, D is the average grain size of the diamond abrasive grains.
2. A diamond grinding disc for grinding steel products with special abrasive grain topography as claimed in claim 1, wherein the shape of said heat dissipation area includes circle, triangle, quadrangle, hexagon, diamond.
3. A diamond grinding disc for grinding steel products with special abrasive grain topography according to claim 1, characterized in that the granularity and the contour of the diamond abrasive grains arranged on the surface of the diamond grinding disc are controlled within 15%, that is, the maximum size of the diamond on the surface of the same grinding disc is not larger than the minimum size by 15%.
4. A diamond grinding disc for grinding steel products with special abrasive grain topography according to claim 1, characterized in that the width direction of said linear or belt-shaped distribution area is arranged with not more than three abrasive grains.
5. A diamond grinding disc for grinding steel products with special abrasive grain topography according to claim 1, characterized in that the grain size distribution of the diamond abrasive grains is 20-120 meshes, and the diamond grain size on the surface of the grinding disc is a single grain size interval.
6. A diamond sharpening disk for steel products having a specialized abrasive grain topography according to claim 1, characterized in that said alloy solder layer is selected from Ni-Cr-B-Si alloy solders or Cu-Sn-Ti solders.
7. A diamond grinding disc for grinding steel products with special abrasive grain topography according to claim 1, characterized in that the outer diameter of the grinding disc specification ranges from 70mm to 230mm.
8. The method for preparing a diamond grinding disc with special abrasive grain topography for grinding steels according to any one of claims 1 to 7 is characterized by comprising the following steps:
(1) Coating a binder on the surface of the grinding disc matrix;
(2) Adhering a mesh-shaped separator, wherein the shape of meshes of the mesh-shaped separator corresponds to the shape of the heat dissipation area;
(3) Spreading alloy solder particles to cover the heat dissipation area;
(4) Removing the net-shaped partition plate;
(5) Diamond abrasive grains are distributed and sprinkled on the surface of the grinding disc which is exposed in a linear or strip shape and is not covered with the alloy solder;
(6) The welding flux is distributed again, the welding flux is distributed again and sprinkled on the surface of the whole diamond grinding disc, one part of the welding flux is filled in the gap of the diamond abrasive particles, and the other part of the welding flux is filled in the gap of the previous alloy welding flux;
(7) The special abrasive grain landform of the steel grinding disc is obtained by brazing preparation, diamond on the surface of the steel grinding disc is firmly welded after the abrasive grain is welded, the abrasive grain is uniformly distributed in a linear or strip shape, and a uniformly distributed heat dissipation area is surrounded;
the adhesive is a pressure-sensitive adhesive, and is diluted by organic solvents such as acetone, ethyl acetate and the like and then brushed on the surface of a steel matrix;
the reticular clapboard can be closely attached to the geometrical shapes such as a plane, a cambered surface, a bent angle curved surface and the like.
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