TWI405633B - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TWI405633B
TWI405633B TW097114836A TW97114836A TWI405633B TW I405633 B TWI405633 B TW I405633B TW 097114836 A TW097114836 A TW 097114836A TW 97114836 A TW97114836 A TW 97114836A TW I405633 B TWI405633 B TW I405633B
Authority
TW
Taiwan
Prior art keywords
optical axis
laser processing
optical
processing apparatus
modulation element
Prior art date
Application number
TW097114836A
Other languages
English (en)
Chinese (zh)
Other versions
TW200932409A (en
Inventor
中村達哉
高橋浩一
有賀潤子
Original Assignee
奧林巴斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧林巴斯股份有限公司 filed Critical 奧林巴斯股份有限公司
Publication of TW200932409A publication Critical patent/TW200932409A/zh
Application granted granted Critical
Publication of TWI405633B publication Critical patent/TWI405633B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
TW097114836A 2007-05-01 2008-04-23 雷射加工裝置 TWI405633B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007120812A JP5086687B2 (ja) 2007-05-01 2007-05-01 レーザ加工装置

Publications (2)

Publication Number Publication Date
TW200932409A TW200932409A (en) 2009-08-01
TWI405633B true TWI405633B (zh) 2013-08-21

Family

ID=40051446

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097114836A TWI405633B (zh) 2007-05-01 2008-04-23 雷射加工裝置

Country Status (4)

Country Link
JP (1) JP5086687B2 (https=)
KR (1) KR101523293B1 (https=)
CN (1) CN101298117B (https=)
TW (1) TWI405633B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5301955B2 (ja) * 2008-11-13 2013-09-25 オリンパス株式会社 欠陥修正装置
JP5346690B2 (ja) * 2009-05-26 2013-11-20 オリンパス株式会社 レーザ照射装置
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
TWI573650B (zh) 2011-12-16 2017-03-11 應用材料股份有限公司 輻射源及用於結合同調光束的光束組合器
CN102608875A (zh) * 2012-03-27 2012-07-25 深圳市华星光电技术有限公司 基于修补机台的玻璃基板补刻号方法及玻璃基板补刻号装置
CN103203541B (zh) * 2013-02-04 2015-05-13 张立国 一种激光加工装置
CN104375383B (zh) * 2013-08-13 2017-08-29 上海微电子装备有限公司 用于光刻设备的调焦调平检测装置及方法
JP6321932B2 (ja) * 2013-09-24 2018-05-09 株式会社小糸製作所 車両用前照灯
CN104227243A (zh) * 2014-09-11 2014-12-24 深圳英诺激光科技有限公司 一种硬质材料激光深加工设备及加工方法
CN106141457B (zh) * 2016-07-19 2018-01-12 张立国 一种激光钻孔系统及激光钻孔方法
CN106735875B (zh) * 2017-02-20 2019-01-18 湖北工业大学 一种基于液晶空间光调制器的激光柔性微加工系统及方法
CN107824968A (zh) * 2017-11-08 2018-03-23 深圳泰德激光科技有限公司 Ccd视觉定位的激光焊接装置
TWI856984B (zh) * 2018-10-30 2024-10-01 日商濱松赫德尼古斯股份有限公司 雷射加工頭以及雷射加工裝置
CN111098043B (zh) * 2020-01-19 2024-12-27 中国科学院宁波材料技术与工程研究所 水导激光加工装置和加工系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09206965A (ja) * 1996-01-26 1997-08-12 Keyence Corp レーザマーク装置
JP2006227198A (ja) * 2005-02-16 2006-08-31 Olympus Corp レーザ加工装置
TW200711773A (en) * 2005-06-17 2007-04-01 Olympus Corp Laser beam machining method and apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2220936Y (zh) * 1995-04-07 1996-02-28 中国科学院长春光学精密机械研究所 一种新型激光照排机
JP4429974B2 (ja) * 2005-06-17 2010-03-10 オリンパス株式会社 レーザ加工方法および装置
JP4947933B2 (ja) * 2005-07-26 2012-06-06 オリンパス株式会社 レーザリペア装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09206965A (ja) * 1996-01-26 1997-08-12 Keyence Corp レーザマーク装置
JP2006227198A (ja) * 2005-02-16 2006-08-31 Olympus Corp レーザ加工装置
TW200711773A (en) * 2005-06-17 2007-04-01 Olympus Corp Laser beam machining method and apparatus

Also Published As

Publication number Publication date
CN101298117A (zh) 2008-11-05
TW200932409A (en) 2009-08-01
JP2008272806A (ja) 2008-11-13
JP5086687B2 (ja) 2012-11-28
CN101298117B (zh) 2013-04-10
KR20080097340A (ko) 2008-11-05
KR101523293B1 (ko) 2015-05-27

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