TWI398725B - A photosensitive resin composition and a photosensitive resin laminate using the same - Google Patents

A photosensitive resin composition and a photosensitive resin laminate using the same Download PDF

Info

Publication number
TWI398725B
TWI398725B TW98111861A TW98111861A TWI398725B TW I398725 B TWI398725 B TW I398725B TW 98111861 A TW98111861 A TW 98111861A TW 98111861 A TW98111861 A TW 98111861A TW I398725 B TWI398725 B TW I398725B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
group
compound
resin composition
substrate
Prior art date
Application number
TW98111861A
Other languages
English (en)
Chinese (zh)
Other versions
TW201001066A (en
Inventor
Yosuke Hata
Youichiroh Ide
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201001066A publication Critical patent/TW201001066A/zh
Application granted granted Critical
Publication of TWI398725B publication Critical patent/TWI398725B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polyethers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW98111861A 2008-04-10 2009-04-09 A photosensitive resin composition and a photosensitive resin laminate using the same TWI398725B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008102036 2008-04-10
JP2008102038 2008-04-10

Publications (2)

Publication Number Publication Date
TW201001066A TW201001066A (en) 2010-01-01
TWI398725B true TWI398725B (zh) 2013-06-11

Family

ID=41161884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98111861A TWI398725B (zh) 2008-04-10 2009-04-09 A photosensitive resin composition and a photosensitive resin laminate using the same

Country Status (3)

Country Link
JP (2) JP5155389B2 (ja)
TW (1) TWI398725B (ja)
WO (1) WO2009125752A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI485521B (zh) * 2010-06-28 2015-05-21 Everlight Chem Ind Corp 正型感光樹脂組成物
KR102375653B1 (ko) * 2014-02-12 2022-03-16 쇼와덴코머티리얼즈가부시끼가이샤 감광성 엘리먼트
JP6641217B2 (ja) * 2016-03-30 2020-02-05 東京応化工業株式会社 金属酸化物膜形成用塗布剤及び金属酸化物膜を有する基体の製造方法
KR102293963B1 (ko) * 2016-12-20 2021-08-25 아사히 가세이 가부시키가이샤 2 층 감광층 롤
JP7190439B2 (ja) 2017-11-06 2022-12-15 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
KR101920783B1 (ko) * 2018-03-14 2018-11-21 동우 화인켐 주식회사 감광성 수지 조성물 및 이를 사용한 패턴 형성 방법
JP7076329B2 (ja) * 2018-08-01 2022-05-27 旭化成株式会社 感光性樹脂組成物及びそれを用いた感光性樹脂積層体
JP7338142B2 (ja) * 2018-10-30 2023-09-05 住友ベークライト株式会社 感光性樹脂組成物および電子デバイスの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087179A1 (en) * 2001-05-14 2003-05-08 Fuji Photo Film Co., Ltd. Positive photoresist transfer material and method for processing surface of substrate using the transfer material

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087433B2 (ja) * 1989-04-19 1996-01-29 日本ゼオン株式会社 ポジ型レジスト組成物
JP3203843B2 (ja) * 1992-12-24 2001-08-27 住友化学工業株式会社 カラーフィルター用レジスト組成物
JP2888236B2 (ja) * 1997-12-01 1999-05-10 ジェイエスアール株式会社 １，２−ナフトキノンジアジド化合物の製造方法
JP4236559B2 (ja) * 2002-11-01 2009-03-11 住友化学株式会社 着色感光性樹脂組成物およびそれを用いたカラーフィルタ
JP2005215137A (ja) * 2004-01-28 2005-08-11 Fuji Photo Film Co Ltd 感光性樹脂組成物、感光性転写材料、液晶配向制御用突起及びその製造方法、並びに液晶表示装置
JP2005221726A (ja) * 2004-02-05 2005-08-18 Fuji Photo Film Co Ltd 感光性転写材料、液晶配向制御用突起及びその形成方法、並びに、液晶表示装置
JP4655882B2 (ja) * 2004-10-29 2011-03-23 Ｊｓｒ株式会社 ポジ型感光性絶縁樹脂組成物およびその硬化物
KR101240643B1 (ko) * 2005-07-08 2013-03-08 삼성디스플레이 주식회사 포토레지스트 조성물, 상기 포토레지스트 조성물을 이용한 패턴의 형성 방법 및 이를 이용한 박막 트랜지스터표시판의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087179A1 (en) * 2001-05-14 2003-05-08 Fuji Photo Film Co., Ltd. Positive photoresist transfer material and method for processing surface of substrate using the transfer material

Also Published As

Publication number Publication date
JP2013054363A (ja) 2013-03-21
WO2009125752A1 (ja) 2009-10-15
TW201001066A (en) 2010-01-01
JPWO2009125752A1 (ja) 2011-08-04
JP5155389B2 (ja) 2013-03-06

Similar Documents

Publication Publication Date Title
JP3710717B2 (ja) 厚膜用ポジ型ホトレジスト組成物、ホトレジスト膜およびこれを用いたバンプ形成方法
TWI398725B (zh) A photosensitive resin composition and a photosensitive resin laminate using the same
JP3633179B2 (ja) ポジ型フォトレジスト組成物
JP4899986B2 (ja) ２層積層膜およびこれを用いたパターン形成方法
JP6323337B2 (ja) 感光性樹脂組成物及びこれを用いた感光性フィルム
JP4865729B2 (ja) 基板加工方法
JP4752754B2 (ja) ２層積層膜およびこれを用いたパターン形成方法
JP4840068B2 (ja) 感光性樹脂組成物及び感光性エレメント
KR101249997B1 (ko) 유기 절연막용 감광성 수지 조성물 및 이로부터 제조된 유기 절연막
WO2005101124A1 (ja) 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法
JP4063053B2 (ja) ２層積層膜およびこれを用いたパターン形成方法
KR19990036936A (ko) 열가소성 수지 경화막의 제조 방법
JP7076329B2 (ja) 感光性樹脂組成物及びそれを用いた感光性樹脂積層体
JP2004219536A (ja) 感光性樹脂組成物、回路形成用基板、レジストパターンの製造法、プリント配線板の製造法
WO2005008337A1 (ja) 感光性樹脂組成物
JP7340329B2 (ja) 感光性樹脂積層体及びレジストパターンの製造方法
JP2004240115A (ja) 感光性樹脂組成物、回路形成用基板、レジストパターンの製造法、プリント配線板の製造法
JP2010039214A (ja) 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2009198957A (ja) ポジ型感光性樹脂組成物
TW200912530A (en) Positive resist composition for producing a liquid crystal element and resist pattern formation method
JP7376989B2 (ja) 感光性樹脂組成物及びそれを用いた感光性樹脂積層体
JP7340328B2 (ja) 感光性樹脂組成物
TW200407667A (en) Radiation-sensitive resin composition used for insulation film formation of organic EL display element by ink-jet system, insulation film formed from organic EL display element and organic EL display element
JP2005037712A (ja) パターン化されたレジスト膜の製造方法、レジスト膜形成済回路形成用基板、及びプリント配線板の製造方法
JP3757408B2 (ja) 硬化膜、電子部品用膜およびその製造法