TWI394659B - 高屈曲性可撓性覆銅積層板之製造方法 - Google Patents

高屈曲性可撓性覆銅積層板之製造方法 Download PDF

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Publication number
TWI394659B
TWI394659B TW095126480A TW95126480A TWI394659B TW I394659 B TWI394659 B TW I394659B TW 095126480 A TW095126480 A TW 095126480A TW 95126480 A TW95126480 A TW 95126480A TW I394659 B TWI394659 B TW I394659B
Authority
TW
Taiwan
Prior art keywords
copper foil
heat treatment
copper
clad laminate
polyimide
Prior art date
Application number
TW095126480A
Other languages
English (en)
Chinese (zh)
Other versions
TW200704507A (en
Inventor
Natsuki Fukuda
Koichi Hattori
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200704507A publication Critical patent/TW200704507A/zh
Application granted granted Critical
Publication of TWI394659B publication Critical patent/TWI394659B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides

Landscapes

  • Laminated Bodies (AREA)
TW095126480A 2005-07-27 2006-07-20 高屈曲性可撓性覆銅積層板之製造方法 TWI394659B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005217064 2005-07-27

Publications (2)

Publication Number Publication Date
TW200704507A TW200704507A (en) 2007-02-01
TWI394659B true TWI394659B (zh) 2013-05-01

Family

ID=37674862

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126480A TWI394659B (zh) 2005-07-27 2006-07-20 高屈曲性可撓性覆銅積層板之製造方法

Country Status (3)

Country Link
KR (1) KR101241265B1 (ko)
CN (1) CN100594760C (ko)
TW (1) TWI394659B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4477665B2 (ja) * 2007-12-10 2010-06-09 古河電気工業株式会社 電解銅箔および配線板
KR101295138B1 (ko) * 2008-07-07 2013-08-09 후루카와 덴끼고교 가부시키가이샤 전해 동박 및 동장 적층판
KR101126969B1 (ko) * 2009-08-18 2012-03-23 엘에스엠트론 주식회사 고굴곡성의 전해 동박 및 그 제조 방법
JP2011093229A (ja) * 2009-10-30 2011-05-12 Jx Nippon Mining & Metals Corp 両面銅張積層板の製造方法、及びそれに用いる１組の銅又は銅合金箔
CN102078853A (zh) * 2009-11-30 2011-06-01 比亚迪股份有限公司 一种挠性覆铜板的制备方法
KR101304846B1 (ko) * 2011-06-10 2013-09-05 주식회사 포스코 우수한 방열성을 갖는 플렉서블 디스플레이용 기판 및 그 제조방법
CN105745360B (zh) * 2013-11-27 2017-12-08 三井金属矿业株式会社 带有载体箔的铜箔、覆铜层压板及印刷线路板
JP6344914B2 (ja) * 2013-12-27 2018-06-20 新日鉄住金化学株式会社 フレキシブル銅張積層板及びフレキシブル回路基板
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217507A (ja) * 2001-01-22 2002-08-02 Sony Chem Corp フレキシブルプリント基板
JP2004292734A (ja) * 2003-03-28 2004-10-21 Mitsui Chemicals Inc ポリイミド組成物およびポリイミド金属積層板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217507A (ja) * 2001-01-22 2002-08-02 Sony Chem Corp フレキシブルプリント基板
JP2004292734A (ja) * 2003-03-28 2004-10-21 Mitsui Chemicals Inc ポリイミド組成物およびポリイミド金属積層板

Also Published As

Publication number Publication date
TW200704507A (en) 2007-02-01
KR101241265B1 (ko) 2013-03-14
CN1905781A (zh) 2007-01-31
KR20070014067A (ko) 2007-01-31
CN100594760C (zh) 2010-03-17

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