TWI392422B - 具電氣零件之基板之製造方法 - Google Patents

具電氣零件之基板之製造方法 Download PDF

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TWI392422B
TWI392422B TW096110275A TW96110275A TWI392422B TW I392422 B TWI392422 B TW I392422B TW 096110275 A TW096110275 A TW 096110275A TW 96110275 A TW96110275 A TW 96110275A TW I392422 B TWI392422 B TW I392422B
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substrate
support substrate
electrical component
base substrate
electrical
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TW200810644A (en
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Masaki Taniguchi
Kazutaka Furuta
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Sony Chem & Inf Device Corp
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Description

具電氣零件之基板之製造方法
本發明係關於具電氣零件之基板之製造方法。
習知，如通訊用模組(module)，或無線LAN、調諧器等電子零件模塊，因裝載於含行動電話之電子機器，故要求小型、薄型。
電子零件模組，一般具有訊號處理用等IC數個與C、R等被動零件或其他異形零件數十個，且將此等零件構裝於主基板。
電子零件模組中，有一種在底基板之表面及背面裝載有電子零件之具電氣零件之基板，此種基板之一例，係在底基板之表面或背面，形成有包圍電子零件之環狀基板，在其環內側之空間(空穴)連接電子零件。
此種空穴構造，因在組合基板之製程不容易製作，故一般係先在底基板表面連接環狀基板以形成空穴構造，電子零件係於形成空穴構造後，連接於底基板。
然而，因該方法係於連接電子零件之前，在底基板形成空穴構造，故空穴構造成為供應焊料等連接材料之妨礙，導致不能以金屬掩模印刷或異向導電性薄膜之貼合等簡易方法供應連接材料等問題。因此，連接材料之供應方法僅限於使用分配器(dispenser)者，連接材料不僅限於分配器之吐出性良好者，且供應連接材料至微細圖案亦困難。
(專利文獻1)日本特開平11－45904號公報(專利文獻2)日本特開2000－105388號公報(專利文獻3)日本特開2002－93933號公報(專利文獻4)日本特開2002－359264號公報(專利文獻5)日本特開2005－32952號公報
本發明為解決上述問題而成者，其目的在於提供一種能以簡易方法製造具有空穴構造之基板之技術。
為解決上述問題，本發明係一種具電氣零件之基板之製造方法，在底基板單面之第一面、及與該第一面相反側面之第二面分別連接電氣零件，其特徵在於：在該底基板之第一面，配置該電氣零件、與厚度大於該電氣零件之支撐基板，將該電氣零件與該支撐基板一起按壓連接於該底基板後，在以該支撐基板支撐該底基板之狀態下，將該電氣零件裝載於該第二面，使該電氣零件連接於該第二面。
本發明係具電氣零件之基板之製造方法，其中，該支撐基板與該電氣零件之按壓，係將按壓橡膠按壓於該支持基板與該電氣零件。
本發明係具電氣零件之基板之製造方法，其中，該電氣零件與該支撐基板之配置，係以使該底基板之通孔、與該支撐基板之通孔形成電氣連接之方式，使該電氣零件與該支持基板定位。
本發明係具電氣零件之基板之製造方法，其中，該支持基板之俯視形狀呈環狀，且在該支撐基板之環內側配置該電氣零件。
本發明如上述構成，電氣零件與支撐基板，係藉由異向導電性黏著劑、異向導電性薄膜、糊狀導電材料、低熔點金屬(焊料)等之連接材料連接於底基板。
在第一面連接電氣零件之前，由於在第一面亦未連接支撐基板，並無妨礙配置連接材料之物，故連接材料之配置方法，不限於僅使用分配器之方法。
依本發明，由於能一次連接電氣零件與支撐基板，與習知方式相較連接步驟之數目少，故能縮短具電氣零件之基板之製造時間。又，若在連接電氣零件或支撐基板之步驟需要加熱時，因連接步驟之數目少，底基板或電氣零件被加熱之次數亦減少，故加熱所造成之損害變少。若要在與支撐基板相反側之面連接電氣零件時，雖支撐基板與處理台接觸，但因與支撐基板同一面連接之電氣零件不與處理台接觸，即使沒有特別之支撐治具，亦不會損傷電氣零件。當按壓橡膠變形時，因按壓橡膠之流動被支撐基板攔阻，故不會產生電氣零件之移位，而能獲得可靠性高之具電氣零件之基板。
圖4(h)中，符號1係表示以本發明之製造方法製成之具電氣零件之基板之一例，具電氣零件之基板1，具有底基板10與支撐基板20。
底基板10具有基板本體11，在基板本體11之表面及背面，配置有以圖案化形成之配線膜12。
配線膜12具有以圖案化形成寬度大之連接部16、與以圖案化形成細長之配線部17，連接部16與連接部16之間係以配線部17彼此連接。
在基板本體11之表面配置電氣零件32、與異形零件33，在基板本體11之背面配置電氣零件31、與厚度小於該電氣零件31之電氣零件32。
電氣零件31~33具有連接端子36、37，基板本體11表面之電氣零件32係在連接端子37接觸於連接部16之狀態下，藉由固化之焊料18固定，異形零件33亦藉由固化之焊料18固定於連接部16上。
在基板本體11背面之電氣零件31、32，在連接端子36、37直接或透過後述之導電性粒子接觸於連接部16之狀態下，藉由硬化之黏著劑層46固定。因此，電氣零件31~33在與配線膜12形成電氣連接之狀態下，亦與底基板10形成機械連接。
在基板本體11設有從表面貫穿至背面之通孔15，在通孔15內部形成未圖示之導電體。連接部16連接在通孔15兩端，基板本體11表面之配線膜12與背面之配線膜12透過通孔15之導電體形成電氣連接。如上述，因電氣零件31~33連接於配線膜12，故電氣零件31~33亦與通孔15形成電氣連接。
支撐基板20，具有：基板本體21；通孔25，從表面至背面貫穿基板本體21；及配線膜(焊盤：land)22，形成於通孔25之一端與另一端。
支撐基板20之俯視形狀係呈環狀，其環內周之大小係較基板本體11之俯視形狀為小，以環內周包圍至少1個電氣零件31、32之方式，藉由硬化於基板本體11背面上之黏著劑層46固定。
焊盤22位於通孔25正上方，而位於底基板10之通孔15正上方之連接部16係連接於該焊盤22。因此，底基板10之通孔15與支撐基板20之通孔25係以排列成直線上之狀態彼此連接。
又，通孔15、25不限於排列成直線上之情形，亦包含底基板10之通孔15不位於支撐基板20之通孔25正上方，而位於離開之位置之情形。
如上述，連接於底基板10之電氣零件31、32，因連接於底基板10之通孔15，故電氣零件31、32成為與底基板20之通孔25連接。
在此，在配置於支撐基板20之與底基板10相反側之焊盤22，配置用以使通孔25連接於其他配線板或電氣裝置之焊球27。
若將底基板10之連接支撐基板20側之面設為第1面13，將與第一面13相反之面設為第二面14，支撐基板20則較配置於第一面13之電氣零件31、32為厚。
因此，支撐基板20係較電氣零件31、32從第一面13突出為高，當將此具電氣零件之基板1連接於其他配線板時，能使支撐基板20之焊盤22抵接於配線板之端子，使配線板與具電氣零件之基板1形成電氣連接。
其次，說明製造上述具電氣零件之基板1之步驟。
圖1(a)係表示在將電氣零件31、32與支撐基板20連接前之底基板10，在此底基板10係硬質基板。
在第一面13之連接部16上配置黏著劑層45，若將底基板10裝載於載置台48，將第二面14之配線膜12密接於載置台48之平坦之裝載面49，第一面13即配置於無凹凸之平面內(圖2(a))。
圖1(b)~(d)分別表示連接於底基板10前之支撐基板20、與電氣零件31、32，在此支撐基板20係硬質基板。
底基板10之供電氣零件31、32連接之部位，係依電氣零件31、32而預先決定。若將厚電氣零件31與薄電氣零件32分別配置於第一面13上所決定之部位，厚電氣零件31之連接端子36與薄電氣零件32之連接端子37則被裝載於隔著黏著劑層45決定之連接部16上。
支撐基板20與底基板10之相對位置關係係預先設定。以未圖示之對準標記疊合之方式，先進行較電氣零件31、32為厚之支撐基板20與底基板10之定位後，將支撐基板20裝載於第一面13上，支撐基板20之焊盤22即隔著黏著劑層45被裝載於既定之連接部16(圖2(b))。
如上述，因支撐基板20較第一面13上之電氣零件31、32為厚，故在將支撐基板20與電氣零件31、32裝載於第一面13上之狀態下，支撐基板20之前端，較電氣零件31、32前端從第一面13突出為高。
圖2(c)之符號40係表示將按壓橡膠42安裝於金屬製按壓板41之按壓頭。
按壓橡膠42係以例如彈性體之彈性材料構成，當按壓頭40下降，首先，按壓橡膠42先接觸於支撐基板20之前端，若更下降，按壓橡膠42即按壓支撐基板20，即使在按壓橡膠42施加橫方向之力量，被按壓橡膠42按壓之支撐基板20之部分不移動，而對支撐基板20保持靜止狀態。
如上述，因電氣零件31、32之厚度不同，故從第一面13至電氣零件31、32前端之高度不同。
使按壓頭40更下降，接觸於最厚之電氣零件31，接著，接觸於厚度較薄之電氣零件32，藉由按壓橡膠42按壓電氣零件31、32。
此時，因電氣零件31、32按壓橡膠42會凹陷，凹陷之部分雖藉由其他部分之膨脹而移動至電氣零件31、32間之間隙、或電氣零件31、32與支撐基板20間之間隙，但因與支撐基板20密接之按壓橡膠42之部分不移動，故因按壓橡膠42之膨脹，即使產生從支撐基板20之環中心向外側之力量，按壓橡膠42仍不會從環內側超越支撐基板20而往外側流出，故在電氣零件31、32外表上不會施加橫方向之力量。
當電氣零件31、32以按壓橡膠42按壓時，若在電氣零件31、32之周圍沒有支撐基板20，按壓橡膠42即往外側流出，會對電氣零件31、32產生朝外側移動之力量而引起移位。
在此，電氣零件31、32係位於支撐基板20之環內側，因在電氣零件31、32外表上不會施加橫方向之力量，故當以按壓橡膠42一起按壓電氣零件31、32與支撐基板20時，電氣零件31、32不會朝橫方向移動，不引起電氣零件31、32之移位。
黏著劑層45係以將導電性粒子分散於黏結劑而成之異向導電性黏著劑構成，當電氣零件31、32與支撐基板20被按壓，黏著劑層45因按壓而被擠出，使電氣零件31、32之連接端子36、37與支撐基板20之焊盤22，直接或透過導電性粒子抵接於連接部16，而使支撐基板20與電氣零件31、32電氣連接於底基板10。
在此，在載置台48設有加熱機構47，藉由加熱機構47預先加熱載置台48，利用熱傳導加熱黏著劑層45。黏著劑層45之黏結劑含有熱硬化性樹脂，當黏著劑層45升溫至既定溫度以上，熱硬化性樹脂即聚合而使黏著劑層45硬化。
圖3(d)表示使黏著劑層45硬化後，將按壓頭40從電氣零件31、32或支撐基板20分離之狀態。
支撐基板20與電氣零件31、32藉由硬化之黏著劑層45保持電氣連接於底基板10而固定，因此支撐基板20與電氣零件31、32形成機械及電氣連接於底基板10。
在此，第一面13之配線膜12係位於同一平面內，如上述，因支撐基板20係較電氣零件31、32為厚，故在將支撐基板20與電氣零件31、32電氣及機械連接於底基板10之狀態下，支撐基板20前端從第一面13算起之高度，大於電氣零件31、32前端從第一面13算起之高度。
將連接支撐基板20與電氣零件31、32之狀態之底基板10，以支撐板20為下側，裝載於處理台51之平坦之處理面52，支撐基板20雖會接觸於處理面52，但電氣零件31、32成為下垂於第一面13之狀態，在電氣零件31、32與處理面52之間形成間隙(圖3(e))。
在使第二面14呈大致水平之方式配置處理台51之狀態下，在第二面14之連接部16上配置焊料糊而形成低熔點金屬層18，接著，將電氣零件32與異形(電氣)零件33裝載於第二面14上所指定之部位，電氣零件32之連接端子37隔著低熔點金屬層18而與連接部16面對，異形零件33亦成為裝載於連接部16之狀態(圖3(f))。
保持第二面14呈大致水平之狀態，例如，將底基板10與處理台51一起放入迴焊(reflow)爐加熱，使低熔點金屬層18升溫至熔點以上，低熔點金屬層18即軟化，電氣零件32之連接端子37抵接於連接部16，異形零件33亦抵接於連接部16，使電氣零件32與異形零件33電氣連接於底基板10(圖4(g))。
當低熔點金屬層18升溫時，雖硬化之黏著劑層46亦升溫，但因熱硬化性樹脂之聚合物，至少在低熔點金屬層18之熔解溫度不會軟化，保持著黏著劑層46硬化，故第一面13側之電氣零件31、32不會掉落，而維持垂下狀態。
其次使全體冷卻而使低熔點金屬層18固化，電氣零件32與異形零件33即以保持著連接於底基板10固化之低熔點金屬層18固定。因此，電氣零件32與異形零件33藉由固化之低熔點金屬層18形成電氣及機械連接於底基板10。
其次，在與底基板10相反側之焊盤22配置焊球27，能獲得圖4(h)所示之具電氣零件之基板1。
以上，底基板10與支撐基板20係不限於硬質基板(例如玻璃環氧基板)，亦能使用撓性配線板。若在支撐基板20使用撓性配線板時，較佳為支撐底基板10時不會壓縮變形者。
若在底基板10使用具撓性之撓性配線板時，當將底基板10裝載於載置台48時，使底基板10不彎曲，在第1面13位於平面內之狀態下，進行支撐基板20與電氣零件31、32之連接，將連接支撐基板20與電氣零件31、32之底基板10移載至處理台51時，使底基板10不彎曲，且使電氣零件31、32不接觸處理台51。
支撐基板20之環狀不特別限於四角形、圓形等，該環狀或環之大小，只要不使支撐基板20從第一面13掉落，能配置於底基板10上即可，例如，環之一部分從底基板10之邊緣突出亦可。
又，支撐基板20不限於環狀，只要能以支撐基板20支撐底基板10，能使用ㄈ字形、L字形、直線狀、柱狀者，但若支撐基板20係環狀，如上述能防止電氣零件31、32之移位。
電氣零件31、32不限於僅配置在支撐基板20之環內側之情形，亦可將配置於支撐基板20之環外側之電氣零件31、32連接於支撐基板20，或與位於支撐基板20之環內側之電氣零件31、32一起連接於底基板10。
當支撐基板20係L字形時，為穏定支撐底基板10，如圖5所示，較佳為在底基板10之第1面13側將支撐基板20連接2個以上。又，當支撐基板20係直線狀或柱狀時，如圖6所示，較佳為在底基板10之第1面13側將支撐基板20隔著間隔連接3個或4個以上。
當支撐基板20係直線狀或柱狀時，若在連接於第一面13之支撐基板20安裝固定具，使支撐基板20彼此之相對位置關係固定，即使底基板10係具撓性之撓性配線板，以支撐基板20支撐底基板10時，仍不會產生底基板10之彎曲。
以上，雖說明僅在第一面13連接支撐基板20之情形，但本發明不限於此，亦能在第一、第二面13、14雙方連接支撐基板20。在此情形，在第一面13連接支撐基板20之後，在該支撐基板20支撐底基板10之狀態下，在第二面14連接支撐基板20。
以上，雖說明在第二面14連接電氣零件31、32之連接材料係使用低熔點金屬(焊料)，使低熔點金屬熔解來進行連接之情形，但本發明不限於此。
例如，底基板10係硬質基板等，以即使按壓亦不變形之基板來構成之情形，在第二面14上連接電氣零件32或異形零件33時，即使按壓電氣零件32或異形零件33，因底基板10不會彎曲，故可維持電氣零件31、32垂下於第一面13之狀態。
因此，在第二面14連接電氣零件32或異形零件33時之連接材料，除低熔點金屬以外，亦能使用熱硬化性黏著劑、熱可塑性黏著劑。
若在第二面14連接電氣零件32或異形零件33時進行加熱之情形，該加熱溫度，係設定為不會使固定電氣零件31、32於第一面13之連接材料熔解或破壞之溫度。
例如，在第一面13連接電氣零件31、32時，能使用熔點高於在第二面14連接電氣零件32或異形零件33時之加熱溫度的低熔點金屬、軟化溫度低於該加熱溫度之熱可塑性黏著劑。
使用於本發明之熱硬化性黏著劑，係指導電性粒子分散於含熱硬化性樹脂之黏結劑，熱可塑性黏著劑，係指導電性粒子分散於含熱可塑性樹脂之黏結劑。又，若在熱硬化性樹脂之黏結劑亦含有熱可塑性樹脂，能提高熱硬化性黏著劑之黏著性。
第一、第二面13、14之連接材料之配置方法並無特別限定，能採用各種方法，例如，使用形成有既定圖案的開口之掩模將連接材料塗布於既定圖案之掩模印刷法、使用分配器吐出連接材料之分配器法、貼合薄膜狀之連接材料(黏著薄膜)之方法等。
又，因未限定連接材料之配置方法，故亦不限定連接材料之種類，能配合電氣零件31、32、33或支撐基板20之特性來選擇連接材料。
連接於底基板10之電氣零件31、32，例如有半導體晶片、電阻元件等，但未特別限定其種類。
1．．．具電氣零件之基板
10．．．底基板
11、21．．．基板本體
12．．．配線膜
13．．．第一面
14．．．第二面
15、25．．．通孔
16．．．連接部
17．．．配線部
18．．．焊料(低熔點金屬層)
20．．．支撐基板
22．．．配線膜(焊盤)
27．．．焊球
31、32、33．．．電氣零件
36、37．．．連接端子
40．．．按壓頭
41．．．按壓板
42．．．按壓橡膠
45、46．．．黏著劑層
47．．．加熱機構
48．．．載置台
49．．．裝載面
51．．．處理台
52．．．處理面
圖1(a)係底基板的截面圖，(b)係支撐基板的截面圖，(c)係電氣零件的截面圖。
圖2(a)~(c)係用以說明具電氣零件之基板之製造過程的截面圖。
圖3(d)~(f)係用以說明具電氣零件之基板之製造過程的截面圖。
圖4(g)、(h)係用以說明具電氣零件之基板之製造過程的截面圖。
圖5係用以說明將L字形狀之支撐基板連接於底基板之狀態的俯視圖。
圖6係用以說明將直線狀或柱狀之支撐基板連接於底基板之狀態的俯視圖。
1．．．具電氣零件之基板
10．．．底基板
11、21．．．基板本體
12．．．配線膜
13．．．第一面
14．．．第二面
15、25．．．通孔
16．．．連接部
17．．．配線部
18．．．焊料(低熔點金屬層)
20．．．支撐基板
22．．．配線膜(焊盤)
27．．．焊球
31、32、33．．．電氣零件
36、37．．．連接端子
46．．．黏著劑層
51．．．處理台
2．．．處理面

Claims (4)

  1. 一種具電氣零件之基板之製造方法，係在底基板單面之第一面、及與該第一面相反側面之第二面分別連接電氣零件，其特徵在於：在該底基板之第一面上，配置該電氣零件、與厚度大於該電氣零件之支撐基板，將該電氣零件與該支撐基板透過連接材料一起按壓連接於該底基板後，在以該支撐基板支撐該底基板之狀態下，將該電氣零件裝載於該第二面，使該電氣零件透過連接材料連接於該第二面。
  2. 如申請專利範圍第1項之具電氣零件之基板之製造方法，其中，該支撐基板與該電氣零件之按壓，係將按壓橡膠緊壓於該支撐基板與該電氣零件。
  3. 如申請專利範圍第1項之具電氣零件之基板之製造方法，其中，該電氣零件與該支撐基板之配置，係以使該底基板之通孔、與該支撐基板之通孔形成電氣連接之方式，使該電氣零件與該支撐基板定位。
  4. 如申請專利範圍第1項之具電氣零件之基板之製造方法，其中，該支撐基板之俯視形狀呈環狀，且在該支撐基板之環內側配置該電氣零件。
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