TWI385263B - Silver alloy target for forming reflective electrode film for organic electroluminescent element and manufacturing method thereof - Google Patents

Silver alloy target for forming reflective electrode film for organic electroluminescent element and manufacturing method thereof Download PDF

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Publication number
TWI385263B
TWI385263B TW099134036A TW99134036A TWI385263B TW I385263 B TWI385263 B TW I385263B TW 099134036 A TW099134036 A TW 099134036A TW 99134036 A TW99134036 A TW 99134036A TW I385263 B TWI385263 B TW I385263B
Authority
TW
Taiwan
Prior art keywords
target
reflective electrode
electrode film
silver alloy
particle diameter
Prior art date
Application number
TW099134036A
Other languages
English (en)
Chinese (zh)
Other versions
TW201131001A (en
Inventor
小見山昌三
伊藤郁夫
Original Assignee
三菱綜合材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱綜合材料股份有限公司 filed Critical 三菱綜合材料股份有限公司
Publication of TW201131001A publication Critical patent/TW201131001A/zh
Application granted granted Critical
Publication of TWI385263B publication Critical patent/TWI385263B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW099134036A 2009-10-06 2010-10-06 Silver alloy target for forming reflective electrode film for organic electroluminescent element and manufacturing method thereof TWI385263B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009232634 2009-10-06
JP2010210149A JP4793502B2 (ja) 2009-10-06 2010-09-17 有機ｅｌ素子の反射電極膜形成用銀合金ターゲットおよびその製造方法

Publications (2)

Publication Number Publication Date
TW201131001A TW201131001A (en) 2011-09-16
TWI385263B true TWI385263B (zh) 2013-02-11

Family

ID=43856934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099134036A TWI385263B (zh) 2009-10-06 2010-10-06 Silver alloy target for forming reflective electrode film for organic electroluminescent element and manufacturing method thereof

Country Status (7)

Country Link
US (1) US8821769B2 (enExample)
EP (1) EP2487274B1 (enExample)
JP (1) JP4793502B2 (enExample)
KR (1) KR101099415B1 (enExample)
CN (1) CN102421931B (enExample)
TW (1) TWI385263B (enExample)
WO (1) WO2011043486A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5533545B2 (ja) * 2010-01-12 2014-06-25 三菱マテリアル株式会社 有機ｅｌ素子の反射電極膜形成用銀合金ターゲットおよびその製造方法
JP5806653B2 (ja) * 2011-12-27 2015-11-10 株式会社神戸製鋼所 反射電極用Ａｇ合金膜、反射電極、およびＡｇ合金スパッタリングターゲット
JP5159962B1 (ja) 2012-01-10 2013-03-13 三菱マテリアル株式会社 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
JP5472353B2 (ja) * 2012-03-27 2014-04-16 三菱マテリアル株式会社 銀系円筒ターゲット及びその製造方法
DE102012006718B3 (de) * 2012-04-04 2013-07-18 Heraeus Materials Technology Gmbh & Co. Kg Planares oder rohrförmiges Sputtertarget sowie Verfahren zur Herstellung desselben
JP5928218B2 (ja) * 2012-07-20 2016-06-01 三菱マテリアル株式会社 Ａｇ合金膜及びその製造方法
JP5522599B1 (ja) 2012-12-21 2014-06-18 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット
JP2014196562A (ja) * 2012-12-21 2014-10-16 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット
JP5612147B2 (ja) * 2013-03-11 2014-10-22 三菱マテリアル株式会社 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
JP6198177B2 (ja) * 2013-07-19 2017-09-20 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット
CN105316630B (zh) * 2014-06-04 2020-06-19 光洋应用材料科技股份有限公司 银合金靶材、其制造方法及应用该靶材的有机发光二极管
DE102014214683A1 (de) 2014-07-25 2016-01-28 Heraeus Deutschland GmbH & Co. KG Sputtertarget auf der Basis einer Silberlegierung
EP3168325B1 (de) 2015-11-10 2022-01-05 Materion Advanced Materials Germany GmbH Sputtertarget auf der basis einer silberlegierung
CN106893989B (zh) * 2016-12-29 2019-10-01 昆山全亚冠环保科技有限公司 一种银钛合金靶材防开裂轧制工艺
JP2019143242A (ja) 2018-02-20 2019-08-29 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット、及び、Ａｇ合金スパッタリングターゲットの製造方法
WO2019163745A1 (ja) * 2018-02-20 2019-08-29 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット、及び、Ａｇ合金スパッタリングターゲットの製造方法
CN117070905A (zh) * 2023-09-19 2023-11-17 芜湖映日科技股份有限公司 一种超大尺寸银合金靶材及其制备方法
CN118028748A (zh) * 2023-12-27 2024-05-14 有研亿金新材料有限公司 一种钨靶材及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003100112A1 (fr) * 2002-05-28 2003-12-04 Ishifuku Metal Industry Co., Ltd. Matériau pour cible de pulvérisation
JP2005036291A (ja) * 2003-07-16 2005-02-10 Kobe Steel Ltd Ａｇ系スパッタリングターゲット及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2857015B2 (ja) 1993-04-08 1999-02-10 株式会社ジャパンエナジー 高純度アルミニウムまたはその合金からなるスパッタリングターゲット
JP3856386B2 (ja) 2001-03-16 2006-12-13 石福金属興業株式会社 スパッタリングターゲット材
TWI258514B (en) * 2002-06-24 2006-07-21 Kobelco Res Inst Inc Silver alloy sputtering target and process for producing the same
JP4264302B2 (ja) * 2002-06-24 2009-05-13 株式会社コベルコ科研 銀合金スパッタリングターゲットとその製造方法
JP4351144B2 (ja) * 2004-12-08 2009-10-28 田中貴金属工業株式会社 銀合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003100112A1 (fr) * 2002-05-28 2003-12-04 Ishifuku Metal Industry Co., Ltd. Matériau pour cible de pulvérisation
JP2005036291A (ja) * 2003-07-16 2005-02-10 Kobe Steel Ltd Ａｇ系スパッタリングターゲット及びその製造方法

Also Published As

Publication number Publication date
JP4793502B2 (ja) 2011-10-12
US8821769B2 (en) 2014-09-02
CN102421931B (zh) 2013-10-30
CN102421931A (zh) 2012-04-18
TW201131001A (en) 2011-09-16
US20120193589A1 (en) 2012-08-02
JP2011100719A (ja) 2011-05-19
EP2487274A1 (en) 2012-08-15
WO2011043486A1 (ja) 2011-04-14
KR101099415B1 (ko) 2011-12-27
KR20110113214A (ko) 2011-10-14
EP2487274A4 (en) 2017-05-24
EP2487274B1 (en) 2018-09-26

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