TWI384915B - 雙接達型撓性電路板的製造方法 - Google Patents

雙接達型撓性電路板的製造方法 Download PDF

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Publication number
TWI384915B
TWI384915B TW095115470A TW95115470A TWI384915B TW I384915 B TWI384915 B TW I384915B TW 095115470 A TW095115470 A TW 095115470A TW 95115470 A TW95115470 A TW 95115470A TW I384915 B TWI384915 B TW I384915B
Authority
TW
Taiwan
Prior art keywords
photosensitive polyimide
circuit board
flexible circuit
photosensitive
type flexible
Prior art date
Application number
TW095115470A
Other languages
English (en)
Chinese (zh)
Other versions
TW200640314A (en
Inventor
Nobuyuki Sensui
Hideaki Tanaka
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200640314A publication Critical patent/TW200640314A/zh
Application granted granted Critical
Publication of TWI384915B publication Critical patent/TWI384915B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095115470A 2005-05-02 2006-05-01 雙接達型撓性電路板的製造方法 TWI384915B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005134140A JP2006310689A (ja) 2005-05-02 2005-05-02 ダブルアクセス型可撓性回路基板の製造方法

Publications (2)

Publication Number Publication Date
TW200640314A TW200640314A (en) 2006-11-16
TWI384915B true TWI384915B (zh) 2013-02-01

Family

ID=37444381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115470A TWI384915B (zh) 2005-05-02 2006-05-01 雙接達型撓性電路板的製造方法

Country Status (4)

Country Link
JP (1) JP2006310689A (ko)
KR (1) KR20060114647A (ko)
CN (1) CN1870859B (ko)
TW (1) TWI384915B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288422A (ja) * 2007-05-18 2008-11-27 Kinsus Interconnect Technology Corp フレキシブルプリント配線板及びその製造方法
US9161712B2 (en) * 2013-03-26 2015-10-20 Google Inc. Systems and methods for encapsulating electronics in a mountable device
TWI577251B (zh) * 2015-12-01 2017-04-01 同泰電子科技股份有限公司 軟硬複合線路板及其製作方法
KR102260412B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260413B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260416B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307564A (ja) * 1994-05-10 1995-11-21 Hitachi Chem Co Ltd 配線板の製造法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
JPH04206677A (ja) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd ダブルアクセスフレキシブル印刷配線板の製造方法
JP2869969B2 (ja) * 1995-04-28 1999-03-10 ソニーケミカル株式会社 フレキシブル回路基板の製造方法
JP3666955B2 (ja) * 1995-10-03 2005-06-29 日本メクトロン株式会社 可撓性回路基板の製造法
JPH10224013A (ja) * 1997-02-12 1998-08-21 Nippon Mektron Ltd 回路基板の製造法
JP3261064B2 (ja) * 1997-03-24 2002-02-25 日本メクトロン株式会社 半導体装置用可撓性回路基板の製造法
JPH1117331A (ja) * 1997-06-26 1999-01-22 Nippon Mektron Ltd 可撓性回路基板の製造法
JP3541697B2 (ja) * 1998-11-20 2004-07-14 ソニーケミカル株式会社 フレキシブル配線板の製造方法
JP2001313451A (ja) * 2000-04-28 2001-11-09 Nitto Denko Corp フレキシブル配線板の製造方法
JP4459406B2 (ja) * 2000-07-27 2010-04-28 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線板製造方法
JP2002156758A (ja) * 2000-11-16 2002-05-31 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製法
JP4570799B2 (ja) * 2001-02-16 2010-10-27 日東電工株式会社 配線回路基板の製造方法
JP4673507B2 (ja) * 2001-06-29 2011-04-20 オプトレックス株式会社 フレキシブル配線基板の位置合わせ方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307564A (ja) * 1994-05-10 1995-11-21 Hitachi Chem Co Ltd 配線板の製造法

Also Published As

Publication number Publication date
CN1870859A (zh) 2006-11-29
CN1870859B (zh) 2012-06-27
JP2006310689A (ja) 2006-11-09
TW200640314A (en) 2006-11-16
KR20060114647A (ko) 2006-11-07

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MM4A Annulment or lapse of patent due to non-payment of fees