TWI383467B - Stage device - Google Patents
Stage device Download PDFInfo
- Publication number
- TWI383467B TWI383467B TW097109874A TW97109874A TWI383467B TW I383467 B TWI383467 B TW I383467B TW 097109874 A TW097109874 A TW 097109874A TW 97109874 A TW97109874 A TW 97109874A TW I383467 B TWI383467 B TW I383467B
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- frame
- cans
- upper frame
- axis direction
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Machine Tool Units (AREA)
- Feeding Of Articles To Conveyors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007321307A JP4195497B2 (ja) | 2007-12-12 | 2007-12-12 | ステージ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200926345A TW200926345A (en) | 2009-06-16 |
TWI383467B true TWI383467B (zh) | 2013-01-21 |
Family
ID=39242917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097109874A TWI383467B (zh) | 2007-12-12 | 2008-03-20 | Stage device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4195497B2 (ja) |
KR (1) | KR100993473B1 (ja) |
CN (1) | CN101459103B (ja) |
TW (1) | TWI383467B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010225687A (ja) * | 2009-03-19 | 2010-10-07 | Shibaura Mechatronics Corp | 基板の処理装置 |
WO2010118002A1 (en) * | 2009-04-07 | 2010-10-14 | Trumpf, Inc. | A workpiece processing machine with a processing head, a suction duct and structural connecting frame section for transporting the processing machine |
EP2416916B1 (en) | 2009-04-07 | 2015-02-25 | Trumpf, Inc. | Cutting machine with a cutting head using a beam and a suction duct coupled to the motion unit moving the cutting head |
JP5380225B2 (ja) * | 2009-09-24 | 2014-01-08 | 株式会社日立ハイテクノロジーズ | ガラス基板の検査装置 |
TW201140727A (en) * | 2009-11-10 | 2011-11-16 | Ulvac Inc | Inspection apparatus |
KR101055214B1 (ko) * | 2010-08-02 | 2011-08-09 | 김복인 | 현장조립형 중,대형 가공기 |
JP5605502B2 (ja) * | 2011-03-24 | 2014-10-15 | 村田機械株式会社 | 工作機械システム |
CN103594280B (zh) * | 2013-10-31 | 2015-08-26 | 西安交通大学 | 一种新型复合触头真空灭弧室及其应用的真空断路器 |
DE102017007962A1 (de) * | 2017-08-24 | 2019-02-28 | Deckel Maho Seebach Gmbh | Werkzeugmaschine |
JP6628950B1 (ja) * | 2019-04-25 | 2020-01-15 | 三菱電機株式会社 | レーザ加工機 |
CN110000578A (zh) * | 2019-04-29 | 2019-07-12 | 广船国际有限公司 | 一种镗孔设备的支撑结构及法兰的加工方法 |
JP7223289B2 (ja) * | 2020-09-24 | 2023-02-16 | 日新イオン機器株式会社 | 搬送装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6002465A (en) * | 1996-10-15 | 1999-12-14 | Canon Kabushiki Kaisha | Stage device, exposure apparatus using the same, and device production method |
US6266133B1 (en) * | 1998-05-06 | 2001-07-24 | Canon Kabushiki Kaisha | Stage device, an exposure apparatus and a device manufacturing method using the same |
JP2002365026A (ja) * | 2001-06-07 | 2002-12-18 | Sigma Technos Kk | 基板検査装置 |
JP2006224039A (ja) * | 2005-02-21 | 2006-08-31 | Dainippon Printing Co Ltd | パターン形成装置、パターニング方法、基板処理装置、基板処理方法 |
JP2006269509A (ja) * | 2005-03-22 | 2006-10-05 | Nsk Ltd | 位置決め装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4197238B2 (ja) * | 2002-05-24 | 2008-12-17 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2006049384A (ja) * | 2004-07-30 | 2006-02-16 | Laserfront Technologies Inc | ガントリー型xyステージ |
-
2007
- 2007-12-12 JP JP2007321307A patent/JP4195497B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-20 TW TW097109874A patent/TWI383467B/zh not_active IP Right Cessation
- 2008-04-11 CN CN2008100870894A patent/CN101459103B/zh not_active Expired - Fee Related
- 2008-09-23 KR KR1020080093188A patent/KR100993473B1/ko not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6002465A (en) * | 1996-10-15 | 1999-12-14 | Canon Kabushiki Kaisha | Stage device, exposure apparatus using the same, and device production method |
US6266133B1 (en) * | 1998-05-06 | 2001-07-24 | Canon Kabushiki Kaisha | Stage device, an exposure apparatus and a device manufacturing method using the same |
JP2002365026A (ja) * | 2001-06-07 | 2002-12-18 | Sigma Technos Kk | 基板検査装置 |
JP2006224039A (ja) * | 2005-02-21 | 2006-08-31 | Dainippon Printing Co Ltd | パターン形成装置、パターニング方法、基板処理装置、基板処理方法 |
JP2006269509A (ja) * | 2005-03-22 | 2006-10-05 | Nsk Ltd | 位置決め装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4195497B2 (ja) | 2008-12-10 |
CN101459103A (zh) | 2009-06-17 |
KR20090063076A (ko) | 2009-06-17 |
CN101459103B (zh) | 2011-11-30 |
KR100993473B1 (ko) | 2010-11-10 |
TW200926345A (en) | 2009-06-16 |
JP2008060614A (ja) | 2008-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |