TWI379870B - - Google Patents

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Publication number
TWI379870B
TWI379870B TW095104939A TW95104939A TWI379870B TW I379870 B TWI379870 B TW I379870B TW 095104939 A TW095104939 A TW 095104939A TW 95104939 A TW95104939 A TW 95104939A TW I379870 B TWI379870 B TW I379870B
Authority
TW
Taiwan
Prior art keywords
parts
mass
rubber
unit
rubber composition
Prior art date
Application number
TW095104939A
Other languages
English (en)
Chinese (zh)
Other versions
TW200641055A (en
Inventor
Noriyuki Meguriya
Tsutomu Nakamura
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200641055A publication Critical patent/TW200641055A/zh
Application granted granted Critical
Publication of TWI379870B publication Critical patent/TWI379870B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2265Oxides; Hydroxides of metals of iron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/206Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW095104939A 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet TW200641055A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037444A JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Publications (2)

Publication Number Publication Date
TW200641055A TW200641055A (en) 2006-12-01
TWI379870B true TWI379870B (enrdf_load_stackoverflow) 2012-12-21

Family

ID=36987076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104939A TW200641055A (en) 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet

Country Status (3)

Country Link
JP (1) JP4525914B2 (enrdf_load_stackoverflow)
KR (1) KR101225391B1 (enrdf_load_stackoverflow)
TW (1) TW200641055A (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839780B1 (ko) 2006-01-18 2008-06-19 주식회사 엘지화학 유연성 기판 반송용 점착제
KR100831562B1 (ko) 2006-03-23 2008-05-21 주식회사 엘지화학 유연성 기판 반송용 점착제 조성물
KR100804359B1 (ko) * 2006-12-04 2008-02-15 엘에스전선 주식회사 자동차용 고무호스
JP2008247812A (ja) * 2007-03-30 2008-10-16 Gc Corp シリコーン組成物
JP5243775B2 (ja) * 2007-11-14 2013-07-24 東海ゴム工業株式会社 誘電膜およびそれを用いたアクチュエータ、センサ、トランスデューサ
DE102009011164A1 (de) * 2009-03-04 2010-09-09 Tesa Se Klebeband, insbesondere zur Verklebung von Photovoltaiklaminaten
KR102277649B1 (ko) 2014-01-31 2021-07-16 신에쓰 가가꾸 고교 가부시끼가이샤 오가노폴리실록세인 화합물 및 그 제조 방법, 그리고 부가 경화형 실리콘 조성물
JP6733241B2 (ja) 2016-03-18 2020-07-29 信越化学工業株式会社 付加硬化性シリコーンゴム組成物、その製造方法及び硬化物
US10954385B2 (en) 2016-10-28 2021-03-23 Shin-Etsu Chemical Co., Ltd. Heat-resistant millable silicone rubber composition
US11987731B2 (en) 2018-08-10 2024-05-21 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
EP3835387A4 (en) 2018-08-10 2022-05-18 Dow Toray Co., Ltd. ORGANOPOLYSILOXANE COMPOSITION FOR FORMING A PRESSURE-SENSITIVE ADHESIVE LAYER AND THEIR USE
CN112673073B (zh) 2018-08-10 2023-01-17 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
JP7618539B2 (ja) * 2018-08-23 2025-01-21 スリーエム イノベイティブ プロパティズ カンパニー 粘着付与及び充填シリコーン接着剤組成物
US20220275251A1 (en) 2019-08-13 2022-09-01 Dow Torayco., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer and use of same
JP7678751B2 (ja) 2019-08-13 2025-05-16 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
US20220275262A1 (en) 2019-08-13 2022-09-01 Dow Toray Co., Ltd. Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof
JP7573028B2 (ja) * 2019-11-25 2024-10-24 ダウ シリコーンズ コーポレーション 難燃性ポリシロキサン組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3712054B2 (ja) * 2001-04-13 2005-11-02 信越化学工業株式会社 固体高分子型燃料電池セパレータ用シール材料
JP4140758B2 (ja) * 2002-08-08 2008-08-27 大日本印刷株式会社 オフセット印刷用ブランケット及びオフセット印刷方法
JP3912525B2 (ja) * 2002-12-12 2007-05-09 信越化学工業株式会社 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Also Published As

Publication number Publication date
TW200641055A (en) 2006-12-01
KR20060092089A (ko) 2006-08-22
JP4525914B2 (ja) 2010-08-18
KR101225391B1 (ko) 2013-01-22
JP2006225420A (ja) 2006-08-31

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