JP4525914B2 - 付加硬化型シリコーンゴム組成物及び粘着ゴムシート - Google Patents

付加硬化型シリコーンゴム組成物及び粘着ゴムシート Download PDF

Info

Publication number
JP4525914B2
JP4525914B2 JP2005037444A JP2005037444A JP4525914B2 JP 4525914 B2 JP4525914 B2 JP 4525914B2 JP 2005037444 A JP2005037444 A JP 2005037444A JP 2005037444 A JP2005037444 A JP 2005037444A JP 4525914 B2 JP4525914 B2 JP 4525914B2
Authority
JP
Japan
Prior art keywords
parts
silicone rubber
mass
sio
addition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005037444A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006225420A (ja
Inventor
典行 廻谷
勉 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2005037444A priority Critical patent/JP4525914B2/ja
Priority to TW095104939A priority patent/TW200641055A/zh
Priority to KR1020060014045A priority patent/KR101225391B1/ko
Publication of JP2006225420A publication Critical patent/JP2006225420A/ja
Application granted granted Critical
Publication of JP4525914B2 publication Critical patent/JP4525914B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2005037444A 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート Expired - Fee Related JP4525914B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005037444A JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート
TW095104939A TW200641055A (en) 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet
KR1020060014045A KR101225391B1 (ko) 2005-02-15 2006-02-14 부가 경화형 실리콘 고무 조성물 및 점착 고무 시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037444A JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Publications (2)

Publication Number Publication Date
JP2006225420A JP2006225420A (ja) 2006-08-31
JP4525914B2 true JP4525914B2 (ja) 2010-08-18

Family

ID=36987076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005037444A Expired - Fee Related JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Country Status (3)

Country Link
JP (1) JP4525914B2 (enrdf_load_stackoverflow)
KR (1) KR101225391B1 (enrdf_load_stackoverflow)
TW (1) TW200641055A (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839780B1 (ko) 2006-01-18 2008-06-19 주식회사 엘지화학 유연성 기판 반송용 점착제
KR100831562B1 (ko) 2006-03-23 2008-05-21 주식회사 엘지화학 유연성 기판 반송용 점착제 조성물
KR100804359B1 (ko) * 2006-12-04 2008-02-15 엘에스전선 주식회사 자동차용 고무호스
JP2008247812A (ja) * 2007-03-30 2008-10-16 Gc Corp シリコーン組成物
JP5243775B2 (ja) * 2007-11-14 2013-07-24 東海ゴム工業株式会社 誘電膜およびそれを用いたアクチュエータ、センサ、トランスデューサ
DE102009011164A1 (de) * 2009-03-04 2010-09-09 Tesa Se Klebeband, insbesondere zur Verklebung von Photovoltaiklaminaten
KR102277649B1 (ko) 2014-01-31 2021-07-16 신에쓰 가가꾸 고교 가부시끼가이샤 오가노폴리실록세인 화합물 및 그 제조 방법, 그리고 부가 경화형 실리콘 조성물
JP6733241B2 (ja) 2016-03-18 2020-07-29 信越化学工業株式会社 付加硬化性シリコーンゴム組成物、その製造方法及び硬化物
US10954385B2 (en) 2016-10-28 2021-03-23 Shin-Etsu Chemical Co., Ltd. Heat-resistant millable silicone rubber composition
US11987731B2 (en) 2018-08-10 2024-05-21 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
EP3835387A4 (en) 2018-08-10 2022-05-18 Dow Toray Co., Ltd. ORGANOPOLYSILOXANE COMPOSITION FOR FORMING A PRESSURE-SENSITIVE ADHESIVE LAYER AND THEIR USE
CN112673073B (zh) 2018-08-10 2023-01-17 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
JP7618539B2 (ja) * 2018-08-23 2025-01-21 スリーエム イノベイティブ プロパティズ カンパニー 粘着付与及び充填シリコーン接着剤組成物
US20220275251A1 (en) 2019-08-13 2022-09-01 Dow Torayco., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer and use of same
JP7678751B2 (ja) 2019-08-13 2025-05-16 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
US20220275262A1 (en) 2019-08-13 2022-09-01 Dow Toray Co., Ltd. Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof
JP7573028B2 (ja) * 2019-11-25 2024-10-24 ダウ シリコーンズ コーポレーション 難燃性ポリシロキサン組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3712054B2 (ja) * 2001-04-13 2005-11-02 信越化学工業株式会社 固体高分子型燃料電池セパレータ用シール材料
JP4140758B2 (ja) * 2002-08-08 2008-08-27 大日本印刷株式会社 オフセット印刷用ブランケット及びオフセット印刷方法
JP3912525B2 (ja) * 2002-12-12 2007-05-09 信越化学工業株式会社 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Also Published As

Publication number Publication date
TWI379870B (enrdf_load_stackoverflow) 2012-12-21
TW200641055A (en) 2006-12-01
KR20060092089A (ko) 2006-08-22
KR101225391B1 (ko) 2013-01-22
JP2006225420A (ja) 2006-08-31

Similar Documents

Publication Publication Date Title
KR101225391B1 (ko) 부가 경화형 실리콘 고무 조성물 및 점착 고무 시트
JP3912525B2 (ja) 付加硬化型シリコーンゴム組成物及び粘着ゴムシート
JP5534837B2 (ja) 熱伝導性シリコーンゴム組成物
JP5627941B2 (ja) 光により架橋可能なシリコーン混合物からシリコーン被覆及びシリコーン成形品を製造する方法
JP4957898B2 (ja) 付加硬化型シリコーンゴム組成物及びその硬化物
CN111148793B (zh) 包含填料的有机硅组合物
JP5856060B2 (ja) ポリシロキサン組成物及びその硬化物
US8895678B2 (en) Cross-linkable silicone composition and cross-linked product thereof
JP4947309B2 (ja) オイルブリード性付加硬化型シリコーンゴム組成物及びその硬化物
KR20090106401A (ko) 실리콘-계 감압성 접착제 조성물 및 접착 테이프
JP5068988B2 (ja) 接着性ポリオルガノシロキサン組成物
JP2013124297A (ja) 硬化性ポリオルガノシロキサン組成物
JP2002322364A (ja) シリコーンゲル組成物
JP2001139818A (ja) 熱伝導性シリコーンゴム組成物
JP6468115B2 (ja) 付加硬化性シリコーンゴム組成物及び硬化物
KR20200134162A (ko) 다이 본딩용 실리콘 조성물, 그의 경화물 및 광반도체 장치
JP2002322363A (ja) シリコーン組成物およびそれから製造されるシリコーン接着剤
JP2019001885A (ja) 自己接着性シリコーンゲル組成物及びその硬化物
JP2009091547A (ja) 付加硬化型シリコーンゴム組成物及びその硬化物並びに架橋剤
CN116685650A (zh) 有机硅弹性体组合物
JP7147966B2 (ja) 自己接着性シリコーンゲル組成物及びその硬化物からなるシリコーンゲル
JP2014224193A (ja) シリコーンゴム組成物の接着方法及び複合成型品
CN114630879B (zh) 聚苯硫醚树脂粘接用聚有机硅氧烷组合物
KR20200008656A (ko) 실리콘 코팅용 조성물
JP2023183384A (ja) 熱伝導性シリコーン組成物および該組成物を使用する熱伝導性部材の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070122

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090128

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090331

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20090331

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090924

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091019

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100512

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130611

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4525914

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100525

LAPS Cancellation because of no payment of annual fees