TWI379369B - - Google Patents

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Publication number
TWI379369B
TWI379369B TW098118028A TW98118028A TWI379369B TW I379369 B TWI379369 B TW I379369B TW 098118028 A TW098118028 A TW 098118028A TW 98118028 A TW98118028 A TW 98118028A TW I379369 B TWI379369 B TW I379369B
Authority
TW
Taiwan
Prior art keywords
wafer
semiconductor
semiconductor wafer
test
stage
Prior art date
Application number
TW098118028A
Other languages
English (en)
Chinese (zh)
Other versions
TW200952106A (en
Inventor
Yoshio Komoto
Yoshiharu Umemura
Yasuo Tokunaga
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200952106A publication Critical patent/TW200952106A/zh
Application granted granted Critical
Publication of TWI379369B publication Critical patent/TWI379369B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098118028A 2008-06-02 2009-06-01 Test system TW200952106A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/060171 WO2009147719A1 (ja) 2008-06-02 2008-06-02 試験システム

Publications (2)

Publication Number Publication Date
TW200952106A TW200952106A (en) 2009-12-16
TWI379369B true TWI379369B (https=) 2012-12-11

Family

ID=41397810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118028A TW200952106A (en) 2008-06-02 2009-06-01 Test system

Country Status (3)

Country Link
JP (1) JP5368440B2 (https=)
TW (1) TW200952106A (https=)
WO (1) WO2009147719A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6308639B1 (ja) * 2017-08-07 2018-04-11 株式会社テクノホロン プロービングステーション
JP6471401B1 (ja) * 2017-10-31 2019-02-20 合同会社Pleson 半導体ウエハーの試験ユニット
CN114779034A (zh) * 2022-04-13 2022-07-22 苏州晶睿半导体科技有限公司 一种基于半导体晶圆的测试设备和map图偏移检测方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105432B2 (ja) * 1986-10-09 1995-11-13 タツモ株式会社 基板の自動位置合せ装置
JPH11274252A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp 半導体装置の検査装置及びその検査方法
JP2000164655A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd アライメント装置及びアライメント方法
JP4423991B2 (ja) * 2003-02-18 2010-03-03 Ｊｓｒ株式会社 異方導電性コネクターおよびプローブ部材並びにウエハ検査装置およびウエハ検査方法
JP4867219B2 (ja) * 2005-07-14 2012-02-01 株式会社デンソー 検査装置及び検査装置の位置決め方法

Also Published As

Publication number Publication date
TW200952106A (en) 2009-12-16
WO2009147719A1 (ja) 2009-12-10
JPWO2009147719A1 (ja) 2011-10-20
JP5368440B2 (ja) 2013-12-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees