TWI375264B - Silicon oxide polishing method utilizing colloidal silica - Google Patents

Silicon oxide polishing method utilizing colloidal silica Download PDF

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Publication number
TWI375264B
TWI375264B TW096115068A TW96115068A TWI375264B TW I375264 B TWI375264 B TW I375264B TW 096115068 A TW096115068 A TW 096115068A TW 96115068 A TW96115068 A TW 96115068A TW I375264 B TWI375264 B TW I375264B
Authority
TW
Taiwan
Prior art keywords
liquid carrier
substrate
polishing
suspended
component
Prior art date
Application number
TW096115068A
Other languages
English (en)
Chinese (zh)
Other versions
TW200807533A (en
Inventor
Benjamin Bayer
Zhan Chen
Jeffrey P Chamberlain
Robert Vacassy
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200807533A publication Critical patent/TW200807533A/zh
Application granted granted Critical
Publication of TWI375264B publication Critical patent/TWI375264B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096115068A 2006-06-29 2007-04-27 Silicon oxide polishing method utilizing colloidal silica TWI375264B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/478,004 US20080220610A1 (en) 2006-06-29 2006-06-29 Silicon oxide polishing method utilizing colloidal silica

Publications (2)

Publication Number Publication Date
TW200807533A TW200807533A (en) 2008-02-01
TWI375264B true TWI375264B (en) 2012-10-21

Family

ID=38894886

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096115068A TWI375264B (en) 2006-06-29 2007-04-27 Silicon oxide polishing method utilizing colloidal silica

Country Status (10)

Country Link
US (1) US20080220610A1 (https=)
EP (1) EP2038916A4 (https=)
JP (1) JP5596344B2 (https=)
KR (1) KR101378259B1 (https=)
CN (1) CN101479836A (https=)
IL (1) IL195699A (https=)
MY (1) MY151925A (https=)
SG (1) SG172740A1 (https=)
TW (1) TWI375264B (https=)
WO (1) WO2008005164A1 (https=)

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Also Published As

Publication number Publication date
US20080220610A1 (en) 2008-09-11
JP2009543337A (ja) 2009-12-03
EP2038916A1 (en) 2009-03-25
SG172740A1 (en) 2011-07-28
JP5596344B2 (ja) 2014-09-24
TW200807533A (en) 2008-02-01
MY151925A (en) 2014-07-31
CN101479836A (zh) 2009-07-08
KR101378259B1 (ko) 2014-03-25
EP2038916A4 (en) 2011-04-13
WO2008005164A1 (en) 2008-01-10
KR20090024195A (ko) 2009-03-06
IL195699A0 (en) 2009-09-01
IL195699A (en) 2014-08-31

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