TWI374173B - - Google Patents

Download PDF

Info

Publication number
TWI374173B
TWI374173B TW94143184A TW94143184A TWI374173B TW I374173 B TWI374173 B TW I374173B TW 94143184 A TW94143184 A TW 94143184A TW 94143184 A TW94143184 A TW 94143184A TW I374173 B TWI374173 B TW I374173B
Authority
TW
Taiwan
Prior art keywords
group
adhesive
component
parts
unit
Prior art date
Application number
TW94143184A
Other languages
English (en)
Chinese (zh)
Other versions
TW200632062A (en
Inventor
Shunji Aoki
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200632062A publication Critical patent/TW200632062A/zh
Application granted granted Critical
Publication of TWI374173B publication Critical patent/TWI374173B/zh

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW094143184A 2004-12-08 2005-12-07 Solvent-free silicone adhesive composition TW200632062A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004355880A JP4761020B2 (ja) 2004-12-08 2004-12-08 無溶剤型シリコーン粘着剤組成物

Publications (2)

Publication Number Publication Date
TW200632062A TW200632062A (en) 2006-09-16
TWI374173B true TWI374173B (enExample) 2012-10-11

Family

ID=36663305

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143184A TW200632062A (en) 2004-12-08 2005-12-07 Solvent-free silicone adhesive composition

Country Status (2)

Country Link
JP (1) JP4761020B2 (enExample)
TW (1) TW200632062A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105102576A (zh) * 2013-04-12 2015-11-25 信越化学工业株式会社 无溶剂型有机硅压敏粘合剂组合物和压敏粘合性物品

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4782046B2 (ja) * 2007-03-05 2011-09-28 信越化学工業株式会社 フィルム用無溶剤型シリコーン剥離剤組成物及びそれを用いてなる剥離フィルム
TWI440682B (zh) * 2007-03-30 2014-06-11 Shinetsu Chemical Co 無溶劑型聚矽氧感壓接著劑組成物
JP5060873B2 (ja) * 2007-08-24 2012-10-31 東レ・ダウコーニング株式会社 シリコーン系感圧接着剤組成物および感圧接着テープもしくはシート
JP5292835B2 (ja) * 2008-02-01 2013-09-18 大日本印刷株式会社 サインフィルム
JP5234064B2 (ja) 2010-08-23 2013-07-10 信越化学工業株式会社 無溶剤型付加型シリコーン粘着剤組成物及び粘着性物品
KR101267776B1 (ko) * 2010-11-10 2013-05-24 (주)엘지하우시스 재박리성 및 상용성이 우수한 윈도우 필름용 실리콘계 점착제 조성물 및 이를 이용한 윈도우 필름
JP6024638B2 (ja) * 2013-10-10 2016-11-16 信越化学工業株式会社 シリコーン粘着剤組成物、密着向上剤の製造方法及び粘着性物品
WO2017065131A1 (ja) * 2015-10-14 2017-04-20 信越化学工業株式会社 衝撃吸収性画面保護フィルム
JP6657037B2 (ja) * 2015-12-22 2020-03-04 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物および半導体装置
EP3184589B1 (en) 2015-12-22 2019-05-01 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone resin composition and a semiconductor device
US11059971B2 (en) * 2017-09-29 2021-07-13 Dow Silicones Corporation Thermally conductive composition
GB2574440A (en) * 2018-06-06 2019-12-11 Advanced Insulation Ltd Tie coat
US20210246337A1 (en) * 2018-06-29 2021-08-12 Dow Silicones Corporation Solventless silicone pressure sensitive adhesive and methods for making and using same
WO2020121939A1 (ja) * 2018-12-13 2020-06-18 ダウ・東レ株式会社 シリコーン感圧接着剤組成物およびその用途
US12129407B2 (en) 2018-12-13 2024-10-29 Dow Silicones Corporation Silicone adhesive composition and use thereof
EP4268980A4 (en) 2020-12-25 2024-11-20 Dow Toray Co., Ltd. Silicone adhesive composition and use thereof
CN119684965B (zh) * 2024-12-13 2025-11-11 江苏皇冠新材料科技有限公司 可用于纸基涂布的有机硅压敏胶组合物、压敏胶及其制品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082706A (en) * 1988-11-23 1992-01-21 Dow Corning Corporation Pressure sensitive adhesive/release liner laminate
US5292586A (en) * 1991-03-26 1994-03-08 General Electric Company Solventless or high solids-containing silicone pressure sensitive adhesive compositions
JP2734809B2 (ja) * 1991-05-09 1998-04-02 信越化学工業株式会社 シリコーン粘着剤組成物
US5357007A (en) * 1993-03-12 1994-10-18 General Electric Company Method for making a solventless silicone pressure sensitive adhesive composition and product
JP2002285129A (ja) * 2001-03-23 2002-10-03 Shin Etsu Chem Co Ltd シリコーン感圧接着剤組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105102576A (zh) * 2013-04-12 2015-11-25 信越化学工业株式会社 无溶剂型有机硅压敏粘合剂组合物和压敏粘合性物品

Also Published As

Publication number Publication date
TW200632062A (en) 2006-09-16
JP2006160923A (ja) 2006-06-22
JP4761020B2 (ja) 2011-08-31

Similar Documents

Publication Publication Date Title
TWI374173B (enExample)
JP5130995B2 (ja) 無溶剤型シリコーン粘着剤組成物
KR101124996B1 (ko) 실리콘계 감압성 접착제 및 접착제 테이프
KR101628388B1 (ko) 부가 반응 경화형 실리콘 점착제 조성물 및 점착 테이프
JP7116045B2 (ja) シリコーン系粘着材の製造方法
TW201005039A (en) Low-viscosity ultraviolet-curable silicone composition for release paper
KR102553390B1 (ko) 압력에 민감한 접착제 조성물 및 그것을 준비하기 위한 제조 방법과 유연한 유기 발광 다이오드 애플리케이션에서의 사용
JP2002285129A (ja) シリコーン感圧接着剤組成物
JP2002275450A (ja) シリコーン系感圧接着剤組成物およびそれを用いた感圧接着テープ
EP1783186A2 (en) Solvent-free silicone composition for release paper
JP4648011B2 (ja) 芳香族溶剤を含まないシリコーン粘着剤組成物およびそれを塗工した粘着テープ、シートまたはラベル
TWI746828B (zh) 聚矽氧黏著劑用底漆組成物及物品
JP2010184953A (ja) シリコーン粘着テープ及びその製造方法
JP2002371261A (ja) 紫外線硬化型シリコーン粘着剤組成物
WO2020090781A1 (ja) シリコーン粘着剤組成物の製造方法
JP2004307653A (ja) シリコーン粘着剤用プライマー組成物
JP2004231900A (ja) シリコーン系感圧接着剤および感圧接着性フィルム
JP7003479B2 (ja) 基材付き粘着テープ
KR102853650B1 (ko) 실리콘점착제용 프라이머 조성물
JP2000080345A (ja) シリコーン系感圧接着剤、および粘着材
KR20240139602A (ko) 감압성 접착제 조성물, 이의 제조 방법 및 플렉시블 유기 발광 다이오드 응용에서의 이의 용도
WO2021171734A1 (ja) シリコーン粘着剤組成物
TW200535206A (en) Silicone-based pressure-sensitive adhesive and adhesive tape

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees