JP4761020B2 - 無溶剤型シリコーン粘着剤組成物 - Google Patents
無溶剤型シリコーン粘着剤組成物 Download PDFInfo
- Publication number
- JP4761020B2 JP4761020B2 JP2004355880A JP2004355880A JP4761020B2 JP 4761020 B2 JP4761020 B2 JP 4761020B2 JP 2004355880 A JP2004355880 A JP 2004355880A JP 2004355880 A JP2004355880 A JP 2004355880A JP 4761020 B2 JP4761020 B2 JP 4761020B2
- Authority
- JP
- Japan
- Prior art keywords
- sio
- group
- component
- adhesive
- integer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004355880A JP4761020B2 (ja) | 2004-12-08 | 2004-12-08 | 無溶剤型シリコーン粘着剤組成物 |
| TW094143184A TW200632062A (en) | 2004-12-08 | 2005-12-07 | Solvent-free silicone adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004355880A JP4761020B2 (ja) | 2004-12-08 | 2004-12-08 | 無溶剤型シリコーン粘着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006160923A JP2006160923A (ja) | 2006-06-22 |
| JP4761020B2 true JP4761020B2 (ja) | 2011-08-31 |
Family
ID=36663305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004355880A Expired - Fee Related JP4761020B2 (ja) | 2004-12-08 | 2004-12-08 | 無溶剤型シリコーン粘着剤組成物 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4761020B2 (enExample) |
| TW (1) | TW200632062A (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4782046B2 (ja) * | 2007-03-05 | 2011-09-28 | 信越化学工業株式会社 | フィルム用無溶剤型シリコーン剥離剤組成物及びそれを用いてなる剥離フィルム |
| TWI440682B (zh) * | 2007-03-30 | 2014-06-11 | Shinetsu Chemical Co | 無溶劑型聚矽氧感壓接著劑組成物 |
| JP5060873B2 (ja) * | 2007-08-24 | 2012-10-31 | 東レ・ダウコーニング株式会社 | シリコーン系感圧接着剤組成物および感圧接着テープもしくはシート |
| JP5292835B2 (ja) * | 2008-02-01 | 2013-09-18 | 大日本印刷株式会社 | サインフィルム |
| JP5234064B2 (ja) | 2010-08-23 | 2013-07-10 | 信越化学工業株式会社 | 無溶剤型付加型シリコーン粘着剤組成物及び粘着性物品 |
| KR101267776B1 (ko) * | 2010-11-10 | 2013-05-24 | (주)엘지하우시스 | 재박리성 및 상용성이 우수한 윈도우 필름용 실리콘계 점착제 조성물 및 이를 이용한 윈도우 필름 |
| JP2014205762A (ja) * | 2013-04-12 | 2014-10-30 | 信越化学工業株式会社 | 無溶剤型シリコーン粘着剤組成物及び粘着性物品 |
| JP6024638B2 (ja) * | 2013-10-10 | 2016-11-16 | 信越化学工業株式会社 | シリコーン粘着剤組成物、密着向上剤の製造方法及び粘着性物品 |
| WO2017065131A1 (ja) * | 2015-10-14 | 2017-04-20 | 信越化学工業株式会社 | 衝撃吸収性画面保護フィルム |
| JP6657037B2 (ja) * | 2015-12-22 | 2020-03-04 | 信越化学工業株式会社 | 付加硬化性シリコーン樹脂組成物および半導体装置 |
| EP3184589B1 (en) | 2015-12-22 | 2019-05-01 | Shin-Etsu Chemical Co., Ltd. | Addition-curable silicone resin composition and a semiconductor device |
| US11059971B2 (en) * | 2017-09-29 | 2021-07-13 | Dow Silicones Corporation | Thermally conductive composition |
| GB2574440A (en) * | 2018-06-06 | 2019-12-11 | Advanced Insulation Ltd | Tie coat |
| US20210246337A1 (en) * | 2018-06-29 | 2021-08-12 | Dow Silicones Corporation | Solventless silicone pressure sensitive adhesive and methods for making and using same |
| WO2020121939A1 (ja) * | 2018-12-13 | 2020-06-18 | ダウ・東レ株式会社 | シリコーン感圧接着剤組成物およびその用途 |
| US12129407B2 (en) | 2018-12-13 | 2024-10-29 | Dow Silicones Corporation | Silicone adhesive composition and use thereof |
| EP4268980A4 (en) | 2020-12-25 | 2024-11-20 | Dow Toray Co., Ltd. | Silicone adhesive composition and use thereof |
| CN119684965B (zh) * | 2024-12-13 | 2025-11-11 | 江苏皇冠新材料科技有限公司 | 可用于纸基涂布的有机硅压敏胶组合物、压敏胶及其制品 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5082706A (en) * | 1988-11-23 | 1992-01-21 | Dow Corning Corporation | Pressure sensitive adhesive/release liner laminate |
| US5292586A (en) * | 1991-03-26 | 1994-03-08 | General Electric Company | Solventless or high solids-containing silicone pressure sensitive adhesive compositions |
| JP2734809B2 (ja) * | 1991-05-09 | 1998-04-02 | 信越化学工業株式会社 | シリコーン粘着剤組成物 |
| US5357007A (en) * | 1993-03-12 | 1994-10-18 | General Electric Company | Method for making a solventless silicone pressure sensitive adhesive composition and product |
| JP2002285129A (ja) * | 2001-03-23 | 2002-10-03 | Shin Etsu Chem Co Ltd | シリコーン感圧接着剤組成物 |
-
2004
- 2004-12-08 JP JP2004355880A patent/JP4761020B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-07 TW TW094143184A patent/TW200632062A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200632062A (en) | 2006-09-16 |
| TWI374173B (enExample) | 2012-10-11 |
| JP2006160923A (ja) | 2006-06-22 |
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