TWI373813B - - Google Patents

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Publication number
TWI373813B
TWI373813B TW097131735A TW97131735A TWI373813B TW I373813 B TWI373813 B TW I373813B TW 097131735 A TW097131735 A TW 097131735A TW 97131735 A TW97131735 A TW 97131735A TW I373813 B TWI373813 B TW I373813B
Authority
TW
Taiwan
Prior art keywords
acf
substrate
blade
conductive film
pressing
Prior art date
Application number
TW097131735A
Other languages
English (en)
Chinese (zh)
Other versions
TW200926324A (en
Inventor
Hideki Nomoto
Jun Onoshiro
Hitoshi Yonezawa
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TW200926324A publication Critical patent/TW200926324A/zh
Application granted granted Critical
Publication of TWI373813B publication Critical patent/TWI373813B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
TW097131735A 2007-08-21 2008-08-20 ACF paste device and flat panel display TW200926324A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007214893 2007-08-21

Publications (2)

Publication Number Publication Date
TW200926324A TW200926324A (en) 2009-06-16
TWI373813B true TWI373813B (ja) 2012-10-01

Family

ID=40493689

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097131735A TW200926324A (en) 2007-08-21 2008-08-20 ACF paste device and flat panel display

Country Status (4)

Country Link
JP (3) JP4392766B2 (ja)
KR (1) KR101011178B1 (ja)
CN (2) CN101916001B (ja)
TW (1) TW200926324A (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101710573B (zh) * 2009-09-30 2011-05-25 日东电子科技(深圳)有限公司 Cog芯片预校准夹持装置
CN101714500B (zh) * 2009-09-30 2012-02-01 日东电子科技(深圳)有限公司 Cog芯片倒装键合装置
KR101220316B1 (ko) * 2010-07-28 2013-01-09 현정 주식회사 필름 융착장치
WO2013183507A1 (ja) * 2012-06-06 2013-12-12 シャープ株式会社 部品圧着装置
KR102138746B1 (ko) * 2013-05-15 2020-07-29 삼성디스플레이 주식회사 필름 처리 장치 및 이를 이용한 필름 처리 방법
CN104914595B (zh) * 2014-03-10 2018-01-09 旭东机械工业股份有限公司 基板压制机构
KR101604069B1 (ko) * 2015-10-06 2016-03-16 주식회사 씨앤와이테크 다층 시트 부재용 프레스 가공 장치
CN105751270A (zh) * 2016-03-25 2016-07-13 深圳市华星光电技术有限公司 Acf贴附设备及其切割装置
JP6970869B2 (ja) * 2017-09-04 2021-11-24 パナソニックＩｐマネジメント株式会社 テープ貼着装置およびテープ貼着方法
US20200411466A1 (en) * 2018-03-12 2020-12-31 Sakai Display Products Corporation Thermocompression bonding device
KR102122427B1 (ko) * 2019-01-09 2020-06-12 한국미쯔보시다이아몬드공업(주) 단재 제거 장치
CN112550876A (zh) * 2020-09-17 2021-03-26 深圳市联得自动化装备股份有限公司 自动贴膜装置及贴膜方法
CN113900291B (zh) 2021-08-17 2022-08-16 江苏特丽亮镀膜科技有限公司 一种用于acf胶膜联结结构的制作设备及其制作工艺
CN113795086B (zh) * 2021-10-19 2023-04-14 重庆新固兴科技有限公司 双面假贴机

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206331B2 (ja) * 1994-10-06 2001-09-10 松下電器産業株式会社 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
JP3484896B2 (ja) 1996-10-04 2004-01-06 セイコーエプソン株式会社 液晶パネルの基板への接着用テープの貼付方法及びその装置
JP3909816B2 (ja) * 2001-10-31 2007-04-25 オプトレックス株式会社 液晶表示パネルへの回路部品接続装置
JP4037649B2 (ja) 2001-12-28 2008-01-23 松下電器産業株式会社 加圧装置
JP2003057681A (ja) * 2002-07-22 2003-02-26 Seiko Epson Corp 液晶パネルの基板への接着用テープの貼付方法
CN2606369Y (zh) * 2003-04-07 2004-03-10 深圳深辉技术有限公司 液晶显示器模块
KR100633159B1 (ko) * 2004-11-26 2006-10-11 삼성전자주식회사 Ａｃｆ공급장치
CN100452276C (zh) * 2005-03-14 2009-01-14 四川世纪双虹显示器件有限公司 等离子体显示器的制造方法
JP4632037B2 (ja) * 2005-04-01 2011-02-16 株式会社日立ハイテクノロジーズ 熱圧着装置及び半導体装置の搭載装置
JP4539856B2 (ja) 2005-08-25 2010-09-08 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け方法及びａｃｆ貼り付け装置
JP2007123344A (ja) * 2005-10-25 2007-05-17 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
JP4818008B2 (ja) * 2006-07-20 2011-11-16 株式会社東芝 異方導電性テープの貼着装置および電気機器の製造方法
JP2008153595A (ja) * 2006-12-20 2008-07-03 Shibaura Mechatronics Corp 配線基板の検査装置及び配線基板の検査方法、異方性導電体貼付装置及び異方性導電体貼付方法
JP4370341B2 (ja) * 2007-03-29 2009-11-25 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
JP5096835B2 (ja) * 2007-08-21 2012-12-12 株式会社日立ハイテクノロジーズ Ａｃｆ貼付け装置及びフラットパネルディスプレイの製造装置

Also Published As

Publication number Publication date
JP4392766B2 (ja) 2010-01-06
CN101393332B (zh) 2010-09-15
JP4501036B2 (ja) 2010-07-14
JP2009276775A (ja) 2009-11-26
JP2009071282A (ja) 2009-04-02
TW200926324A (en) 2009-06-16
CN101916001A (zh) 2010-12-15
KR101011178B1 (ko) 2011-01-26
CN101916001B (zh) 2012-10-10
JP4453849B2 (ja) 2010-04-21
JP2010004051A (ja) 2010-01-07
KR20090019738A (ko) 2009-02-25
CN101393332A (zh) 2009-03-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees