CN101916001B - Acf粘贴方法以及acf粘贴装置 - Google Patents

Acf粘贴方法以及acf粘贴装置 Download PDF

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Publication number
CN101916001B
CN101916001B CN2010102473622A CN201010247362A CN101916001B CN 101916001 B CN101916001 B CN 101916001B CN 2010102473622 A CN2010102473622 A CN 2010102473622A CN 201010247362 A CN201010247362 A CN 201010247362A CN 101916001 B CN101916001 B CN 101916001B
Authority
CN
China
Prior art keywords
acf
sword
substrate
pressurization
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010102473622A
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English (en)
Chinese (zh)
Other versions
CN101916001A (zh
Inventor
野本秀树
斧城淳
米泽仁志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
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Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN101916001A publication Critical patent/CN101916001A/zh
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Publication of CN101916001B publication Critical patent/CN101916001B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
CN2010102473622A 2007-08-21 2008-08-21 Acf粘贴方法以及acf粘贴装置 Expired - Fee Related CN101916001B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007214893 2007-08-21
JP2007-214893 2007-08-21

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2008102142336A Division CN101393332B (zh) 2007-08-21 2008-08-21 Acf粘贴装置以及平板显示装置

Publications (2)

Publication Number Publication Date
CN101916001A CN101916001A (zh) 2010-12-15
CN101916001B true CN101916001B (zh) 2012-10-10

Family

ID=40493689

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008102142336A Expired - Fee Related CN101393332B (zh) 2007-08-21 2008-08-21 Acf粘贴装置以及平板显示装置
CN2010102473622A Expired - Fee Related CN101916001B (zh) 2007-08-21 2008-08-21 Acf粘贴方法以及acf粘贴装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN2008102142336A Expired - Fee Related CN101393332B (zh) 2007-08-21 2008-08-21 Acf粘贴装置以及平板显示装置

Country Status (4)

Country Link
JP (3) JP4392766B2 (ja)
KR (1) KR101011178B1 (ja)
CN (2) CN101393332B (ja)
TW (1) TW200926324A (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101714500B (zh) * 2009-09-30 2012-02-01 日东电子科技(深圳)有限公司 Cog芯片倒装键合装置
CN101710573B (zh) * 2009-09-30 2011-05-25 日东电子科技(深圳)有限公司 Cog芯片预校准夹持装置
KR101220316B1 (ko) * 2010-07-28 2013-01-09 현정 주식회사 필름 융착장치
CN104246998A (zh) * 2012-06-06 2014-12-24 夏普株式会社 部件压接装置
KR102138746B1 (ko) * 2013-05-15 2020-07-29 삼성디스플레이 주식회사 필름 처리 장치 및 이를 이용한 필름 처리 방법
CN104914595B (zh) * 2014-03-10 2018-01-09 旭东机械工业股份有限公司 基板压制机构
KR101604069B1 (ko) * 2015-10-06 2016-03-16 주식회사 씨앤와이테크 다층 시트 부재용 프레스 가공 장치
CN105751270A (zh) * 2016-03-25 2016-07-13 深圳市华星光电技术有限公司 Acf贴附设备及其切割装置
JP6970869B2 (ja) * 2017-09-04 2021-11-24 パナソニックＩｐマネジメント株式会社 テープ貼着装置およびテープ貼着方法
US20200411466A1 (en) * 2018-03-12 2020-12-31 Sakai Display Products Corporation Thermocompression bonding device
KR102122427B1 (ko) * 2019-01-09 2020-06-12 한국미쯔보시다이아몬드공업(주) 단재 제거 장치
CN112550876A (zh) * 2020-09-17 2021-03-26 深圳市联得自动化装备股份有限公司 自动贴膜装置及贴膜方法
CN113900291B (zh) * 2021-08-17 2022-08-16 江苏特丽亮镀膜科技有限公司 一种用于acf胶膜联结结构的制作设备及其制作工艺
CN113795086B (zh) * 2021-10-19 2023-04-14 重庆新固兴科技有限公司 双面假贴机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209886A (zh) * 1996-10-04 1999-03-03 精工爱普生株式会社 液晶屏的粘接用带的粘着方法及其装置
CN1779539A (zh) * 2004-11-26 2006-05-31 三星电子株式会社 Acf供给装置
JP2007057957A (ja) * 2005-08-25 2007-03-08 Hitachi High-Technologies Corp Ａｃｆ貼り付け方法及びａｃｆ貼り付け装置
JP2007123344A (ja) * 2005-10-25 2007-05-17 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206331B2 (ja) * 1994-10-06 2001-09-10 松下電器産業株式会社 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
JP3909816B2 (ja) * 2001-10-31 2007-04-25 オプトレックス株式会社 液晶表示パネルへの回路部品接続装置
JP4037649B2 (ja) 2001-12-28 2008-01-23 松下電器産業株式会社 加圧装置
JP2003057681A (ja) * 2002-07-22 2003-02-26 Seiko Epson Corp 液晶パネルの基板への接着用テープの貼付方法
CN2606369Y (zh) * 2003-04-07 2004-03-10 深圳深辉技术有限公司 液晶显示器模块
CN100452276C (zh) * 2005-03-14 2009-01-14 四川世纪双虹显示器件有限公司 等离子体显示器的制造方法
JP4632037B2 (ja) * 2005-04-01 2011-02-16 株式会社日立ハイテクノロジーズ 熱圧着装置及び半導体装置の搭載装置
JP4818008B2 (ja) * 2006-07-20 2011-11-16 株式会社東芝 異方導電性テープの貼着装置および電気機器の製造方法
JP2008153595A (ja) * 2006-12-20 2008-07-03 Shibaura Mechatronics Corp 配線基板の検査装置及び配線基板の検査方法、異方性導電体貼付装置及び異方性導電体貼付方法
JP4370341B2 (ja) * 2007-03-29 2009-11-25 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
JP5096835B2 (ja) * 2007-08-21 2012-12-12 株式会社日立ハイテクノロジーズ Ａｃｆ貼付け装置及びフラットパネルディスプレイの製造装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209886A (zh) * 1996-10-04 1999-03-03 精工爱普生株式会社 液晶屏的粘接用带的粘着方法及其装置
CN1779539A (zh) * 2004-11-26 2006-05-31 三星电子株式会社 Acf供给装置
JP2007057957A (ja) * 2005-08-25 2007-03-08 Hitachi High-Technologies Corp Ａｃｆ貼り付け方法及びａｃｆ貼り付け装置
JP2007123344A (ja) * 2005-10-25 2007-05-17 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置

Also Published As

Publication number Publication date
JP2009071282A (ja) 2009-04-02
JP4392766B2 (ja) 2010-01-06
CN101393332A (zh) 2009-03-25
JP4501036B2 (ja) 2010-07-14
TWI373813B (ja) 2012-10-01
KR20090019738A (ko) 2009-02-25
JP2009276775A (ja) 2009-11-26
CN101916001A (zh) 2010-12-15
TW200926324A (en) 2009-06-16
JP4453849B2 (ja) 2010-04-21
KR101011178B1 (ko) 2011-01-26
CN101393332B (zh) 2010-09-15
JP2010004051A (ja) 2010-01-07

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