TWI373626B - - Google Patents
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- Publication number
- TWI373626B TWI373626B TW097113779A TW97113779A TWI373626B TW I373626 B TWI373626 B TW I373626B TW 097113779 A TW097113779 A TW 097113779A TW 97113779 A TW97113779 A TW 97113779A TW I373626 B TWI373626 B TW I373626B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- tested
- test
- contact
- contact arm
- Prior art date
Links
- 238000012360 testing method Methods 0.000 claims description 154
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 2
- 238000010998 test method Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 description 46
- 230000032258 transport Effects 0.000 description 37
- 238000012546 transfer Methods 0.000 description 23
- 238000007664 blowing Methods 0.000 description 18
- 230000008646 thermal stress Effects 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 241001416181 Axis axis Species 0.000 description 1
- 208000036829 Device dislocation Diseases 0.000 description 1
- 241000237502 Ostreidae Species 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003708 ampul Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 235000020636 oyster Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000013102 re-test Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/060212 WO2008142754A1 (ja) | 2007-05-18 | 2007-05-18 | 電子部品試験装置及び電子部品試験方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200900711A TW200900711A (en) | 2009-01-01 |
| TWI373626B true TWI373626B (enrdf_load_stackoverflow) | 2012-10-01 |
Family
ID=40031481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097113779A TW200900711A (en) | 2007-05-18 | 2008-04-16 | Electronic component testing device and electronic component testing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2008142754A1 (enrdf_load_stackoverflow) |
| TW (1) | TW200900711A (enrdf_load_stackoverflow) |
| WO (1) | WO2008142754A1 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401766B (zh) * | 2009-03-23 | 2013-07-11 | Evertechno Co Ltd | 試驗處理機及其零件移送方法 |
| TWI414798B (zh) * | 2010-05-21 | 2013-11-11 | Hon Tech Inc | 可執行冷測／熱測之電子元件測試分類機 |
| JP2013024829A (ja) * | 2011-07-26 | 2013-02-04 | Seiko Epson Corp | 電子部品搬送装置及び電子部品搬送方法 |
| JP5942459B2 (ja) * | 2012-02-14 | 2016-06-29 | セイコーエプソン株式会社 | ハンドラー、及び部品検査装置 |
| KR102270760B1 (ko) * | 2019-11-29 | 2021-06-30 | 에이엠티 주식회사 | 미세 피치를 갖는 디바이스의 테스트장치 |
| TWI769664B (zh) * | 2021-01-15 | 2022-07-01 | 鴻勁精密股份有限公司 | 測試裝置及其應用之測試設備 |
| CN113326167B (zh) * | 2021-05-13 | 2022-07-08 | 山东英信计算机技术有限公司 | 基于基板管理控制器通信的定温可调测试器和测试方法 |
| TWI787919B (zh) * | 2021-07-23 | 2022-12-21 | 致茂電子股份有限公司 | 多層架構之供料和分料裝置及具備該裝置之電子元件檢測設備 |
| US11740283B2 (en) | 2021-07-23 | 2023-08-29 | Chroma Ate Inc. | Multistory electronic device testing apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62127677A (ja) * | 1985-11-29 | 1987-06-09 | Ando Electric Co Ltd | 部品の温度試験装置 |
| JPH0333023Y2 (enrdf_load_stackoverflow) * | 1986-01-24 | 1991-07-12 | ||
| JPH1164437A (ja) * | 1997-08-22 | 1999-03-05 | Ando Electric Co Ltd | Ｉｃ加熱装置 |
| JP4458447B2 (ja) * | 2000-11-10 | 2010-04-28 | 株式会社アドバンテスト | 電子部品試験用保持装置、電子部品試験装置および電子部品試験方法 |
-
2007
- 2007-05-18 WO PCT/JP2007/060212 patent/WO2008142754A1/ja active Application Filing
- 2007-05-18 JP JP2009515024A patent/JPWO2008142754A1/ja active Pending
-
2008
- 2008-04-16 TW TW097113779A patent/TW200900711A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2008142754A1 (ja) | 2010-08-05 |
| TW200900711A (en) | 2009-01-01 |
| WO2008142754A1 (ja) | 2008-11-27 |
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