TWI370527B - - Google Patents

Info

Publication number
TWI370527B
TWI370527B TW099140147A TW99140147A TWI370527B TW I370527 B TWI370527 B TW I370527B TW 099140147 A TW099140147 A TW 099140147A TW 99140147 A TW99140147 A TW 99140147A TW I370527 B TWI370527 B TW I370527B
Authority
TW
Taiwan
Application number
TW099140147A
Other languages
Chinese (zh)
Other versions
TW201113989A (en
Inventor
Kasezawa Yoshimasa
Hisashi Hori
Hino Harumichi
Tanaka Tsunehiko
Takeshi Yoshida
Original Assignee
Nippon Light Metal Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Co filed Critical Nippon Light Metal Co
Publication of TW201113989A publication Critical patent/TW201113989A/en
Application granted granted Critical
Publication of TWI370527B publication Critical patent/TWI370527B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
TW099140147A 2005-04-21 2006-04-20 Liquid-cooled jacket TW201113989A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005123403 2005-04-21

Publications (2)

Publication Number Publication Date
TW201113989A TW201113989A (en) 2011-04-16
TWI370527B true TWI370527B (en) 2012-08-11

Family

ID=37214696

Family Applications (3)

Application Number Title Priority Date Filing Date
TW099140146A TW201113988A (en) 2005-04-21 2006-04-20 Liquid-cooled jacket
TW099140147A TW201113989A (en) 2005-04-21 2006-04-20 Liquid-cooled jacket
TW095114120A TW200644199A (en) 2005-04-21 2006-04-20 Liquid-cooled jacket

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW099140146A TW201113988A (en) 2005-04-21 2006-04-20 Liquid-cooled jacket

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095114120A TW200644199A (en) 2005-04-21 2006-04-20 Liquid-cooled jacket

Country Status (5)

Country Link
US (1) US20090065178A1 (en)
JP (2) JP5423638B2 (en)
CN (1) CN100543975C (en)
TW (3) TW201113988A (en)
WO (1) WO2006115073A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624324B (en) * 2014-11-05 2018-05-21 Nippon Light Metal Co Method for manufacturing liquid-cooled jacket and liquid-cooled jacket

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JP5496279B2 (en) * 2012-07-25 2014-05-21 株式会社放熱器のオーエス Heat exchanger and manufacturing method thereof
CN102790025B (en) * 2012-08-27 2016-03-30 无锡市福曼科技有限公司 The multiple flow passages water-cooling structure of computer CPU
CN102790027B (en) * 2012-08-27 2016-03-30 无锡市福曼科技有限公司 The multiple flow passages water cooling plant of computer CPU
JPWO2014045766A1 (en) * 2012-09-19 2016-08-18 富士電機株式会社 Semiconductor device and manufacturing method of semiconductor device
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JPWO2014185088A1 (en) * 2013-05-17 2017-02-23 富士通株式会社 Semiconductor device, method for manufacturing the same, and electronic device
CN103365385A (en) * 2013-07-10 2013-10-23 北京百度网讯科技有限公司 Server component for complete cabinet and complete cabinet employing same
CN103402344A (en) * 2013-08-08 2013-11-20 安徽巨一自动化装备有限公司 Water channel structure of water-cooled heat sink of high-power electronic component
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JP6164304B2 (en) * 2013-11-28 2017-07-19 富士電機株式会社 Manufacturing method of semiconductor module cooler, semiconductor module cooler, semiconductor module, and electrically driven vehicle
CN103796492B (en) * 2014-01-25 2017-01-18 清华大学 Heat collecting end using lotus root-shaped cellular material microchannel module
JP2015175542A (en) * 2014-03-14 2015-10-05 パナソニックＩｐマネジメント株式会社 Cooling device
JP6238800B2 (en) * 2014-03-17 2017-11-29 株式会社フジクラ Cooling structure
WO2015178064A1 (en) * 2014-05-20 2015-11-26 富士電機株式会社 Semiconductor module cooler and method for manufacturing same
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WO2016013072A1 (en) * 2014-07-23 2016-01-28 日本軽金属株式会社 Radiator
JP6378960B2 (en) * 2014-07-29 2018-08-22 株式会社キーレックス Press machine
WO2016021565A1 (en) * 2014-08-06 2016-02-11 富士電機株式会社 Semiconductor device
CN105636402B (en) * 2014-10-28 2018-01-09 奇瑞新能源汽车技术有限公司 A kind of water-cooling radiating structure of motor and electric machine controller
JP6372515B2 (en) * 2015-08-26 2018-08-15 日本軽金属株式会社 Liquid cooling jacket manufacturing method and liquid cooling jacket
JP6489219B2 (en) 2015-08-26 2019-03-27 日本軽金属株式会社 Joining method, liquid cooling jacket manufacturing method, and liquid cooling jacket
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JP2017195226A (en) * 2016-04-18 2017-10-26 昭和電工株式会社 Liquid-cooled type cooling device
CN107768333B (en) * 2016-08-23 2019-11-29 湖南中车时代电动汽车股份有限公司 Electric machine controller radiator
SI3290822T1 (en) * 2016-08-30 2020-07-31 Alfa Laval Corporate Ab Plate heat exchanger for solar heating
TWI635248B (en) 2016-09-02 2018-09-11 宏碁股份有限公司 Evaporator and manufacturing method thereof
CN107801351B (en) * 2016-09-05 2023-08-01 宏碁股份有限公司 Evaporator and manufacturing method thereof
CN206089440U (en) * 2016-09-14 2017-04-12 深圳市力沣实业有限公司 Heat radiation structure and have this heat radiation structure's three -dimensional forming and hot -pressing system of glass
US10139168B2 (en) * 2016-09-26 2018-11-27 International Business Machines Corporation Cold plate with radial expanding channels for two-phase cooling
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US11794271B2 (en) * 2018-07-19 2023-10-24 Nippon Light Metal Company, Ltd. Method for manufacturing liquid-cooled jacket
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JP7367394B2 (en) 2018-11-22 2023-10-24 富士電機株式会社 Semiconductor module, vehicle and manufacturing method
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
TWI624324B (en) * 2014-11-05 2018-05-21 Nippon Light Metal Co Method for manufacturing liquid-cooled jacket and liquid-cooled jacket
US10471557B2 (en) 2014-11-05 2019-11-12 Nippon Light Metal Company, Ltd. Method of manufacturing liquid-cooled jacket and liquid-cooled jacket

Also Published As

Publication number Publication date
TWI355049B (en) 2011-12-21
JP5423638B2 (en) 2014-02-19
TW201113988A (en) 2011-04-16
US20090065178A1 (en) 2009-03-12
CN100543975C (en) 2009-09-23
JP2011040778A (en) 2011-02-24
CN101167184A (en) 2008-04-23
JP5423637B2 (en) 2014-02-19
TW200644199A (en) 2006-12-16
JP2011018940A (en) 2011-01-27
TW201113989A (en) 2011-04-16
WO2006115073A1 (en) 2006-11-02

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