CN102790027B - The multiple flow passages water cooling plant of computer CPU - Google Patents
The multiple flow passages water cooling plant of computer CPU Download PDFInfo
- Publication number
- CN102790027B CN102790027B CN201210307359.4A CN201210307359A CN102790027B CN 102790027 B CN102790027 B CN 102790027B CN 201210307359 A CN201210307359 A CN 201210307359A CN 102790027 B CN102790027 B CN 102790027B
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- China
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- micro
- top cover
- flow distribution
- cover plate
- cutting coldplate
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The multiple flow passages water cooling plant of computer CPU of the present invention, the temperature of heater members can drop to lower than ambient temperature by it, and it can be applicable to various environment occasion, and the scope of application is large, and its quiet noiselessness.It comprises top cover plate, micro-cutting coldplate, the upper surface of described top cover plate is provided with delivery port, water inlet, described top cover plate mounts cover in described micro-cutting coldplate, it is characterized in that: in the cavity that described top cover plate, micro-cutting coldplate are formed, be provided with injection flow distribution plate, described injection flow distribution plate has at least four parallel runner notches, and described water inlet is communicated to parallel described runner notch along the upper surface of described injection flow distribution plate.
Description
Technical field
The present invention relates to the cooling technology field of computer CPU, be specially the multiple flow passages water cooling plant of computer CPU.
Background technology
Current computer CPU cooling, air-cooled and these the two kinds of modes of water-cooled of general employing, along with the development of video card process chip, its caloric value produced in the course of the work constantly promotes, in order to ensure that good heat dispersion and video card normally work, it is air-cooled must adopt high rotating speed fan cooled, and high rotating speed fan brings huge noise and vibrations, makes people vexed.And existing cooling by water mode, temperature can only be reduced at most ambient temperature by its water cooling module cooling effect, and it is unsuitable in the higher application scenario of ambient temperature, and its scope of application is little.
Summary of the invention
For the problems referred to above, the invention provides the multiple flow passages water cooling plant of computer CPU, it can the temperature of just heater members drop to lower than ambient temperature, and it can be applicable to various environment occasion, and the scope of application is large, and its quiet noiselessness.
The multiple flow passages water cooling plant of computer CPU, its technical scheme is such: it comprises top cover plate, micro-cutting coldplate, the upper surface of described top cover plate is provided with delivery port, water inlet, described top cover plate mounts cover in described micro-cutting coldplate, it is characterized in that: described top cover plate, injection flow distribution plate is provided with in the cavity that micro-cutting coldplate is formed, described injection flow distribution plate has at least four parallel runner notches, described water inlet is communicated to parallel described runner notch along the upper surface of described injection flow distribution plate, the below of described runner notch is the heat dissipation region of described micro-cutting coldplate, the heat dissipation region of described micro-cutting coldplate is evenly equipped with parallel heat radiation groove, described heat radiation texturearunaperpendicular is in described runner notch, the bottom outer edge of described injection flow distribution plate is provided with guiding gutter, apopore, described guiding gutter leads to described apopore, described apopore is communicated with described delivery port, the bottom of described injection flow distribution plate press-fits the upper surface in described micro-cutting coldplate by outer fringe seal circle.
After using structure of the present invention, after cooling water passes into water inlet, enter into the upper surface of spraying flow distribution plate, then cooling water is from the heat dissipation region of the parallel runner notch flow direction to micro-cutting coldplate of spraying flow distribution plate, cooling water flows into the guiding gutter of the bottom outer edge of spraying flow distribution plate along heat radiation groove afterwards, cooling water flow to apopore along guiding gutter, then flow out from delivery port, its at least four parallel runner notches make cooling water have at least four runners, hydraulic pressure is run off little, flow process is short, heat radiation can not leave dead angle, it can the temperature of just heater members drop to lower than ambient temperature, it can be applicable to various environment occasion, the scope of application is large, and its quiet noiselessness.
Accompanying drawing explanation
Fig. 1 is structural representation assembling stereogram of the present invention;
Fig. 2 is the structure schematic diagram of injection flow distribution plate of the present invention;
Fig. 3 is the A place partial enlargement structural representation of Fig. 1.
Embodiment
See Fig. 1, Fig. 2, Fig. 3, it comprises top cover plate 1, micro-cutting coldplate 2, the upper surface of top cover plate 1 is provided with delivery port 3, water inlet 4, top cover plate 1 mounts cover in micro-cutting coldplate 2, top cover plate 1, be provided with in the cavity that micro-cutting coldplate 2 is formed and spray flow distribution plate 5, injection flow distribution plate 5 has four parallel runner notches 6, water inlet 4 is communicated to four parallel runner notches 6 along spraying the upper surface of flow distribution plate 5, the below of runner notch 6 is the heat dissipation region of micro-cutting coldplate 2, the heat dissipation region of micro-cutting coldplate 2 is evenly equipped with parallel heat radiation groove 7, heat radiation groove 7 is perpendicular to runner notch 6, the bottom outer edge of spraying flow distribution plate 5 is provided with guiding gutter 8, apopore 9, guiding gutter 8 leads to apopore 9, apopore 9 is communicated with delivery port 3, the bottom of spraying flow distribution plate 5 press-fits upper surface in micro-cutting coldplate 2 by outer fringe seal circle 10, the corner of top cover plate and micro-cutting coldplate respectively correspondence is provided with installing hole.
Claims (1)
1. the multiple flow passages water cooling plant of computer CPU, it comprises top cover plate, micro-cutting coldplate, the upper surface of described top cover plate is provided with delivery port, water inlet, described top cover plate mounts cover in described micro-cutting coldplate, it is characterized in that: described top cover plate, injection flow distribution plate is provided with in the cavity that micro-cutting coldplate is formed, described injection flow distribution plate has at least four parallel runner notches, described water inlet is communicated to parallel described runner notch along the upper surface of described injection flow distribution plate, the below of described runner notch is the heat dissipation region of described micro-cutting coldplate, the heat dissipation region of described micro-cutting coldplate is evenly equipped with parallel heat radiation groove, described heat radiation texturearunaperpendicular is in described runner notch, the bottom outer edge of described injection flow distribution plate is provided with guiding gutter, apopore, described guiding gutter leads to described apopore, described apopore is communicated with described delivery port, the bottom of described injection flow distribution plate press-fits the upper surface in described micro-cutting coldplate by outer fringe seal circle, the corner of described top cover plate and described micro-cutting coldplate respectively correspondence is provided with installing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210307359.4A CN102790027B (en) | 2012-08-27 | 2012-08-27 | The multiple flow passages water cooling plant of computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210307359.4A CN102790027B (en) | 2012-08-27 | 2012-08-27 | The multiple flow passages water cooling plant of computer CPU |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102790027A CN102790027A (en) | 2012-11-21 |
| CN102790027B true CN102790027B (en) | 2016-03-30 |
Family
ID=47155395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210307359.4A Expired - Fee Related CN102790027B (en) | 2012-08-27 | 2012-08-27 | The multiple flow passages water cooling plant of computer CPU |
Country Status (1)
| Country | Link |
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| CN (1) | CN102790027B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1471409A1 (en) * | 2003-04-22 | 2004-10-27 | Pentalpha International Inc. | Water cooled heat dissipation device |
| CN2919359Y (en) * | 2006-05-26 | 2007-07-04 | 佛山市顺德区汉达精密电子科技有限公司 | Water-cooled computer heat radiating device |
| CN201115237Y (en) * | 2007-06-14 | 2008-09-10 | 宝宁科技股份有限公司 | Liquid cooling heat radiation device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100450326B1 (en) * | 2002-01-22 | 2004-09-30 | 성이제 | Heat sink construction of largest radiant heat area |
| US8464781B2 (en) * | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
| TWI295725B (en) * | 2003-03-17 | 2008-04-11 | Cooligy Inc | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| JP2005229047A (en) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | Cooling system for electronic equipment, and the electronic equipment using same |
| TWM262755U (en) * | 2004-05-28 | 2005-04-21 | Wen-Chr Liau | Heat sink module for slim electronic equipment |
| CN100543975C (en) * | 2005-04-21 | 2009-09-23 | 日本轻金属株式会社 | Liquid-cooled jacket |
| US20070012423A1 (en) * | 2005-07-15 | 2007-01-18 | Koichiro Kinoshita | Liquid cooling jacket and liquid cooling device |
| JP4891617B2 (en) * | 2006-01-05 | 2012-03-07 | 株式会社ティラド | Water-cooled heat sink |
| CN100450336C (en) * | 2007-03-26 | 2009-01-07 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| JP5136072B2 (en) * | 2008-01-15 | 2013-02-06 | 日本軽金属株式会社 | Manufacturing method of liquid cooling jacket |
| CN102056457B (en) * | 2009-10-30 | 2014-01-22 | 鸿富锦精密工业（深圳）有限公司 | Water-cooling type radiating device |
| CN202711162U (en) * | 2012-08-27 | 2013-01-30 | 无锡市福曼科技有限公司 | Double-channel water cooling device for CPU (central processing unit) of computer |
-
2012
- 2012-08-27 CN CN201210307359.4A patent/CN102790027B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1471409A1 (en) * | 2003-04-22 | 2004-10-27 | Pentalpha International Inc. | Water cooled heat dissipation device |
| CN2919359Y (en) * | 2006-05-26 | 2007-07-04 | 佛山市顺德区汉达精密电子科技有限公司 | Water-cooled computer heat radiating device |
| CN201115237Y (en) * | 2007-06-14 | 2008-09-10 | 宝宁科技股份有限公司 | Liquid cooling heat radiation device |
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| Publication number | Publication date |
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| CN102790027A (en) | 2012-11-21 |
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Granted publication date: 20160330 Termination date: 20160827 |
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| CF01 | Termination of patent right due to non-payment of annual fee |