CN102790025B - The multiple flow passages water-cooling structure of computer CPU - Google Patents
The multiple flow passages water-cooling structure of computer CPU Download PDFInfo
- Publication number
- CN102790025B CN102790025B CN201210307233.7A CN201210307233A CN102790025B CN 102790025 B CN102790025 B CN 102790025B CN 201210307233 A CN201210307233 A CN 201210307233A CN 102790025 B CN102790025 B CN 102790025B
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- micro
- top cover
- flow distribution
- cover plate
- cutting coldplate
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Abstract
The invention provides the multiple flow passages water-cooling structure of computer CPU, the temperature of heater members can drop to lower than ambient temperature by it, and it can be applicable to various environment occasion, and the scope of application is large, and its quiet noiselessness.It comprises top cover plate, micro-cutting coldplate, the upper surface of described top cover plate is provided with delivery port, water inlet, described top cover plate mounts cover in described micro-cutting coldplate, it is characterized in that: in the cavity that described top cover plate, micro-cutting coldplate are formed, be provided with injection flow distribution plate, described injection flow distribution plate has at least four parallel runner notches, described water inlet is communicated to parallel described runner notch along the upper surface of described injection flow distribution plate, and the below of described runner notch is the heat radiation projection of described micro-cutting coldplate.
Description
Technical field
The present invention relates to the cooling technology field of computer CPU, be specially the multiple flow passages water-cooling structure of computer CPU.
Background technology
Current computer CPU cooling, air-cooled and these the two kinds of modes of water-cooled of general employing, along with the development of video card process chip, its caloric value produced in the course of the work constantly promotes, in order to ensure that good heat dispersion and video card normally work, it is air-cooled must adopt high rotating speed fan cooled, and high rotating speed fan brings huge noise and vibrations, makes people vexed.And existing cooling by water mode, temperature can only be reduced at most ambient temperature by its water cooling module cooling effect, and it is unsuitable in the higher application scenario of ambient temperature, and its scope of application is little.
Summary of the invention
For the problems referred to above, the invention provides the multiple flow passages water-cooling structure of computer CPU, it can the temperature of just heater members drop to lower than ambient temperature, and it can be applicable to various environment occasion, and the scope of application is large, and its quiet noiselessness.
The multiple flow passages water-cooling structure of computer CPU, its technical scheme is such: it comprises top cover plate, micro-cutting coldplate, the upper surface of described top cover plate is provided with delivery port, water inlet, described top cover plate mounts cover in described micro-cutting coldplate, it is characterized in that: described top cover plate, injection flow distribution plate is provided with in the cavity that micro-cutting coldplate is formed, described injection flow distribution plate has at least four parallel runner notches, described water inlet is communicated to parallel described runner notch along the upper surface of described injection flow distribution plate, the below of described runner notch is the heat radiation projection of described micro-cutting coldplate, the thermal vias interconnected separately is placed with in the heat radiation projection of described micro-cutting coldplate, the bottom outer edge of described injection flow distribution plate is provided with guiding gutter, apopore, described thermal vias is communicated with described guiding gutter, described guiding gutter leads to described apopore, described apopore is communicated with described delivery port, the bottom of described injection flow distribution plate press-fits the upper surface in described micro-cutting coldplate by outer fringe seal circle.
After using structure of the present invention, after cooling water passes into water inlet, enter into the upper surface of spraying flow distribution plate, then cooling water flows to heat radiation projection to micro-cutting coldplate from spraying the parallel runner notch of at least four of flow distribution plate, the thermal vias of cooling water along heat radiation projection inside is to the guiding gutter of the bottom outer edge of injection flow distribution plate afterwards, cooling water flow to apopore along guiding gutter, then flow out from delivery port, its at least four parallel runner notches make cooling water have at least four runners, hydraulic pressure is run off little, flow process is short, heat radiation can not leave dead angle, it can the temperature of just heater members drop to lower than ambient temperature, it can be applicable to various environment occasion, the scope of application is large, and its quiet noiselessness.
Accompanying drawing explanation
Fig. 1 is structural representation assembling stereogram of the present invention;
Fig. 2 is the structure schematic diagram of injection flow distribution plate of the present invention;
Fig. 3 is the A place partial enlargement structural representation of Fig. 1.
Embodiment
See Fig. 1, Fig. 2, Fig. 3, it comprises top cover plate 1, micro-cutting coldplate 2, the upper surface of top cover plate 1 is provided with delivery port 3, water inlet 4, top cover plate 1 mounts cover in micro-cutting coldplate 2, top cover plate 1, be provided with in the cavity that micro-cutting coldplate 2 is formed and spray flow distribution plate 5, injection flow distribution plate 5 has four parallel runner notches 6, water inlet 4 is communicated to four parallel runner notches 6 along spraying the upper surface of flow distribution plate 5, the below of runner notch 6 is the heat radiation projection 11 of micro-cutting coldplate 2, the thermal vias 7 interconnected separately is placed with in the heat radiation projection 11 of micro-cutting coldplate 2, the bottom outer edge of spraying flow distribution plate 5 is provided with guiding gutter 8, apopore 9, thermal vias 7 is communicated with guiding gutter 8, guiding gutter 8 leads to apopore 9, apopore 9 is communicated with delivery port 3, the bottom of spraying flow distribution plate 5 press-fits upper surface in micro-cutting coldplate 2 by outer fringe seal circle 10.
Claims (1)
1. the multiple flow passages water-cooling structure of computer CPU, it comprises top cover plate, micro-cutting coldplate, described top cover plate and described micro-cutting coldplate are respectively arranged with corresponding installing hole, the upper surface of described top cover plate is provided with delivery port, water inlet, described top cover plate mounts cover in described micro-cutting coldplate, it is characterized in that: described top cover plate, injection flow distribution plate is provided with in the cavity that micro-cutting coldplate is formed, described injection flow distribution plate has at least four parallel runner notches, described water inlet is communicated to parallel described runner notch along the upper surface of described injection flow distribution plate, the below of described runner notch is the heat radiation projection of described micro-cutting coldplate, the thermal vias interconnected separately is placed with in the heat radiation projection of described micro-cutting coldplate, the bottom outer edge of described injection flow distribution plate is provided with annular diversion trench, apopore, described thermal vias is communicated with described guiding gutter, described guiding gutter leads to described apopore, described apopore is communicated with described delivery port, the bottom of described injection flow distribution plate press-fits the upper surface in described micro-cutting coldplate by outer fringe seal circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210307233.7A CN102790025B (en) | 2012-08-27 | 2012-08-27 | The multiple flow passages water-cooling structure of computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210307233.7A CN102790025B (en) | 2012-08-27 | 2012-08-27 | The multiple flow passages water-cooling structure of computer CPU |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102790025A CN102790025A (en) | 2012-11-21 |
| CN102790025B true CN102790025B (en) | 2016-03-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210307233.7A Expired - Fee Related CN102790025B (en) | 2012-08-27 | 2012-08-27 | The multiple flow passages water-cooling structure of computer CPU |
Country Status (1)
| Country | Link |
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| CN (1) | CN102790025B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111146151A (en) * | 2019-12-27 | 2020-05-12 | 中国电子科技集团公司第十三研究所 | Packaging structure capable of simultaneously realizing heat dissipation and air tightness of flip chip and preparation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1936481A (en) * | 2005-09-23 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and radiating model group |
| CN101167184A (en) * | 2005-04-21 | 2008-04-23 | 日本轻金属株式会社 | Liquid-cooled jacket |
| CN101228495A (en) * | 2005-05-06 | 2008-07-23 | 阿塞泰克公司 | Cooling system for computer system |
| CN202712162U (en) * | 2012-08-27 | 2013-01-30 | 无锡市福曼科技有限公司 | Multi-flow channel water-cooling structure of computer CPU |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8464781B2 (en) * | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
| CN2741096Y (en) * | 2004-10-11 | 2005-11-16 | 任德锋 | Liquid-cooled radiator of computer |
| CN201115237Y (en) * | 2007-06-14 | 2008-09-10 | 宝宁科技股份有限公司 | Liquid cooling heat radiation device |
| CN201417421Y (en) * | 2009-05-07 | 2010-03-03 | 无锡市福曼科技有限公司 | Micro-channel highly-effective water cooling exchanger |
-
2012
- 2012-08-27 CN CN201210307233.7A patent/CN102790025B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101167184A (en) * | 2005-04-21 | 2008-04-23 | 日本轻金属株式会社 | Liquid-cooled jacket |
| CN101228495A (en) * | 2005-05-06 | 2008-07-23 | 阿塞泰克公司 | Cooling system for computer system |
| CN1936481A (en) * | 2005-09-23 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and radiating model group |
| CN202712162U (en) * | 2012-08-27 | 2013-01-30 | 无锡市福曼科技有限公司 | Multi-flow channel water-cooling structure of computer CPU |
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| Publication number | Publication date |
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| CN102790025A (en) | 2012-11-21 |
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Granted publication date: 20160330 Termination date: 20160827 |