CN102790025A - Multi-channel water-cooling structure of CPU (central processing unit) of computer - Google Patents

Multi-channel water-cooling structure of CPU (central processing unit) of computer Download PDF

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Publication number
CN102790025A
CN102790025A CN2012103072337A CN201210307233A CN102790025A CN 102790025 A CN102790025 A CN 102790025A CN 2012103072337 A CN2012103072337 A CN 2012103072337A CN 201210307233 A CN201210307233 A CN 201210307233A CN 102790025 A CN102790025 A CN 102790025A
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China
Prior art keywords
plate
cover plate
flow distribution
cpu
water
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CN2012103072337A
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Chinese (zh)
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CN102790025B (en
Inventor
谈士权
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Wuxi Formen Technical Co Ltd
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Wuxi Formen Technical Co Ltd
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Priority to CN201210307233.7A priority Critical patent/CN102790025B/en
Publication of CN102790025A publication Critical patent/CN102790025A/en
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Publication of CN102790025B publication Critical patent/CN102790025B/en
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Abstract

The invention provides a multi-channel water-cooling structure of a CPU (central processing unit) of a computer. The multi-channel water-cooling structure of the CPU of the computer can reduce the temperature of a heating device to lower than the ambient temperature, is suitable for various environments and occasions with a large scope of application and can be used quietly without any noise. The multi-channel water-cooling structure of the CPU of the computer comprises an upper cover plate and a micro-cutting cooling plate, wherein a water outlet and a water inlet are arranged on the upper end face of the upper cover plate, the upper cover plate covers on the micro-cutting cooling plate, the multi-channel water-cooling structure of the CPU of the computer is characterized in that an injection spreader plate is arranged inside a cavity formed by the upper cover plate and the micro-cutting cooling plate, at least four parallel channel slots are arranged on the injection spreader plate, the water inlet is communicated with the parallel channel slots along the upper surface of the injection spreader plate, and heat dissipation bumps of the micro-cutting cooling plate are arranged below the channel slots.

Description

The multithread road water-cooling structure of computer CPU
Technical field
The present invention relates to the cooling technology field of computer CPU, be specially the multithread road water-cooling structure of computer CPU.
Background technology
Present computer CPU cooling; Air-cooled and this dual mode of water-cooled of general employing is accompanied by the continuous development of video card process chip, and its caloric value that is produced in the course of the work constantly promotes; In order to guarantee good performance of heat dissipation and video card operate as normal; Its air-cooled necessary high rotating speed fan cooled that adopts, high rotating speed fan brings huge noise and vibrations, makes the people vexed.And the existing water-cooled type of cooling, its water cooling module cooling effect can only be reduced to ambient temperature with temperature at most, and it is inappropriate in ambient temperature than higher application scenario, and its scope of application is little.
Summary of the invention
To the problems referred to above, the invention provides the multithread road water-cooling structure of computer CPU, its just the temperature of heater members drop to and be lower than ambient temperature, it can be applicable to various environment occasions, the scope of application is big, and its quiet noiselessness.
The multithread road water-cooling structure of computer CPU; Its technical scheme is such: it comprises top cover plate, little cutting coldplate; The upper surface of said top cover plate is provided with delivery port, water inlet; Said top cover plate lid is loaded on said little cutting coldplate, and it is characterized in that: be provided with the injection flow distribution plate in said top cover plate, the formed cavity of little cutting coldplate, said injection flow distribution plate has at least four parallel runner notches; Said water inlet is communicated to parallel said runner notch along the upper surface of said injection flow distribution plate; The below of said runner notch is the heat radiation projection of said little cutting coldplate, is placed with the heat radiation through hole that interconnects separately in the heat radiation projection of said little cutting coldplate, and the bottom outer edge of said injection flow distribution plate is provided with guiding gutter, apopore; Said heat radiation through hole is communicated with said guiding gutter; Said guiding gutter leads to said apopore, and said apopore is communicated with said delivery port, and the bottom of said injection flow distribution plate press-fits in the upper surface of said little cutting coldplate through the outer fringe seal circle.
After using structure of the present invention, after cooling water feeds water inlet, enter into the upper surface of spraying flow distribution plate; Cooling water flows to the heat radiation projection to little cutting coldplate from least four parallel runner notches that spray flow distribution plate then, and cooling water is along the guiding gutter of inner heat radiation through hole to the bottom outer edge of spraying flow distribution plate of heat radiation projection afterwards, and cooling water flow to apopore along guiding gutter; Flow out from delivery port then; Its at least four parallel runner notches make cooling water that at least four runners arranged, and make that the hydraulic pressure loss is little, flow process short, and heat radiation can not leave the dead angle; Its just the temperature of heater members drop to and be lower than ambient temperature; It can be applicable to various environment occasions, and the scope of application is big, and its quiet noiselessness.
Description of drawings
Fig. 1 is a structural representation assembling stereogram of the present invention;
Fig. 2 is the structure sketch map of injection flow distribution plate of the present invention;
Fig. 3 is the local structure for amplifying sketch map in A place of Fig. 1.
Embodiment
See Fig. 1, Fig. 2, Fig. 3; It comprises top cover plate 1, little cutting coldplate 2, and the upper surface of top cover plate 1 is provided with delivery port 3, water inlet 4, and cover plate 1 lid in top is loaded on little cutting coldplate 2; Be provided with in top cover plate 1, the little cutting coldplate 2 formed cavitys and spray flow distribution plate 5; Spray flow distribution plate 5 and have four parallel runner notches 6, water inlet 4 is communicated to four parallel runner notches 6 along the upper surface that sprays flow distribution plate 5, and the below of runner notch 6 is the heat radiation projection 11 of little cutting coldplate 2; Be placed with the heat radiation through hole 7 that interconnects separately in the heat radiation projection 11 of little cutting coldplate 2; The bottom outer edge of spraying flow distribution plate 5 is provided with guiding gutter 8, apopore 9, and heat radiation through hole 7 is communicated with guiding gutter 8, and guiding gutter 8 leads to apopore 9; Apopore 9 is communicated with delivery port 3, and the bottom of spraying flow distribution plate 5 press-fits in the upper surface of little cutting coldplate 2 through outer fringe seal circle 10.

Claims (1)

1. the multithread road water-cooling structure of computer CPU; It comprises top cover plate, little cutting coldplate, and the upper surface of said top cover plate is provided with delivery port, water inlet, and cover plate lid in said top is loaded on said little cutting coldplate; It is characterized in that: be provided with the injection flow distribution plate in said top cover plate, the formed cavity of little cutting coldplate; Said injection flow distribution plate has at least four parallel runner notches, and said water inlet is communicated to parallel said runner notch along the upper surface of said injection flow distribution plate, and the below of said runner notch is the heat radiation projection of said little cutting coldplate; Be placed with the heat radiation through hole that interconnects separately in the heat radiation projection of said little cutting coldplate; The bottom outer edge of said injection flow distribution plate is provided with guiding gutter, apopore, and said heat radiation through hole is communicated with said guiding gutter, and said guiding gutter leads to said apopore; Said apopore is communicated with said delivery port, and the bottom of said injection flow distribution plate press-fits in the upper surface of said little cutting coldplate through the outer fringe seal circle.
CN201210307233.7A 2012-08-27 2012-08-27 The multiple flow passages water-cooling structure of computer CPU Expired - Fee Related CN102790025B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210307233.7A CN102790025B (en) 2012-08-27 2012-08-27 The multiple flow passages water-cooling structure of computer CPU

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210307233.7A CN102790025B (en) 2012-08-27 2012-08-27 The multiple flow passages water-cooling structure of computer CPU

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CN102790025A true CN102790025A (en) 2012-11-21
CN102790025B CN102790025B (en) 2016-03-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111146151A (en) * 2019-12-27 2020-05-12 中国电子科技集团公司第十三研究所 Packaging structure capable of simultaneously realizing heat dissipation and air tightness of flip chip and preparation method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2741096Y (en) * 2004-10-11 2005-11-16 任德锋 Liquid-cooled radiator of computer
US20070034356A1 (en) * 2002-11-01 2007-02-15 Cooligy, Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
CN1936481A (en) * 2005-09-23 2007-03-28 鸿富锦精密工业(深圳)有限公司 Heat pipe and radiating model group
CN101167184A (en) * 2005-04-21 2008-04-23 日本轻金属株式会社 Liquid-cooled jacket
CN101228495A (en) * 2005-05-06 2008-07-23 阿塞泰克公司 Cooling system for computer system
CN201115237Y (en) * 2007-06-14 2008-09-10 宝宁科技股份有限公司 Liquid cooling heat radiation device
CN201417421Y (en) * 2009-05-07 2010-03-03 无锡市福曼科技有限公司 Micro-channel highly-effective water cooling exchanger
CN202712162U (en) * 2012-08-27 2013-01-30 无锡市福曼科技有限公司 Multi-flow channel water-cooling structure of computer CPU

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070034356A1 (en) * 2002-11-01 2007-02-15 Cooligy, Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
CN2741096Y (en) * 2004-10-11 2005-11-16 任德锋 Liquid-cooled radiator of computer
CN101167184A (en) * 2005-04-21 2008-04-23 日本轻金属株式会社 Liquid-cooled jacket
CN101228495A (en) * 2005-05-06 2008-07-23 阿塞泰克公司 Cooling system for computer system
CN1936481A (en) * 2005-09-23 2007-03-28 鸿富锦精密工业(深圳)有限公司 Heat pipe and radiating model group
CN201115237Y (en) * 2007-06-14 2008-09-10 宝宁科技股份有限公司 Liquid cooling heat radiation device
CN201417421Y (en) * 2009-05-07 2010-03-03 无锡市福曼科技有限公司 Micro-channel highly-effective water cooling exchanger
CN202712162U (en) * 2012-08-27 2013-01-30 无锡市福曼科技有限公司 Multi-flow channel water-cooling structure of computer CPU

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111146151A (en) * 2019-12-27 2020-05-12 中国电子科技集团公司第十三研究所 Packaging structure capable of simultaneously realizing heat dissipation and air tightness of flip chip and preparation method

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