JP2001313357A - Method for manufacturing heat sink plate, and heat sink structure - Google Patents
Method for manufacturing heat sink plate, and heat sink structureInfo
- Publication number
- JP2001313357A JP2001313357A JP2000132844A JP2000132844A JP2001313357A JP 2001313357 A JP2001313357 A JP 2001313357A JP 2000132844 A JP2000132844 A JP 2000132844A JP 2000132844 A JP2000132844 A JP 2000132844A JP 2001313357 A JP2001313357 A JP 2001313357A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- joining
- sink plate
- plate
- cooling hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2220/00—Closure means, e.g. end caps on header boxes or plugs on conduits
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はヒートシンク板（パ
ッキングプレート）の製作方法に関し、前記ヒートシン
ク板に設けられた冷却孔と蓋との接合において、接合に
よる熱ひずみを減少し、平滑かつ、精度の高いヒートシ
ンク板を得るに適した製作方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a heat sink plate (packing plate). The present invention relates to a manufacturing method suitable for obtaining a high heat sink plate.
【０００２】[0002]
【従来の技術】半導体のヒートシンク板（パッキングプ
レート）は、シリコンウエハまたはガラス基板などのエ
ッチングまたはスパッタリング工程において、前記ウエ
ハやガラス基板を保持し、かつ効率的な冷却機能が必要
である。このため、銅または銅合金またはアルミ合金か
らなる平滑な板の内部に冷却孔を有し、これを同じ材質
からなる蓋で金属的に密閉する構造である。従来、前記
ヒートシンク板の冷却孔と蓋との密閉は電子ビーム溶
接，拡散接合，ろう付け方法などにより金属的に接合し
て製作されている。2. Description of the Related Art A semiconductor heat sink plate (packing plate) needs to have an efficient cooling function for holding a wafer or a glass substrate in an etching or sputtering process of a silicon wafer or a glass substrate. Therefore, a cooling plate is provided inside a smooth plate made of copper, a copper alloy, or an aluminum alloy, and the cooling hole is metallically sealed with a lid made of the same material. Conventionally, the hermetic seal between the cooling hole and the lid of the heat sink plate has been manufactured by metallic bonding by electron beam welding, diffusion bonding, brazing, or the like.
【０００３】[0003]
【発明が解決しようとする課題】前記ヒートシンク板は
冷却効率を高める必要があり、前記シリコンウエハなど
と接触する前記ヒートシンク板の表面は高い平滑精度が
必要である。ところが、前記ヒートシンク板に設けられ
る冷却孔とその蓋との接合は、従来、電子ビーム溶接，
レーザ溶接，拡散接合，ろう付けなどが採用されてい
る。しかし、投入熱量の比較的小さい電子ビーム溶接で
も接合後は大きな熱ひずみが発生する。このため、接合
後の修正作業または機械切削によって平滑にする必要が
ある。従って、品質，精度さらに接合後のコストの点で
問題がある。The heat sink plate needs to have a high cooling efficiency, and the surface of the heat sink plate which comes into contact with the silicon wafer or the like needs to have high smoothness. However, the connection between the cooling hole provided in the heat sink plate and the lid thereof has conventionally been made by electron beam welding,
Laser welding, diffusion bonding, brazing, etc. are employed. However, even with electron beam welding having a relatively small heat input, large thermal strain occurs after joining. For this reason, it is necessary to perform smoothing by repair work after joining or mechanical cutting. Therefore, there are problems in quality, accuracy, and cost after joining.
【０００４】[0004]
【課題を解決するための手段】前記課題を解決するた
め、前記ヒートシンク板に設けられた冷却孔と蓋との接
合は摩擦攪拌接合法により接合する。前記接合方法は銅
またはアルミの融点以下の低温で接合できる。さらに、
前記接合は水，オイル，冷却ガスなどの冷却剤の中でま
たは接合部近傍及び前記ヒートシンク板全体に前記冷却
材をかけながら接合する。In order to solve the above problems, the cooling hole provided in the heat sink plate and the lid are joined by a friction stir welding method. The bonding method can be performed at a low temperature equal to or lower than the melting point of copper or aluminum. further,
The joining is performed in a coolant such as water, oil, or a cooling gas or while applying the coolant to the vicinity of the joint and the entire heat sink plate.
【０００５】前記摩擦攪拌接合方法は、実質的に前記ア
ルミニウムまたは銅の材質よりも硬い材質の金属棒（ツ
ール）を前記接合部に挿入し、このツールを回転させな
がら移動するかまたは前記ヒートシンク板自体を移動す
ることによって、前記ツールと前記ヒートシンク板との
間で発生する摩擦熱と塑性流動を利用して接合する方法
である。これは特公表7−505090号公報（EPO615480B1）
で公知である。つまり、前記ツールと接合材との摩擦熱
による塑性流動現象を利用したもので、アーク溶接のよ
うに接合材を溶かして溶接するものではない。さらに、
この摩擦攪拌接合方法は、従来の摩擦溶接方法のよう
に、加工物同士を回転させてその摩擦熱による溶接方法
とは異なり、加工物を接合線長方向、つまり、長手方向
に連続的に接合材の融点以下の温度で接合できる特徴が
ある。[0005] In the friction stir welding method, a metal rod (tool) made of a material substantially harder than the aluminum or copper material is inserted into the joint, and the tool is moved while rotating the tool or the heat sink plate is rotated. This is a method of joining by utilizing frictional heat and plastic flow generated between the tool and the heat sink plate by moving itself. This is Japanese Patent Publication No. 7-505090 (EPO615480B1)
And is known. That is, the method utilizes a plastic flow phenomenon caused by frictional heat between the tool and the joining material, and does not melt and weld the joining material as in arc welding. further,
This friction stir welding method is different from the conventional friction welding method in which workpieces are rotated and friction welding heat is used, and the workpieces are continuously joined in a joining line length direction, that is, in a longitudinal direction. It has the characteristic that it can be joined at a temperature lower than the melting point of the material.
【０００６】前記摩擦攪拌接合方法により接合すること
により、銅またはアルミの融点以下の低温で接合でき
る。このため、従来の電子ビーム溶接などに比べて接合
によるひずみが小さく、精度の高いヒートシンク板を製
作できる。従って、接合後の修正作業時間が短縮でき
る。[0006] By joining by the friction stir welding method, joining can be performed at a low temperature equal to or lower than the melting point of copper or aluminum. For this reason, compared with the conventional electron beam welding or the like, distortion due to joining is small, and a highly accurate heat sink plate can be manufactured. Therefore, the repair work time after joining can be reduced.
【０００７】さらに、前記接合方法は水，オイル，冷却
ガスなどの冷却剤の中でまたは接合部近傍及び前記ヒー
トシンク板全体に前記冷却材をかけながら接合できる。
これにより、接合部から数ミリ離れた位置での温度上昇
は１００℃以下である。このため、接合後のひずみが極
限まで減少できる。従って、前記シリコンウエハと接触
する面が平滑、かつ、精度並びに信頼性が高いヒートシ
ンク板が低コストで製作できる。Further, the bonding method can be performed in a coolant such as water, oil, cooling gas or the like, or while applying the coolant to the vicinity of the bonding portion and the entire heat sink plate.
Thus, the temperature rise at a position several millimeters away from the joint is 100 ° C. or less. For this reason, the strain after joining can be reduced to the limit. Therefore, a heat sink plate having a smooth surface in contact with the silicon wafer and having high accuracy and reliability can be manufactured at low cost.
【０００８】[0008]
【発明の実施の形態】（実施例１）図１は本発明を半導
体用のヒートシンク板（パッキングプレート）の接合に
実施した場合の上方向から観察のヒートシンク板の構造
と接合方法を示す。図２は図１のＡ−Ｂ方向の断面を示
す。図１，図２のヒートシンク板１の材質はＪＩＳ規格
Ｃ１０２０の無酸素銅である。前記ヒートシンク板１に
は複数の独立した水冷孔２及び冷却水の給排水口３が設
けられている。前記水冷孔２は同じ材質の銅板からなる
蓋が本発明の摩擦攪拌接合方法により接合される。(Embodiment 1) FIG. 1 shows a structure and a joining method of a heat sink plate observed from above when the present invention is applied to joining of a heat sink plate (packing plate) for a semiconductor. FIG. 2 shows a cross section in the AB direction of FIG. The material of the heat sink plate 1 in FIGS. 1 and 2 is oxygen-free copper of JIS standard C1020. The heat sink plate 1 is provided with a plurality of independent water cooling holes 2 and cooling water supply / drain ports 3. The water cooling hole 2 is formed by joining a lid made of a copper plate of the same material by the friction stir welding method of the present invention.
【０００９】本実施例における前記銅板の厚さは１５m
m、幅は１０００mm、長さは１２００mm、冷却孔の幅は
４０mm、高さは１０mmである。前記銅板に４個の前記冷
却孔が設けられている。In the present embodiment, the thickness of the copper plate is 15 m.
m, the width is 1000 mm, the length is 1200 mm, the width of the cooling hole is 40 mm, and the height is 10 mm. The copper plate has four cooling holes.
【００１０】前記水冷孔２を密閉にする蓋４は、次に示
す摩擦攪拌接合により金属的に接合される。前記摩擦攪
拌接合に用いる回転ツール５は、前記ヒートシンク板１
より硬い例えば工具鋼のような金属製からできている。
前記回転ツール５は先端のピン部６と前記ピン部６より
太いショルダ部７からなっている。前記ピン部６の全部
の長さが接合部に回転した状態で挿入される。ここで、
ショルダ部７もわずかに挿入される。次に前記回転ツー
ル５が回転した状態で接合線方向に移動する。このと
き、前記水冷孔２の蓋４は、前記回転ツール５と前記ヒ
ートシンク板１との間に生じる摩擦熱と塑性流動現象に
よって接合される。前記接合方法によって得られる接合
部８は、接合欠陥もなく、かつ平滑である。The lid 4 for sealing the water cooling hole 2 is metallically joined by the following friction stir welding. The rotating tool 5 used for the friction stir welding includes the heat sink plate 1
It is made of a harder metal, such as tool steel.
The rotary tool 5 includes a pin portion 6 at the tip and a shoulder portion 7 which is thicker than the pin portion 6. The entire length of the pin portion 6 is inserted into the joint portion while rotating. here,
The shoulder 7 is also slightly inserted. Next, the rotary tool 5 moves in the joining line direction while rotating. At this time, the lid 4 of the water cooling hole 2 is joined by friction heat generated between the rotating tool 5 and the heat sink plate 1 and a plastic flow phenomenon. The joining portion 8 obtained by the joining method has no joining defects and is smooth.
【００１１】本実施例における前記回転ツール５のピン
部６の径は６mm、長さは５mm、ショルダ部７の径は１５
mm、接合速度は４００mm／min、回転数は８００rpmであ
る。なお、前記回転ツールは接合進行方向と逆方向に１
〜５度の角度で傾斜していることが望ましい。In this embodiment, the diameter of the pin 6 of the rotary tool 5 is 6 mm, the length is 5 mm, and the diameter of the shoulder 7 is 15 mm.
mm, the bonding speed is 400 mm / min, and the rotation speed is 800 rpm. In addition, the rotating tool is moved in the direction opposite to the joining progress direction by one.
It is desirable to be inclined at an angle of up to 5 degrees.
【００１２】前記接合方法は接合のスタート点と終端部
は欠陥が発生しやすい。このため、本発明では接合のス
タート点と終端部にダミー板９を設け、前記ダミー板９
から接合を開始し、ダミー板９の部分で接合を終了す
る。前記ダミー板は接合後、機械的に除去する。In the above joining method, defects are apt to occur at the starting point and the ending part of the joining. For this reason, in the present invention, the dummy plate 9 is provided at the start point and the end of the joining, and the dummy plate 9 is provided.
The joining is started from the point of view, and the joining is completed at the portion of the dummy plate 9. After bonding, the dummy plate is mechanically removed.
【００１３】前記接合方法により接合したヒートシンク
板は、従来の電子ビーム溶接で接合した場合に比べてひ
ずみが約半分に減少し、接合後のひずみ修正作業の機械
加工時間が半分で済み、コスト低減と品質の向上が実現
できる。前記ヒートシンク板は半導体用スパッタリング
装置のシリコン基板を保持して冷却するパッキングプレ
ートとして適用される。 （実施例２）図３は本発明を半導体用のヒートシンク板
の接合に実施した場合の上方向から観察のヒートシンク
板の構造と接合方法を示す。図４は図３のＡ−Ｂ方向の
断面を示す。前記ヒートシンク板の材質はＪＩＳ規格１
２０１である。ただし、前記回転ツールの材質と形状，
接合条件は同じである。[0013] The heat sink plate joined by the above-mentioned joining method reduces the strain by about half as compared with the case of joining by the conventional electron beam welding, requires only half the machining time for the strain correcting work after joining, and reduces the cost. And quality improvement can be realized. The heat sink plate is applied as a packing plate that holds and cools a silicon substrate of a semiconductor sputtering apparatus. (Embodiment 2) FIG. 3 shows a structure and a joining method of a heat sink plate observed from above when the present invention is applied to joining of a heat sink plate for a semiconductor. FIG. 4 shows a cross section taken along the line AB in FIG. The material of the heat sink plate is JIS standard 1.
201. However, the material and shape of the rotating tool,
The joining conditions are the same.
【００１４】本実施例では、前記水冷孔２を機密にする
ための蓋４の接合は、２個の回転ツールを用いて同時に
接合する。まず、ＡとＢの接合部を２個の回転ツールで
接合する。次にＣとＤを同時に、次にＥとＦを同時に接
合する。次にＨとＧを同時に接合する。前記Ａ−Ｂ間，
Ｃ−Ｄ間，Ｅ−Ｆ間の各間隔は４０mmと狭い。このた
め、接合進行方向に対する前記２つのツールを同時にか
つ平行に配置して接合するとお互いのツールはぶつかり
または接合部の温度が上昇する。従って、２つのツール
は接合進行方向に対して一定の間隔（Ｌ）を保持して配
置されている。In this embodiment, the lid 4 for keeping the water cooling hole 2 confidential is bonded simultaneously using two rotating tools. First, the joint between A and B is joined with two rotating tools. Next, C and D are simultaneously bonded, and then E and F are simultaneously bonded. Next, H and G are simultaneously bonded. Between A and B,
Each space between CD and EF is as narrow as 40 mm. For this reason, if the two tools are arranged at the same time and parallel to the joining progress direction and joined, the two tools collide with each other or the temperature of the joint increases. Therefore, the two tools are arranged so as to keep a constant distance (L) in the joining progress direction.
【００１５】一方、接合部ＡまたはＢと接合部Ｈまたは
Ｇは接合部の一部がお互いに交差する接合となる。これ
により、前記接合は直線方向だけの接合のため、前記接
合装置の構成が簡単となり、かつ安価になる。さらに、
前記接合方法は接合のスタート点と終端部は欠陥が発生
しやすい。このため、本発明では接合のスタート点と終
端部にダミー板９を設け、前記ダミー板９から接合を開
始し、ダミー板９の部分で接合を終了する。前記ダミー
板は接合後、機械的に除去する。On the other hand, the joint A or B and the joint H or G are joints in which a part of the joint intersects with each other. Accordingly, since the joining is performed only in the linear direction, the configuration of the joining device is simplified and the cost is reduced. further,
In the joining method, defects are easily generated at the start point and the end part of the joint. For this reason, in the present invention, the dummy plate 9 is provided at the start point and the end part of the joining, the joining is started from the dummy plate 9, and the joining is completed at the portion of the dummy plate 9. After bonding, the dummy plate is mechanically removed.
【００１６】ところで、本実施例では２個のツールを用
いて同時に接合するため、摩擦熱も多い。このため、接
合部の近傍及びヒートシンク板の全体さらに水冷孔に冷
却水を流しながら接合する。本実施例のごとく、冷却し
ながら接合するため、前記ツールから３mmはなれた前記
ヒートシンク板の温度は１００℃以下である。このた
め、接合後のひずみは水冷却しない場合に比べて約半分
以下になる。従って、接合後のひずみ修正のための機械
加工が不要となる。なお、接合部の近傍に水をかけても
接合部の内部は前記ツールの回転及び摩擦熱で内部圧力
が大気圧力に比べて高いため、接合部内への水の浸入は
ない。従って、接合部８に欠陥の発生もなく、機械的特
性も低下しない。By the way, in this embodiment, since two tools are simultaneously used for joining, a large amount of frictional heat is generated. For this reason, the joining is performed while cooling water is supplied to the vicinity of the joining portion and the entire heat sink plate and further to the water cooling holes. As in the present embodiment, the temperature of the heat sink plate 3 mm away from the tool is 100 ° C. or less for joining while cooling. For this reason, the strain after joining is about half or less as compared with the case without water cooling. Therefore, machining for correcting distortion after joining is not required. Even if water is applied to the vicinity of the joint, the inside of the joint does not enter the joint because the internal pressure is higher than the atmospheric pressure due to the rotation and frictional heat of the tool. Therefore, no defect occurs in the joint 8 and the mechanical characteristics do not deteriorate.
【００１７】前記接合方法により接合したヒートシンク
板は、従来の電子ビーム溶接で接合した場合に比べてひ
ずみが約１／１０以下に減少する。従って、接合後のひ
ずみ修正作業の機械加工時間が不要となり、コスト低減
と品質の向上が実現できる。前記ヒートシンク板は半導
体用スパッタリング装置のガラス基板を保持し、冷却す
るパッキングプレートとして適用される。 （実施例３）本実施例ではアルミ合金のＪＩＳ規格５０
５２に実施した。ヒートシンク板の形状及び接合条件は
実施例１と同じであり、本実施例でも実施例１と同様の
効果が確認された。 （実施例４）図５は実施例１の冷却孔，ツール及び接合
部を拡大した断面を示す。前記ヒートシンク板１及び蓋
４の厚さが他の部分より局部的に厚いことが特徴であ
る。前記局部的に厚い部分の幅（Ｗ）は前記回転ツール
５のショルダ部７の外径とほぼ同じ程度が望ましい。The strain of the heat sink plate joined by the above joining method is reduced to about 1/10 or less as compared with the case of joining by the conventional electron beam welding. Therefore, machining time for the strain correction work after joining is not required, and cost reduction and quality improvement can be realized. The heat sink plate is used as a packing plate for holding and cooling a glass substrate of a semiconductor sputtering apparatus. (Embodiment 3) In this embodiment, JIS standard 50 of aluminum alloy is used.
52. The shape of the heat sink plate and the joining conditions were the same as in Example 1, and the same effects as in Example 1 were confirmed in this example. (Embodiment 4) FIG. 5 shows an enlarged cross section of the cooling holes, tools and joints of Embodiment 1. It is characterized in that the thickness of the heat sink plate 1 and the lid 4 is locally thicker than other portions. The width (W) of the locally thick portion is desirably substantially the same as the outer diameter of the shoulder portion 7 of the rotary tool 5.
【００１８】一方、局部的な厚さは他の部分より０.３
〜３mm 高いことが望ましい。さらに、前記ヒートシン
ク板１の接合部は前記回転ツール５の先端において、段
付きになっていることが望ましい。段付きの部分の幅
（Ｄ）は前記ツールのピン部の径と同等かそれ以上が望
ましい。また、高さ（Ｈ）は前記回転ツール５のピン部
６の長さと同等か１mm程度大きいことが望ましい。前記
接合構造により前記蓋４が安定に固定され、かつ、接合
部の先端部に座屈が発生しない。さらに、接合部の表面
は凹みも生じない。 （実施例５）図６は本発明を半導体用のヒートシンク板
の接合に実施した場合の上方向から観察のヒートシンク
板の構造と接合方法を示す。図６は図５のＡ−Ｂ方向の
断面を示す。図５，図６のヒートシンク板１の材質はＪ
ＩＳ規格Ｃ１０２０の無酸素銅である。前記ヒートシン
ク板１には連続した水冷孔２及び冷却水の給排水口３が
設けられている。前記水冷孔は同じ材質の銅板からなる
蓋４が本発明の摩擦攪拌接合方法により接合される。On the other hand, the local thickness is 0.3 times larger than other portions.
It is desirable that the height is about 3 mm higher. Further, it is desirable that the joining portion of the heat sink plate 1 is stepped at the tip of the rotating tool 5. The width (D) of the stepped portion is desirably equal to or larger than the diameter of the pin portion of the tool. It is desirable that the height (H) is equal to or longer than the length of the pin portion 6 of the rotary tool 5 by about 1 mm. The lid 4 is stably fixed by the joint structure, and buckling does not occur at the tip of the joint. Furthermore, the surface of the joint does not dent. (Embodiment 5) FIG. 6 shows the structure and bonding method of a heat sink plate observed from above when the present invention is applied to bonding of a heat sink plate for semiconductor. FIG. 6 shows a cross section in the AB direction of FIG. The material of the heat sink plate 1 shown in FIGS.
It is oxygen-free copper of IS standard C1020. The heat sink plate 1 is provided with continuous water cooling holes 2 and cooling water supply / drain ports 3. The water cooling holes are joined by the friction stir welding method of the present invention to the lid 4 made of a copper plate of the same material.
【００１９】本実施例における前記ヒートシンク板の厚
さは１５mm、幅は８００mm、長さは１０００mm、水冷孔
２の幅は５０mm、高さは１０mmである。In the present embodiment, the heat sink plate has a thickness of 15 mm, a width of 800 mm, a length of 1000 mm, a width of the water cooling hole 2 of 50 mm, and a height of 10 mm.
【００２０】前記水冷孔２を機密にする蓋４は、次に示
す摩擦攪拌接合により金属的に接合される。前記摩擦攪
拌接合に用いる回転ツールの形状と寸法並びに接合条件
は、実施例１と同じである。前記ヒートシンク板に設け
られた水冷孔は給水口から排水口まで連続しているた
め、前記接合も連続的に行われる。ここで、接合が連続
的であるため、接合過程において、前記ツールの温度が
摩擦熱で４００℃以上と高くなる。さらに、摩擦熱で前
記ヒートシンク板のひずみも大きくなる。従って、本実
施例では前記ツールの一部及び接合部さらにヒートシン
ク板の全部を水の中に浸して冷却しながら接合する方法
を採用した。なお、冷却水は常に２０℃以下になるよう
に循環して冷却している。本実施例のごとく、冷却しな
がら接合するため、前記ツールから２mmはなれた前記ヒ
ートシンク板の温度は１００℃以下である。このため、
接合後のひずみは水冷却しない場合に比べて約半分以下
になる。従って、接合後のひずみ修正のための機械加工
が不要となる。The lid 4, which keeps the water cooling hole 2 secret, is metallically joined by the following friction stir welding. The shape and size of the rotary tool used for the friction stir welding and the welding conditions are the same as those in the first embodiment. Since the water cooling holes provided in the heat sink plate are continuous from the water supply port to the drain port, the joining is also performed continuously. Here, since the joining is continuous, the temperature of the tool increases to 400 ° C. or more due to frictional heat in the joining process. Further, the heat sink also increases the distortion of the heat sink plate. Therefore, in the present embodiment, a method is adopted in which a part of the tool, the joint, and the entire heat sink plate are immersed in water and joined while cooling. The cooling water is circulated and cooled so as to always be 20 ° C. or less. As in the present embodiment, the temperature of the heat sink plate 2 mm away from the tool is 100 ° C. or less for joining while cooling. For this reason,
The strain after joining is less than about half as compared with the case without water cooling. Therefore, machining for correcting distortion after joining is not required.
【００２１】なお、前記接合方法は接合のスタート点と
終端部は欠陥が発生しやすい。このため、本発明では接
合のスタート点と終端部にダミー板９を設け、前記ダミ
ー板９から接合を開始し、ダミー板９の部分で接合を終
了する。前記ダミー板は接合後、機械的に除去する。In the above joining method, defects are likely to occur at the joining start and end portions. For this reason, in the present invention, the dummy plate 9 is provided at the start point and the end part of the joining, the joining is started from the dummy plate 9, and the joining is completed at the portion of the dummy plate 9. After bonding, the dummy plate is mechanically removed.
【００２２】前記接合方法により接合したヒートシンク
板は、従来の電子ビーム溶接で接合した場合に比べてひ
ずみが約半分に減少し、接合後のひずみ修正作業の機械
加工時間が半分で済み、コスト低減と品質の向上が実現
できる。前記ヒートシンク板は半導体用スパッタリング
装置のシリコン基板を保持冷却するパッキングプレート
として適用される。（実施例６）本実施例では外径が５
００mmの円板からなるヒートシンク板に実施した。冷却
孔の構造は実施例５と同じ形状で、かつ連続している。
ヒートシンク板の材質と厚さは実施例５と同じである。
さらに、接合条件も実施例５と同じである。本実施例で
も実施例５と同様の効果が確認された。The heat sink plate joined by the above-mentioned joining method reduces the strain by about half as compared with the case of joining by the conventional electron beam welding, and requires only half the machining time for the strain correcting work after joining, thereby reducing the cost. And quality improvement can be realized. The heat sink plate is used as a packing plate for holding and cooling a silicon substrate of a semiconductor sputtering apparatus. (Embodiment 6) In this embodiment, the outer diameter is 5
The test was performed on a heat sink plate made of a 00 mm disk. The structure of the cooling hole has the same shape as that of the fifth embodiment and is continuous.
The material and thickness of the heat sink plate are the same as in the fifth embodiment.
Furthermore, the joining conditions are the same as in the fifth embodiment. In this embodiment, the same effect as in Embodiment 5 was confirmed.
【００２３】[0023]
【発明の効果】本発明によれば、摩擦攪拌接合によって
接合したヒートシンク板は熱ひずみが小さいため、高い
品質の半導体用ヒートシンク板は安価に製作できる。特
に本発明では水冷しながら接合するため、熱ひずみを極
限まで小さくできる。従って、接合後の修正作業も不要
となり、安価に製作できる。According to the present invention, a heat sink plate joined by friction stir welding has a small thermal strain, so that a high quality semiconductor heat sink plate can be manufactured at low cost. In particular, in the present invention, since the joining is performed while cooling with water, the thermal strain can be minimized. Therefore, repair work after joining is not required, and it can be manufactured at low cost.
【図１】本発明の実施例を示す上方向からの観察図であ
る。FIG. 1 is a top view showing an embodiment of the present invention.
【図２】本発明の実施例を示す図１の断面図である。FIG. 2 is a sectional view of FIG. 1 showing an embodiment of the present invention.
【図３】本発明の実施例を示す上方向からの観察図であ
る。FIG. 3 is an observation view from above showing an example of the present invention.
【図４】本発明の実施例を示す断面図である。FIG. 4 is a sectional view showing an embodiment of the present invention.
【図５】本発明の実施例を示す断面図である。FIG. 5 is a sectional view showing an embodiment of the present invention.
【図６】本発明の実施例を示す上方向からの観察図であ
る。FIG. 6 is an observation view from above showing an example of the present invention.
【図７】本発明の実施例を示す断面図である。FIG. 7 is a sectional view showing an embodiment of the present invention.
１…ヒートシンク板（パッキングプレート）、２…水冷
孔、３…給排水口、４…蓋、５…回転ツール、６…ピン
部、７…ショルダ部、８…接合部、９…ダミー板。DESCRIPTION OF SYMBOLS 1 ... Heat sink plate (packing plate), 2 ... Water cooling hole, 3 ... Water supply / drain opening, 4 ... Lid, 5 ... Rotary tool, 6 ... Pin part, 7 ... Shoulder part, 8 ... Joint part, 9 ... Dummy plate.
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ２３Ｋ 101:04 Ｈ０１Ｌ 23/36 Ｚ 103:10 21/302 Ｂ 103:12 23/46 Ｚ (72)発明者 青田 欣也 茨城県日立市大みか町七丁目１番１号 株 式会社日立製作所日立研究所内 (72)発明者 青野 泰久 茨城県日立市大みか町七丁目１番１号 株 式会社日立製作所日立研究所内 (72)発明者 香川 ▲学▼ 茨城県日立市助川町三丁目１番１号 日立 電線株式会社電線工場内 Ｆターム(参考） 4E067 AA05 AA07 BG00 BG06 EB00 5F004 BB15 BB25 5F036 BA10 BA23 BB01 BB41 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) B23K 101: 04 H01L 23/36 Z 103: 10 21/302 B 103: 12 23/46 Z (72) Inventor Kinya Aota 7-1-1, Omika-cho, Hitachi City, Ibaraki Prefecture, Hitachi, Ltd.Hitachi Research Laboratory, Ltd. Inventor Kagawa ▲ Study 3-1-1, Sukekawa-cho, Hitachi-shi, Ibaraki F-term in the electric wire factory of Hitachi Cable, Ltd. (reference) 4E067 AA05 AA07 BG00 BG06 EB00 5F004 BB15 BB25 5F036 BA10 BA23 BB01 BB41
Claims (7)
閉される構造の銅または銅合金またはアルミニウムまた
はアルミニウム合金からなるヒートシンク板（パッキン
グプレート）の製作方法において、前記ヒートシンク板
の冷却孔と蓋と密閉は摩擦攪拌接合方法により金属的に
接合して製作されることを特徴とするヒートシンク板の
製作方法。1. A method of manufacturing a heat sink plate (packing plate) having a cooling hole therein, the cooling hole being made of copper, a copper alloy, aluminum, or an aluminum alloy having a structure closed by a lid. A method for manufacturing a heat sink plate, wherein the cooling hole, the lid and the seal are metallically joined by a friction stir welding method.
たは不活性ガスのいずれかの冷却剤の中でまたは接合部
の近傍または全体に前記冷却剤をかけながら接合するこ
とを特徴とするヒートシンク板の製作方法。2. The joining according to claim 1, wherein the joining is performed while applying the coolant in a coolant of water, oil, or an inert gas, or near or to the entire joint. How to make a heat sink plate.
ツールにより同時にまたは接合進行方向に対して、複数
の前記ツールの間に一定の距離を設けて接合することを
特徴とするヒートシンク板の製作方法。3. The method according to claim 1, wherein a plurality of rotating tools are joined simultaneously or in a joining direction with a fixed distance between the tools. Production method.
ツールはお互いに交差する方向に接合することを特徴と
するヒートシンク板の製作方法。4. The method according to claim 1, wherein the plurality of rotating tools are joined in a direction crossing each other.
は、冷却孔から離れたヒートシンク板またはダミー部で
あることを特徴とするヒートシンク板の製作方法。5. The method according to claim 1, wherein the starting point or the ending point of the joining is a heat sink plate or a dummy part separated from the cooling hole.
トシンク板及び蓋の接合部は局部的に厚い構造であるこ
とを特徴とするヒートシンク板の接合構造。6. A joint structure for a heat sink plate according to claim 1, wherein the joint between the heat sink plate and the lid for sealing the cooling hole has a locally thick structure.
り製作されたヒートシンク板。7. A heat sink plate manufactured by the method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000132844A JP2001313357A (en) | 2000-04-27 | 2000-04-27 | Method for manufacturing heat sink plate, and heat sink structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000132844A JP2001313357A (en) | 2000-04-27 | 2000-04-27 | Method for manufacturing heat sink plate, and heat sink structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006010587A Division JP4475239B2 (en) | 2006-01-19 | 2006-01-19 | Manufacturing method of heat sink plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001313357A true JP2001313357A (en) | 2001-11-09 |
Family
ID=18641462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000132844A Pending JP2001313357A (en) | 2000-04-27 | 2000-04-27 | Method for manufacturing heat sink plate, and heat sink structure |
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| JP (1) | JP2001313357A (en) |
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