CN112091343A - Brazing method of molybdenum target and back plate - Google Patents
Brazing method of molybdenum target and back plate Download PDFInfo
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- CN112091343A CN112091343A CN202010953695.0A CN202010953695A CN112091343A CN 112091343 A CN112091343 A CN 112091343A CN 202010953695 A CN202010953695 A CN 202010953695A CN 112091343 A CN112091343 A CN 112091343A
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- back plate
- molybdenum target
- welding
- brazing method
- flat welding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Abstract
The invention provides a brazing method of a molybdenum target and a back plate. The brazing method can solve the problem that local desoldering is caused due to the fact that a sink structure is welded and the number of welding materials on a welded step is small, the welding overall combination rate is high, and the single defect rate is low.
Description
Technical Field
The invention belongs to the field of target material manufacturing, and relates to a method for brazing a molybdenum target material and a back plate.
Background
Sputtering Target Back Plate (BP): metal sputtering targets are materials used as cathodes in sputter deposition techniques. The cathode material is separated from the cathode in the form of molecules, atoms or ions under the impact of positive charged cations in a sputtering machine and is redeposited on the surface of the anode. Since the metal sputtering target is usually a relatively expensive material such as high-purity aluminum, copper, titanium, nickel, tantalum, and noble metal, a relatively common material is often used as the backing plate in the manufacturing process. The back plate has the functions of supporting the target material, cooling, reducing the cost and the like, and common materials comprise aluminum Alloy (ALBP), copper alloy (CUBP) and the like.
Braze (Brazing and Brazing, SB): a welding method using a metal material with a melting point lower than that of a base metal as a brazing filler metal, wetting the base metal with the brazing filler metal, filling a gap between a workpiece interface and the base metal, and mutually diffusing the base metal and the brazing filler metal to form a weld joint. The brazing deformation is small, the joint is smooth and attractive, and the method is suitable for welding components which are precise, complex and composed of different materials. Vacuum brazing is a technique of heating brazing filler metal to weld workpieces in a vacuum brazing furnace in a vacuum state.
CN106270866A discloses a welding method of a rotary molybdenum target, wherein a positioning sealing sleeve is fixed on a base, a back tube is fixed on the inner side of the positioning sealing sleeve, a first rotary molybdenum target is sleeved on the back tube, the bottom of the first rotary molybdenum target is fixed with the top of the positioning sealing sleeve, the axes of the first rotary molybdenum target, the positioning sealing sleeve and the back tube are overlapped, a heater is used for heating the back tube and the first rotary molybdenum target from inside to outside, and solder is distributed on the surfaces among the first rotary molybdenum target, the positioning sealing sleeve and the back tube for wetting treatment; heating the back tube and the first rotary molybdenum target material from inside to outside by using a heater; injecting liquid solder into a space formed by the back tube, the positioning sealing sleeve and the first rotary molybdenum target from the upper part of the first rotary molybdenum target, cooling the liquid solder section by section from bottom to top to solidify the solder, and rotating the welded structure by 180 degrees to enable the first rotary molybdenum target to be positioned at the top of the back tube; sequentially sleeving a second rotary molybdenum target and a positioning sealing sleeve from the bottom of a back tube, clamping a clamp between the second rotary molybdenum target and a support, adjusting the clamp to enable the axes of the second rotary molybdenum target, the positioning sealing sleeve and the back tube to coincide, reserving a reserved size between the top of the second rotary molybdenum target and the bottom of the first rotary molybdenum target, abutting the positioning sealing sleeve between the bottom of the second rotary molybdenum target and the back tube, heating the back tube and the second rotary molybdenum target from inside to outside, and distributing solder on the surfaces among the second rotary molybdenum target, the positioning sealing sleeve and the back tube for wetting treatment; heating the back tube and the second rotary molybdenum target material from inside to outside by using a heater; and injecting liquid solder into a space formed by the back tube, the positioning sealing sleeve and the second rotary molybdenum target from the upper part of the second rotary molybdenum target, cooling the liquid solder section by section from bottom to top to solidify the solder, and welding the third rotary molybdenum target and the second rotary molybdenum target.
CN107552907A discloses a green and efficient target and back plate brazing device, which includes a welding heating table, a solder heating device, a laser scanning processing device and a brazing pressurizing component; wherein, a laser scanning processing device is arranged above a welding working area of the welding heating table, and a heating controller is connected below the welding heating table; placing a target material and a back plate on the welding heating table opposite to the laser scanning head; a solder heating device is arranged on one side of the welding heating table, and a matched brazing pressurizing component is placed on the target material and the back plate for pressing when the target material and the back plate are attached and cooled; the laser scanning processing device is composed of a laser which is respectively connected with a light path transmission system and a light path motion control system, and the laser and the light path transmission system are respectively connected with a relevant interface of a laser scanning head.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention provides the brazing method of the molybdenum target and the back plate, the brazing method can solve the problems of local desoldering caused by the fact that a sink structure is welded and the welding flux on a welding rear step is less, the welding overall combination rate is high, and the single defect rate is low.
In a preferred embodiment of the present invention, a solder layer is provided on the soldering surface of the flat soldering.
In a preferred embodiment of the present invention, the thickness of the solder layer is 0.15 to 0.25mm, such as 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, 0.21mm, 0.22mm, 0.23mm, or 0.24mm, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
In a preferred embodiment of the present invention, the raw material of the solder layer includes indium.
In a preferred embodiment of the present invention, the temperature of the flat welding is 200 to 220 ℃, for example, 202 ℃, 205 ℃, 208 ℃, 210 ℃, 212 ℃, 215 ℃ or 218 ℃, but the flat welding is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
As the preferable technical scheme of the invention, the flat welding process needs to be pressed by a pressing block.
Preferably, the briquettes have a weight of 55 to 65kg, such as 56kg, 57kg, 58kg, 59kg, 60kg, 61kg, 62kg, 63kg or 64kg, but not limited to the recited values, and other values not recited in this range of values are equally applicable.
As a preferred technical scheme of the invention, the density of the molybdenum target material is more than or equal to 97%, the grain size is less than or equal to 100 mu m, the conductivity is 18 +/-2 Ms/m, the hardness is 100-200 HV, and the planeness is less than 0.2.
The molybdenum target may have a density of 97.5%, 98%, 98.5%, 99% or 99.5%, etc., a grain size of 90 μm, 80 μm, 70 μm, 60 μm or 50 μm, etc., an electrical conductivity of 16.5Ms/m, 17Ms/m, 17.5Ms/m, 18Ms/m, 18.5Ms/m, 19Ms/m or 19.5Ms/m, etc., and a hardness of 110HV, 120HV, 130HV, 140HV, 150HV, 160HV, 170HV, 180HV or 190HV, etc., but is not limited to the values listed, and other values not listed in the above ranges are also applicable.
As a preferred technical scheme of the invention, the back plate comprises an ALBP back plate and a CUBP back plate.
In a preferred embodiment of the present invention, the back plate has a groove depth of 0.1 to 0.3mm, such as 0.12mm, 0.15mm, 0.18mm, 0.20mm, 0.22mm, 0.25mm, or 0.28mm, but the number is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
Preferably, the diameter of the groove of the back plate is smaller than the diameter of the molybdenum target by 25-30 mm, such as 25.5mm, 26mm, 26.5mm, 27mm, 27.5mm, 28mm, 28.5mm, 29mm or 29.5mm, but not limited to the enumerated values, and other non-enumerated values in the numerical range are also applicable.
As a preferred embodiment of the present invention, the method for brazing the molybdenum target to the backing plate includes:
the molybdenum target and a platform on the outer side of the groove of the back plate are subjected to flat welding, an indium solder layer with the thickness of 0.15-0.25 mm is arranged on a welding surface of the flat welding, the temperature of the flat welding is 200-220 ℃, pressing blocks are required to be pressed in the flat welding process, and the weight of the pressing blocks is 55-65 kg.
In the invention, the flat welding operation further comprises: target material infiltration: scraping the surface solder by using silica gel, wherein the welding surface is uniformly attached by silvery white solder; back plate infiltration: the surface of the area scratched by the ultrasonic head has no bubbles, is silvery white, and has good fluidity. And cooling along with the furnace after welding. And after welding, ensuring that no solder overflows from the welding position.
Compared with the prior art, the invention has at least the following beneficial effects:
the invention provides a brazing method of a molybdenum target and a back plate, which can solve the problem of local desoldering caused by the fact that a sink structure is welded and the welding flux on a welded step is less, wherein the integral bonding rate of welding is not lower than 97%, and the single defect rate is not more than 1.5%.
Drawings
Fig. 1 is a schematic view of a brazing structure of a molybdenum target and a backing plate provided in the present application;
in the figure: 1-backboard, 2-backboard groove and 3-target material.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
example 1
The embodiment provides a method for brazing a molybdenum target and a back plate, which comprises the following steps:
the molybdenum target and the platform on the outer side of the back plate groove are subjected to flat welding, an indium solder layer with the thickness of 0.15mm is arranged on the welding surface of the flat welding, the temperature of the flat welding is 200 ℃, pressing blocks are required to be pressed in the flat welding process, the weight of the pressing blocks is 55kg, and the molybdenum target and the platform are cooled along with a furnace after the welding.
The back plate is an ALBP back plate, the depth of a groove of the back plate is 0.1mm, and the diameter of the groove of the back plate is smaller than the diameter of the molybdenum target material by 25 mm.
Example 2
The embodiment provides a method for brazing a molybdenum target and a back plate, which comprises the following steps:
the molybdenum target and the platform outside the groove of the back plate are subjected to flat welding, an indium solder layer with the thickness of 0.25mm is arranged on the welding surface of the flat welding, the temperature of the flat welding is 220 ℃, pressing needs to be carried out in the flat welding process, and the weight of the pressing block is 65 kg.
The back plate is a CUBP back plate, the depth of the groove of the back plate is 0.3mm, and the diameter of the groove of the back plate is 30mm smaller than that of the molybdenum target material.
Example 3
The embodiment provides a method for brazing a molybdenum target and a back plate, which comprises the following steps:
the molybdenum target and a platform on the outer side of the groove of the back plate are subjected to flat welding, an indium solder layer with the thickness of 0.22mm is arranged on a welding surface of the flat welding, the temperature of the flat welding is 215 ℃, pressing is required to be carried out in the flat welding process, and the weight of the pressing block is 63 kg.
The back plate is an ALBP back plate, the depth of a groove of the back plate is 0.25mm, and the diameter of the groove of the back plate is smaller than the diameter of the molybdenum target material by 28 mm.
Example 4
The embodiment provides a method for brazing a molybdenum target and a back plate, which comprises the following steps:
the molybdenum target and the platform on the outer side of the back plate groove are subjected to flat welding, an indium solder layer with the thickness of 0.18mm is arranged on the welding surface of the flat welding, the temperature of the flat welding is 205 ℃, pressing needs to be carried out in the flat welding process, and the weight of the pressing block is 57 kg.
The back plate is a CUBP back plate, the depth of the groove of the back plate is 0.15mm, and the diameter of the groove of the back plate is smaller than the diameter of the molybdenum target material by 26 mm.
Example 5
The embodiment provides a method for brazing a molybdenum target and a back plate, which comprises the following steps:
the molybdenum target and a platform on the outer side of the back plate groove are subjected to flat welding, an indium solder layer with the thickness of 0.20mm is arranged on a welding surface of the flat welding, the temperature of the flat welding is 210 ℃, pressing needs to be carried out in the flat welding process, and the weight of the pressing block is 58 kg.
The back plate is a CUBP back plate, the depth of the groove of the back plate is 0.20mm, and the diameter of the groove of the back plate is smaller than the diameter of the molybdenum target material by 27 mm.
Comparative example 1
This comparative example was conducted under the same conditions as in example 5 except that the flat welding was replaced with the sink welding.
The welding surfaces of the molybdenum target materials and the backing plate obtained in examples 1 to 5 and comparative example 1 were tested, and the welding effect was verified by using the C-SCAN test, wherein the test conditions are shown in table 1, and the results are shown in table 2.
TABLE 1
| Detection conditions | Product(s) |
| Probe head | 10MHZ |
| Sensitivity of the device | 36dB |
| Acoustic velocity of material | 4000m/s |
| Distance to water | 85.38mm |
| Distance between X-axis | 0.2mm |
| Distance between Y-axis | 0.2mm |
| Scanning speed | 100mm/s |
| Scanning range | / |
| Scanning direction | Y-X |
| Threshold value | TH＝60 |
TABLE 2
| Overall binding rate/%) | Single defect rate/%) | |
| Example 1 | 97.2 | 1.3 |
| Example 2 | 98.7 | 0.7 |
| Example 3 | 98.5 | 0.9 |
| Example 4 | 97.5 | 1.1 |
| Example 5 | 98.1 | 0.9 |
| Comparative example 1 | 92.6 | 3.7 |
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. The brazing method of the molybdenum target and the back plate is characterized by comprising the step of carrying out flat welding on the molybdenum target and a platform on the outer side of a groove of the back plate.
2. The brazing method according to claim 1, wherein a solder layer is provided on the bonding surface of the flat bonding.
3. The brazing method according to claim 2, wherein the thickness of the solder layer is 0.15 to 0.25 mm.
4. The brazing method according to any one of claims 1 to 3, wherein a raw material of the solder layer includes indium.
5. The brazing method according to any one of claims 1 to 4, wherein the temperature of the flat welding is 200 to 220 ℃.
6. The brazing method according to any one of claims 1 to 5, wherein a pressing block is pressed during the flat welding;
preferably, the weight of the briquettes is 55-65 kg.
7. The brazing method according to any one of claims 1 to 6, wherein the density of the molybdenum target material is more than or equal to 97%, the grain size is less than or equal to 100 μm, the conductivity is 18 +/-2 Ms/m, the hardness is 100-200 HV, and the flatness is less than 0.2.
8. The brazing method according to any one of claims 1 to 7, wherein the backing plate comprises an ALBP backing plate and a CUBP backing plate.
9. The brazing method according to any one of claims 1 to 8, wherein the back sheet has a groove depth of 0.1 to 0.3 mm;
preferably, the diameter of the groove of the back plate is 25-30 mm smaller than the diameter of the molybdenum target.
10. Brazing method according to any one of claims 1 to 9, characterized in that it comprises:
the molybdenum target and a platform on the outer side of the groove of the back plate are subjected to flat welding, an indium solder layer with the thickness of 0.15-0.25 mm is arranged on a welding surface of the flat welding, the temperature of the flat welding is 200-220 ℃, pressing blocks are required to be pressed in the flat welding process, and the weight of the pressing blocks is 55-65 kg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010953695.0A CN112091343A (en) | 2020-09-11 | 2020-09-11 | Brazing method of molybdenum target and back plate |
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| CN202010953695.0A CN112091343A (en) | 2020-09-11 | 2020-09-11 | Brazing method of molybdenum target and back plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113210785A (en) * | 2021-06-02 | 2021-08-06 | 宁波江丰电子材料股份有限公司 | Brazing method of aluminum-scandium alloy target |
| CN114086131A (en) * | 2021-11-23 | 2022-02-25 | 宁波江丰电子材料股份有限公司 | Ceramic target brazing structure lower than brazing filler metal density |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104342619A (en) * | 2013-07-31 | 2015-02-11 | 宁波江丰电子材料股份有限公司 | Method for manufacturing molybdenum target material |
| CN104419907A (en) * | 2013-09-11 | 2015-03-18 | 宁波江丰电子材料股份有限公司 | Target material component and formation method thereof |
| CN205996402U (en) * | 2016-08-30 | 2017-03-08 | 有研亿金新材料有限公司 | A kind of layer structure of soldering target |
| JP2017060990A (en) * | 2015-09-23 | 2017-03-30 | 住華科技股▲フン▼有限公司Ｓｕｍｉｋａ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | Solder, sputtering target material and method of manufacturing sputtering target material |
| CN108237279A (en) * | 2016-12-27 | 2018-07-03 | 宁波江丰电子材料股份有限公司 | The welding method of target material assembly and target material assembly welding structure |
| CN110756937A (en) * | 2019-12-02 | 2020-02-07 | 宁波江丰电子材料股份有限公司 | Brazing method for target and back plate |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
-
2020
- 2020-09-11 CN CN202010953695.0A patent/CN112091343A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104342619A (en) * | 2013-07-31 | 2015-02-11 | 宁波江丰电子材料股份有限公司 | Method for manufacturing molybdenum target material |
| CN104419907A (en) * | 2013-09-11 | 2015-03-18 | 宁波江丰电子材料股份有限公司 | Target material component and formation method thereof |
| JP2017060990A (en) * | 2015-09-23 | 2017-03-30 | 住華科技股▲フン▼有限公司Ｓｕｍｉｋａ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | Solder, sputtering target material and method of manufacturing sputtering target material |
| CN205996402U (en) * | 2016-08-30 | 2017-03-08 | 有研亿金新材料有限公司 | A kind of layer structure of soldering target |
| CN108237279A (en) * | 2016-12-27 | 2018-07-03 | 宁波江丰电子材料股份有限公司 | The welding method of target material assembly and target material assembly welding structure |
| CN110756937A (en) * | 2019-12-02 | 2020-02-07 | 宁波江丰电子材料股份有限公司 | Brazing method for target and back plate |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113210785A (en) * | 2021-06-02 | 2021-08-06 | 宁波江丰电子材料股份有限公司 | Brazing method of aluminum-scandium alloy target |
| CN114086131A (en) * | 2021-11-23 | 2022-02-25 | 宁波江丰电子材料股份有限公司 | Ceramic target brazing structure lower than brazing filler metal density |
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