CN114059028A - Brazing structure of copper back plate and processing method thereof - Google Patents
Brazing structure of copper back plate and processing method thereof Download PDFInfo
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- CN114059028A CN114059028A CN202111353282.XA CN202111353282A CN114059028A CN 114059028 A CN114059028 A CN 114059028A CN 202111353282 A CN202111353282 A CN 202111353282A CN 114059028 A CN114059028 A CN 114059028A
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- back plate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Abstract
The invention provides a brazing structure of a copper back plate and a processing method of the brazing structure. The structure reduces welding defects, improves the welding combination rate of the back plate and the target, and the processing method improves the flatness of the mounting groove on the front surface of the back plate.
Description
Technical Field
The invention belongs to the field of target processing, and relates to a brazing structure of a copper back plate and a processing method thereof.
Background
Sputtering Target Back Plate (BP): metal sputtering targets are materials used as cathodes in sputter deposition techniques. The cathode material is separated from the cathode in the form of molecules, atoms or ions under the impact of positive charged cations in a sputtering machine and is redeposited on the surface of the anode. Since the metal sputtering target is usually a relatively expensive material such as high-purity aluminum, copper, titanium, nickel, tantalum, and noble metal, a relatively common material is often used as the backing plate in the manufacturing process. The back plate has the functions of supporting the target material, cooling, reducing the cost and the like, and common materials comprise aluminum Alloy (ALBP), copper alloy (CUBP) and the like.
Braze (Brazing and Brazing, SB): a welding method using a metal material with a melting point lower than that of a base metal as a brazing filler metal, wetting the base metal with the brazing filler metal, filling a gap between a workpiece interface and the base metal, and mutually diffusing the base metal and the brazing filler metal to form a weld joint. The brazing deformation is small, the joint is smooth and attractive, and the method is suitable for welding components which are precise, complex and composed of different materials. Vacuum brazing is a technique of heating brazing filler metal to weld workpieces in a vacuum brazing furnace in a vacuum state.
CN205996402U discloses a welding layer structure of a brazing target, wherein the welding layer structure of the brazing target is that the welding surfaces of the target are all planes; the welding surface of the back plate is a flat-bottom groove or a concave lens curved surface, and the periphery is a narrow plane; the welding surface of the back plate is upward, the welding surface of the target material is downward, and a welding layer coated with brazing material between the back plate and the target material is formed. The brazing solder is In and In alloy, Sn and Sn alloy; the target material is W and W alloy, Mo and Mo alloy, Cr and Cr alloy, Ru and Ru alloy, Al2O3, MgO and other oxides; the back plate is made of Cu and Cu alloy, Al and Al alloy, stainless steel, Ti, Mo and Mo alloy. The welding process of the target material with the welding layer structure is simple and controllable, the welding line is attractive, and the unfavorable phenomena of material shortage, welding line water seepage and the like which are easily caused on the periphery of the welding layer of the common brazing target material are effectively avoided.
CN107552907A discloses a green and efficient target and backing plate brazing device and method, the brazing device includes a welding heating table, a solder heating device, a laser scanning processing device, and a brazing pressurizing component, and integrates the processes of target and backing plate heating, laser scanning cleaning and surface texturing processing, solder spreading, target and backing plate pressing, and the provided device can realize short-flow target and backing plate welding. The device does not need processes such as chemical cleaning, sand blasting and the like before welding, and has the advantages of short welding process, energy conservation, environmental protection, low cost and high efficiency.
However, the brazing structure or the brazing device provided in the prior art cannot solve the problems that the bonding rate of the copper back plate and the target material is low and the flatness of the mounting groove is low.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention provides a brazing structure of a copper back plate and a processing method thereof.
In order to achieve the technical effect, the invention adopts the following technical scheme:
one of the purposes of the invention is to provide a brazing structure of a copper back plate, which comprises a back plate, wherein a welding surface of the back plate is fixedly connected with a target material, a groove is arranged on the welding surface of the back plate, the groove is positioned between the back plate and the target material, and a brazing solder groove is arranged at the bottom of the groove.
In the invention, the welding surface of the back plate is fixedly connected with the target material through flat welding.
In the invention, the bottom of the groove is provided with the solder groove, and the soldering strength of the copper target material and the back plate is improved by storing the solder in the groove in the soldering process.
In a preferred embodiment of the present invention, the ratio of the depth of the solder groove to the depth of the recess is 1:10 to 20, for example, 1:11, 1:12, 1:13, 1:14, 1:15, 1:16, 1:17, 1:18, or 1:19, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
As a preferable technical scheme of the invention, the front surface of the back plate is provided with a mounting groove, a threaded hole and an exhaust groove.
In the invention, the mounting groove is used for mounting the ceramic ring.
In a preferred embodiment of the present invention, the flatness of the mounting groove is less than 0.1mm, such as 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, or 0.09mm, but the mounting groove is not limited to the above-mentioned values, and other values not listed in the above-mentioned value range are also applicable.
As a preferable technical scheme of the invention, the back surface of the back plate is provided with an O-ring groove, an exhaust groove and a drainage/exhaust notch.
Another object of the present invention is to provide a method for processing the above-described brazed structure, the method including:
roughly turning the back plate, and turning the contour, the solder groove and the threaded hole of the back plate;
assembling the back plate and then brazing the back plate and the back plate;
machining the front face of the back plate to obtain the mounting groove;
and polishing the back surface of the back plate.
As a preferred embodiment of the present invention, the back plate is machined under full-circumference clamping.
As a preferred technical solution of the present invention, the clamping depth is equal to the thickness of the back plate.
In the invention, the condition of the welding seam can be judged by machining after welding.
As a preferable technical scheme of the invention, the roughness Ra of the bottom of the polished O-ring groove is less than or equal to 0.8 mu m, and the roughness Ra of the surface except the bottom of the O-ring groove is less than or equal to 1.6 mu m.
The roughness Ra of the bottom of the O-ring grooves may be 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, or 0.7 μm, and the roughness Ra of the surface other than the bottom of the O-ring grooves may be 0.2 μm, 0.5 μm, 0.8 μm, 1.0 μm, 1.2 μm, or 1.5 μm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
As a preferred embodiment of the present invention, the method for processing the brazed structure includes:
roughly turning the back plate, and turning the contour, the solder groove and the threaded hole of the back plate;
assembling the back plate and then brazing the back plate and the back plate;
machining the front face of the back plate to obtain the mounting groove, wherein the machining is carried out under the clamping of the whole periphery of the back plate, and the clamping depth is equal to the thickness of the back plate;
and polishing the back surface of the back plate, wherein the roughness Ra of the bottom of the O-ring groove after polishing is less than or equal to 0.8 mu m, and the roughness Ra of the surface except the bottom of the O-ring groove is less than or equal to 1.6 mu m.
Compared with the prior art, the invention has at least the following beneficial effects:
the invention provides a brazing structure of a copper back plate and a processing method thereof, wherein the brazing structure reduces welding defects, improves the welding bonding rate of the back plate and a target material, the welding bonding rate is more than or equal to 97%, the single defect rate is less than or equal to 1.5%, and the processing method improves the flatness of a mounting groove in the front surface of the back plate, and the flatness of the mounting groove is less than 0.1 mm.
Drawings
FIG. 1 is a schematic illustration of a brazing structure for a copper backing plate provided in part by the present invention;
in the figure: 1-backboard, 2-target material.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Detailed Description
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
example 1
The embodiment provides a brazing structure of a copper back plate, the structure is shown in fig. 1, the brazing structure comprises a back plate, a back plate welding surface is fixedly connected with a target, a groove is formed in the back plate welding surface, the groove is located between the back plate and the target, a solder groove is formed in the bottom of the groove, the depth ratio of the solder groove to the depth of the groove is 1:10, an installation groove, a threaded hole and an exhaust groove are formed in the front surface of the back plate, and an O-ring groove, an exhaust groove and a drainage/exhaust gap are formed in the back surface of the back plate.
The processing method of the brazing structure comprises the following steps:
roughly turning the back plate, and turning the contour, the solder groove and the threaded hole of the back plate;
assembling the back plate and then brazing the back plate and the back plate;
machining the front face of the back plate to obtain the mounting groove, wherein the machining is carried out under the clamping of the whole periphery of the back plate, and the clamping depth is equal to the thickness of the back plate;
and polishing the back surface of the back plate, wherein the roughness Ra of the bottom of the O-ring groove after polishing is less than or equal to 0.8 mu m, and the roughness Ra of the surface except the bottom of the O-ring groove is less than or equal to 1.2 mu m.
Example 2
The embodiment provides a brazing structure of a copper back plate, the structure is shown in fig. 1, the brazing structure comprises a back plate, a back plate welding surface is fixedly connected with a target, a groove is formed in the back plate welding surface, the groove is located between the back plate and the target, a solder groove is formed in the bottom of the groove, the depth ratio of the solder groove to the depth of the groove is 1:20, an installation groove, a threaded hole and an exhaust groove are formed in the front surface of the back plate, and an O-ring groove, an exhaust groove and a drainage/exhaust gap are formed in the back surface of the back plate.
The processing method of the brazing structure comprises the following steps:
roughly turning the back plate, and turning the contour, the solder groove and the threaded hole of the back plate;
assembling the back plate and then brazing the back plate and the back plate;
machining the front face of the back plate to obtain the mounting groove, wherein the machining is carried out under the clamping of the whole periphery of the back plate, and the clamping depth is equal to the thickness of the back plate;
and polishing the back surface of the back plate, wherein the roughness Ra of the bottom of the O-ring groove after polishing is less than or equal to 0.8 mu m, and the roughness Ra of the surface except the bottom of the O-ring groove is less than or equal to 1.6 mu m.
Example 3
The embodiment provides a brazing structure of a copper back plate, the structure is shown in fig. 1, the brazing structure comprises a back plate, a back plate welding surface is fixedly connected with a target, a groove is formed in the back plate welding surface, the groove is located between the back plate and the target, a solder groove is formed in the bottom of the groove, the depth ratio of the solder groove to the depth of the groove is 1:15, an installation groove, a threaded hole and an exhaust groove are formed in the front surface of the back plate, and an O-ring groove, an exhaust groove and a drainage/exhaust gap are formed in the back surface of the back plate.
The processing method of the brazing structure comprises the following steps:
roughly turning the back plate, and turning the contour, the solder groove and the threaded hole of the back plate;
assembling the back plate and then brazing the back plate and the back plate;
machining the front face of the back plate to obtain the mounting groove, wherein the machining is carried out under the clamping of the whole periphery of the back plate, and the clamping depth is equal to the thickness of the back plate;
and polishing the back surface of the back plate, wherein the roughness Ra of the bottom of the O-ring groove after polishing is less than or equal to 0.5 mu m, and the roughness Ra of the surface except the bottom of the O-ring groove is less than or equal to 1.0 mu m.
Example 4
This example was the same as example 3 except that the ratio of the depth of the solder groove to the depth of the recess was 1: 12.
Example 5
This example was the same as example 3 except that the ratio of the depth of the solder groove to the depth of the recess was 1: 18.
Comparative example 1
This comparative example was the same as example 3 except that no solder bath was provided.
Comparative example 2
This comparative example was the same as example 3 except that the ratio of the depth of the solder groove to the depth of the recess was 1: 5.
Comparative example 3
This comparative example was the same as example 3 except that the ratio of the depth of the solder groove to the depth of the recess was 1: 25.
Comparative example 4
This comparative example was conducted under the same conditions as example 3 except that no clamping was performed during the processing of the backing plate.
Comparative example 5
This comparative example was conducted under the same conditions as example 3 except that the clamping depth was half the thickness of the back sheet during the processing of the back sheet machine.
Comparative example 6
This comparative example was conducted under the same conditions as example 3 except that the clamping depth during the processing of the backing plate was 150% of the thickness of the backing plate.
For the brazing conditions in examples 1 to 5 and comparative examples 1 to 6: the brazing temperature is 200 ℃, so that the solder fully infiltrates the welding surface, and the brazing is completed after the pressure is 60kg and the pressure is cooled.
The targets used in examples 1-5 and comparative examples 1-6 were 5N purity titanium targets and the backing plate was a C18000 copper backing plate. The welding effect is verified by adopting C-SCAN detection, the detection conditions are shown in table 1, the flatness of the mounting groove is tested by adopting a flatness meter, and the result is shown in table 2.
TABLE 1
TABLE 2
| Overall bonding rate/％ | Single defect rate/%) | Flatness/mm | |
| Example 1 | 97.2 | 1.5 | 0.08 |
| Example 2 | 98.9 | 0.8 | 0.08 |
| Example 3 | 98.5 | 1.1 | 0.07 |
| Example 4 | 98.2 | 1.3 | 0.08 |
| Example 5 | 98.6 | 1.0 | 0.07 |
| Comparative example 1 | 93.1 | 2.6 | 0.08 |
| Comparative example 2 | 95.6 | 2.1 | 0.07 |
| Comparative example 3 | 96.0 | 1.9 | 0.08 |
| Comparative example 4 | 98.5 | 0.8 | 0.23 |
| Comparative example 5 | 98.5 | 0.8 | 0.16 |
| Comparative example 6 | 98.4 | 0.8 | 0.12 |
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. The brazing structure of the copper back plate is characterized by comprising the back plate, wherein a back plate welding surface is fixedly connected with a target material, a groove is formed in the back plate welding surface and located between the back plate and the target material, and a brazing solder groove is formed in the bottom of the groove.
2. The brazing structure according to claim 1, wherein a ratio of a depth of the solder groove to a depth of the groove is 1:10 to 20.
3. The brazing structure according to claim 1 or 2, wherein the back plate front face is provided with mounting grooves, threaded holes, and exhaust grooves.
4. The brazing structure according to claim 3, wherein the flatness of the mounting groove is < 0.1 mm.
5. The brazing structure according to any one of claims 1 to 4, wherein the back plate is provided with O-ring grooves, vent grooves and drain/vent notches on the back surface.
6. A method of processing a brazed structure according to any one of claims 1 to 5, comprising:
roughly turning the back plate, and turning the contour, the solder groove and the threaded hole of the back plate;
assembling the back plate and then brazing the back plate and the back plate;
machining the front face of the back plate to obtain the mounting groove;
and polishing the back surface of the back plate.
7. The method of machining as claimed in claim 6, wherein the backing plate is machined under full circumferential clamping.
8. The process of claim 7 wherein the depth of said clamping is equal to the thickness of said backing plate.
9. The machining method according to any one of claims 6 to 8, wherein the roughness Ra of the bottom of the O-ring groove after polishing is 0.8 μm or less, and the roughness Ra of the surface other than the bottom of the O-ring groove is 1.6 μm or less.
10. The process according to any one of claims 6 to 9, characterized in that it comprises:
roughly turning the back plate, and turning the contour, the solder groove and the threaded hole of the back plate;
assembling the back plate and then brazing the back plate and the back plate;
machining the front face of the back plate to obtain the mounting groove, wherein the machining is carried out under the clamping of the whole periphery of the back plate, and the clamping depth is equal to the thickness of the back plate;
and polishing the back surface of the back plate, wherein the roughness Ra of the bottom of the O-ring groove after polishing is less than or equal to 0.8 mu m, and the roughness Ra of the surface except the bottom of the O-ring groove is less than or equal to 1.6 mu m.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116511752A (en) * | 2023-01-31 | 2023-08-01 | 度亘激光技术（苏州）有限公司 | Copper surface structure, preparation method and welding method thereof |
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| JPH0243362A (en) * | 1988-08-03 | 1990-02-13 | Hitachi Metals Ltd | Joined body of sputtering target and backing plate |
| CN104741773A (en) * | 2013-12-31 | 2015-07-01 | 宁波江丰电子材料股份有限公司 | Welding method for tungsten-titanium-aluminum target material component |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
| CN212169261U (en) * | 2020-05-15 | 2020-12-18 | 北京首航科学技术开发有限公司 | Nut fluting is with fixed frock |
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2021
- 2021-11-16 CN CN202111353282.XA patent/CN114059028A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243362A (en) * | 1988-08-03 | 1990-02-13 | Hitachi Metals Ltd | Joined body of sputtering target and backing plate |
| CN104741773A (en) * | 2013-12-31 | 2015-07-01 | 宁波江丰电子材料股份有限公司 | Welding method for tungsten-titanium-aluminum target material component |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
| CN212169261U (en) * | 2020-05-15 | 2020-12-18 | 北京首航科学技术开发有限公司 | Nut fluting is with fixed frock |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116511752A (en) * | 2023-01-31 | 2023-08-01 | 度亘激光技术（苏州）有限公司 | Copper surface structure, preparation method and welding method thereof |
| CN116511752B (en) * | 2023-01-31 | 2024-02-06 | 度亘核芯光电技术(苏州)有限公司 | Copper surface structure, preparation method and welding method thereof |
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