JP2015175542A - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
JP2015175542A
JP2015175542A JP2014051530A JP2014051530A JP2015175542A JP 2015175542 A JP2015175542 A JP 2015175542A JP 2014051530 A JP2014051530 A JP 2014051530A JP 2014051530 A JP2014051530 A JP 2014051530A JP 2015175542 A JP2015175542 A JP 2015175542A
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cover
fins
plate
container
spacer
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裕二 中野
Yuji Nakano
裕二 中野
忍 織戸
Shinobu Orito
忍 織戸
誉章 細野
Shigeyuki Hosono
誉章 細野
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2014051530A priority Critical patent/JP2015175542A/en
Priority to PCT/JP2015/001174 priority patent/WO2015136895A1/en
Publication of JP2015175542A publication Critical patent/JP2015175542A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/206Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device capable of corresponding to a variety of arrangements of high heat generating electronic components.SOLUTION: A cooling device 1 is configured by: a container 2 configured by an outer edge 2a and a bottom surface 4; and a cover unit 3 configured by a plurality of fins 7 having a step 7a, a cover 8 in which a slit 9 for penetrating the plurality of fins 7 is provided in parallel with a long side on one end side of the long side, a plate 10 in which a slit 11 is provided for further penetrating the plurality of fins 7 which have penetrated the cover 8 and a spacer 12 (spacer A12a, spacer B12b) which is provided on the whole periphery in the plate 10 and which holds an interval between the cover 8 and the plate 10. In the container 2, the bottom surface 4 comprises an opening surface 5 and a heat receiving surface 6. A plurality of protrusions 6a are provided at a screwing position corresponding to the arrangement of high heat generating components 20, which are cooling objects, at the heat receiving surface 6. The spacer A12a has a U-shape, and a plurality of grooves 13 in which a refrigerant passes are provided in the spacer B12b.

Description

本発明は、例えば、高発熱電子部品を搭載した携帯基地局等の冷却に用いられる冷却装置に関するものである。   The present invention relates to a cooling device used for cooling, for example, a mobile base station equipped with a high heat generating electronic component.

例えば、高発熱電子部品を搭載した携帯基地局等の冷却に用いられる冷却装置として、サーモサイフォン式冷却器が知られている(例えば、特許文献1参照)。   For example, a thermosiphon type cooler is known as a cooling device used for cooling a mobile base station or the like on which high heat-generating electronic components are mounted (for example, see Patent Document 1).

この冷却装置は、凝縮部と蒸発部を直に繋ぐ構造として、複数の通路を構成する押し出し型材を摩擦撹拌接合(FSW)にて1枚のプレート状に接合形成した蒸発部に所定の開口部を設けて、T字型に凝縮部を穴あきブレージングシート、あるいはロウ材のクラッド材シートを挟んでロウ付けして直接接合した構成とすることで、接合部を減少させ、構造を比較的簡単な構成としたものである。   This cooling device has a structure in which the condensing unit and the evaporation unit are directly connected to each other, and a predetermined opening is formed in the evaporation unit formed by joining the extrusion mold material constituting the plurality of passages into one plate shape by friction stir welding (FSW). And a T-shaped condensing part with a perforated brazing sheet or brazing clad sheet and brazed directly to reduce the joining part and make the structure relatively simple This is a simple configuration.

特開2002−134670号公報JP 2002-134670 A

このような従来の冷却装置においては、蒸発部に押し出し型材を用いた構成となっていたので、蒸発部に複数の高発熱電子部品を個々にねじ止めで取り付ける用途に使用するような場合には、ねじ止め位置には雌ねじ用の突起が必要となり、高発熱電子部品の様々な配置に対応できないという課題を有していた。   In such a conventional cooling device, since it has a configuration using an extrusion mold material in the evaporation part, in the case where it is used for an application in which a plurality of high heat generation electronic components are individually screwed to the evaporation part In addition, a female screw protrusion is required at the screwing position, which has a problem that it cannot cope with various arrangements of high heat-generating electronic components.

そこで本発明は、上記従来の課題を解決するものであり、高発熱電子部品の様々な配置に対応できる冷却装置を提供することを目的とする。   SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide a cooling device that can cope with various arrangements of highly heat-generating electronic components.

そして、この目的を達成するために、本発明の冷却装置は、段差を有する複数のフィンと、前記複数のフィンの枚数分のスリットを長辺の一端側に長辺と平行に設けた長方形の平板のカバーと、前記複数のフィンの枚数分のスリットを設けたプレートと、前記カバーと前記プレート間に設けたスペーサと、を備えたカバーユニットと、底面に冷却対象の発熱部品の配置に対応した複数の突起を設けるとともに前記底面の対向面に開口を有する容器とで構成した密閉空間内に充填した冷媒の相変換循環により発熱体を冷却する冷却装置であって、前記カバーと前記スペーサと前記プレートにより放熱空間を形成し、前記カバーユニットは、前記複数のフィンを前記段差が前記カバーに当接するまで前記カバーのスリット、前記プレートのスリットに挿入し、前記放熱空間内に前記複数のフィンを存在させた状態でロウ付けにより形成し、前記容器の開口に、前記プレート側に突出した前記複数のフィンを挿入し、前記容器の底面と前記カバーで受熱空間を形成するように前記容器と前記カバーユニットを配置し、前記カバーと前記容器の継ぎ目を摩擦撹拌接合し、前記放熱空間と前記受熱空間を密封するとともに前記放熱空間と前記受熱空間を連通させるものであり、これにより所期の目的を達成するものである。   In order to achieve this object, the cooling device of the present invention has a rectangular shape in which a plurality of fins having steps and slits corresponding to the number of the plurality of fins are provided on one end side of the long side in parallel with the long side. Corresponding to the arrangement of a cover unit having a flat cover, a plate provided with slits for the number of the plurality of fins, a spacer provided between the cover and the plate, and a heat generating component to be cooled on the bottom surface A cooling device that cools the heating element by phase conversion circulation of a refrigerant filled in a sealed space that is provided with a container having an opening on the opposite surface of the bottom surface, the cover and the spacer, A heat radiating space is formed by the plate, and the cover unit includes a slit in the cover and a slit in the plate until the step contacts the cover. And the plurality of fins are formed by brazing in a state where the plurality of fins are present in the heat dissipation space, and the plurality of fins protruding toward the plate are inserted into the opening of the container, and the bottom surface of the container The container and the cover unit are arranged so as to form a heat receiving space with the cover, and a joint between the cover and the container is friction stir joined, and the heat radiating space and the heat receiving space are sealed and the heat radiating space and the heat receiving space are sealed. It communicates the space and achieves the intended purpose.

以上のように本発明の冷却装置は、段差を有する複数のフィンと、前記複数のフィンの枚数分のスリットを長辺の一端側に長辺と平行に設けた長方形の平板のカバーと、前記複数のフィンの枚数分のスリットを設けたプレートと、前記カバーと前記プレート間に設けたスペーサと、を備えたカバーユニットと、底面に冷却対象の発熱部品の配置に対応した複数の突起を設けるとともに前記底面の対向面に開口を有する容器とで構成した密閉空間内に充填した冷媒の相変換循環により発熱体を冷却する冷却装置であって、前記カバーと前記スペーサと前記プレートにより放熱空間を形成し、前記カバーユニットは、前記複数のフィンを前記段差が前記カバーに当接するまで前記カバーのスリット、前記プレートのスリットに挿入し、前記放熱空間内に前記複数のフィンを存在させた状態でロウ付けにより形成し、前記容器の開口に、前記プレート側に突出した前記複数のフィンを挿入し、前記容器の底面と前記カバーで受熱空間を形成するように前記容器と前記カバーユニットを配置し、前記カバーと前記容器の継ぎ目を摩擦撹拌接合し、前記放熱空間と前記受熱空間を密封するとともに前記放熱空間と前記受熱空間を連通させているので、複数の突起は容器の底面に自由に配置されることにより高発熱電子部品の様々な配置に対応できる。   As described above, the cooling device of the present invention includes a plurality of fins having steps, a rectangular flat plate cover provided with slits corresponding to the number of the plurality of fins on one end side of the long side in parallel with the long side, A cover unit having a plate provided with slits for the number of fins, a spacer provided between the cover and the plate, and a plurality of protrusions corresponding to the arrangement of the heat generating components to be cooled are provided on the bottom surface. And a cooling device that cools the heating element by phase conversion circulation of the refrigerant filled in a sealed space formed by a container having an opening on the opposite surface of the bottom surface, wherein the heat dissipation space is formed by the cover, the spacer, and the plate. The cover unit is configured to insert the plurality of fins into the slit of the cover and the slit of the plate until the step comes into contact with the cover. Formed by brazing with the plurality of fins present therein, inserting the plurality of fins protruding toward the plate into the opening of the container, and forming a heat receiving space with the bottom surface of the container and the cover Since the container and the cover unit are arranged so that the joint between the cover and the container is friction stir joined, the heat radiation space and the heat receiving space are sealed, and the heat radiation space and the heat receiving space are communicated with each other. The plurality of protrusions can be freely arranged on the bottom surface of the container to cope with various arrangements of the high heat generation electronic components.

さらにフィンをカバーとプレートを貫通させるとともに放熱空間内に存在させているので、受熱空間で気化した冷媒との接触効率が向上し、高発熱部品の冷却効率を向上できる。   Further, since the fins are passed through the cover and the plate and are present in the heat radiation space, the contact efficiency with the refrigerant vaporized in the heat receiving space can be improved, and the cooling efficiency of the high heat-generating component can be improved.

また、カバーとプレート間に設けたスペーサにより、カバーとプレートおよび容器の材質にかかわらず摩擦撹拌接合できる。   In addition, the spacer provided between the cover and the plate enables friction stir welding regardless of the material of the cover, the plate, and the container.

さらに受熱空間と放熱空間の境界に配したスペーサに複数の溝を設けたことにより、摩擦撹拌接合するための強度を保つとともに、受熱空間から放熱空間及び放熱空間から受熱空間への冷媒の循環を妨げず、安定的に発熱部品の冷却が可能となる。   Furthermore, by providing a plurality of grooves in the spacer arranged at the boundary between the heat receiving space and the heat radiating space, the strength for friction stir welding is maintained, and the circulation of the refrigerant from the heat receiving space to the heat radiating space and from the heat radiating space to the heat receiving space is maintained. Without obstructing, it becomes possible to cool the heat generating component stably.

本発明の実施の形態1の冷却装置の斜視図The perspective view of the cooling device of Embodiment 1 of this invention 同冷却装置の分解斜視図Exploded perspective view of the cooling device 同カバーユニットの分解斜視図Exploded perspective view of the cover unit 同カバーユニットの断面(図2の平面Aによる切断断面)を示す構成図The block diagram which shows the cross section (cut cross section by the plane A of FIG. 2) of the cover unit 図1の平面Bによる切断断面を示す構成図The block diagram which shows the cross section by plane B of FIG. (a)同冷却装置の接合部を示すカバー側から見た正面図、(b)同冷却装置の接合部を示す背面図(A) The front view seen from the cover side which shows the junction part of the cooling device, (b) The rear view which shows the junction part of the cooling device 図1の平面Aによる切断断面を示す構成図The block diagram which shows the cut cross section by the plane A of FIG.

以下、本発明の実施の形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(実施の形態1)
図1から図7は、冷却装置の一実施形態を示すのもので、図1に示すように、冷却装置1は容器2とカバーユニット3で構成されている。
(Embodiment 1)
1 to 7 show an embodiment of a cooling device. As shown in FIG. 1, the cooling device 1 includes a container 2 and a cover unit 3.

図2に示すように、容器2は外縁2aと底面4で構成し、底面4は開口面5と受熱面6からなり、受熱面6は、冷却対象の発熱体としての高発熱部品20の配置に対応したねじ止め位置に突起6aを複数設けている。カバーユニット3は、複数のフィン7と、カバー8と、プレート10と、スペーサ12で構成されている。   As shown in FIG. 2, the container 2 includes an outer edge 2a and a bottom surface 4. The bottom surface 4 includes an opening surface 5 and a heat receiving surface 6. The heat receiving surface 6 is an arrangement of the high heat generating component 20 as a heating element to be cooled. A plurality of protrusions 6a are provided at screwing positions corresponding to the above. The cover unit 3 includes a plurality of fins 7, a cover 8, a plate 10, and a spacer 12.

図3に示すように、カバーユニット3は、段差7aを有する複数のフィン7と、複数のフィン7を貫通させるスリット9を長辺の一端側に長辺と平行に設けたカバー8と、カバー8を貫通した複数のフィン7をさらに貫通させるスリット11を設けたプレート10と、プレート内の全周に設けカバー8とプレート10との間隔を保持するスペーサ12(スペーサA12a、スペーサB12b)で構成されている。   As shown in FIG. 3, the cover unit 3 includes a plurality of fins 7 having steps 7 a, a cover 8 provided with slits 9 penetrating the plurality of fins 7 on one end side of the long side in parallel with the long side, 8 comprises a plate 10 provided with slits 11 for further penetrating a plurality of fins 7 passing through 8, and spacers 12 (spacer A12a, spacer B12b) provided on the entire circumference of the plate and maintaining the distance between the cover 8 and the plate 10. Has been.

また、スペーサA12aはコの字形状をしており、スペーサB12bには冷媒が通過する溝13が複数設けられている。   The spacer A12a has a U-shape, and the spacer B12b is provided with a plurality of grooves 13 through which the refrigerant passes.

次にフィン7の詳細構成を説明する。図3に示すように、複数のフィン7は長辺の両側の一部を切り欠き、段差7aを形成している。複数のフィン7の最外側の片側のフィン7bは他のフィンより小さく、このフィン7bに対応したカバー8のスリット9aも短く、カバー8の短くしたスリット9aを設けない箇所に、真空引き及び冷媒充填に用いるパイプ15を取付けるパイプ用孔8aが設けられている。   Next, the detailed configuration of the fin 7 will be described. As shown in FIG. 3, the plurality of fins 7 are notched on both sides of the long side to form a step 7 a. The fin 7b on the outermost side of the plurality of fins 7 is smaller than the other fins, the slit 9a of the cover 8 corresponding to the fin 7b is also short, and the cover 8 is not provided with the shortened slit 9a. A pipe hole 8a for attaching the pipe 15 used for filling is provided.

フィン7bに対応したプレート10のスリット11aもスリット9aと同様に短くなっている。   The slits 11a of the plate 10 corresponding to the fins 7b are also short like the slits 9a.

また、図2のカバーユニット3の平面Aによる切断断面の構成図である図4に示すように、カバー8とスペーサ12とプレート10により放熱空間14を形成し、放熱空間14内を複数のフィン7が貫通している。   Further, as shown in FIG. 4 which is a sectional view of the cover unit 3 of FIG. 2 taken along the plane A, a heat radiation space 14 is formed by the cover 8, the spacer 12, and the plate 10, and the heat radiation space 14 has a plurality of fins. 7 penetrates.

カバーユニット3の図3から図2への組立ては、複数のフィン7を段差7aがカバー8に当接するまでカバー8のスリット9(9aを含む)、プレート10のスリット11(11aを含む)に挿入し、放熱空間14内に複数のフィン7を存在させた状態でロウ付けにより形成する。   The cover unit 3 is assembled from FIG. 3 to FIG. 2 with the plurality of fins 7 being slit 9 (including 9a) of the cover 8 until the step 7a contacts the cover 8, and the slit 11 (including 11a) of the plate 10. It is inserted and formed by brazing in a state where a plurality of fins 7 are present in the heat radiation space 14.

そして図2に示すように、ロウ付けで組立てたカバーユニット3のプレート10側に突出した複数のフィン7を容器2の開口面5に挿入し、容器2の底面4及び外縁2aの一部とカバー8で受熱空間16を形成するように容器2とカバーユニット3を配置し、カバー8と容器2および容器2とプレート10の継ぎ目を摩擦撹拌接合し、放熱空間14と受熱空間16を密封する。   Then, as shown in FIG. 2, a plurality of fins 7 protruding to the plate 10 side of the cover unit 3 assembled by brazing are inserted into the opening surface 5 of the container 2, and the bottom surface 4 of the container 2 and a part of the outer edge 2a The container 2 and the cover unit 3 are arranged so as to form the heat receiving space 16 with the cover 8, and the joints of the cover 8, the container 2, and the container 2 and the plate 10 are friction stir joined, and the heat radiating space 14 and the heat receiving space 16 are sealed. .

その後、カバー8に取付けたパイプ15により、放熱空間14と受熱空間16内を真空引きし、適量の冷媒を充填して図1の冷却装置1が完成する。   Thereafter, the heat radiation space 14 and the heat receiving space 16 are evacuated by the pipe 15 attached to the cover 8, and an appropriate amount of refrigerant is filled to complete the cooling device 1 of FIG.

ここで、上記構成の部品は、全て材質はアルミで、充填する冷媒はフロン系である。   Here, all the components having the above-described configuration are made of aluminum, and the refrigerant to be filled is a fluorocarbon material.

このアルミ製の容器で気密性を確保できる接合方法が摩擦撹拌接合で、摩擦撹拌接合はアルミのダイキャスト等鋳物に適用でき、レーザ等を使用した溶接時に鋳物内部の気泡の影響で起こる破裂現象によるピンホールの発生がなく、安定した気密品質が得られる。また、熱をあまりかけず、反りが少なくなるため好ましい接合方法である。   Friction stir welding is a joining method that can ensure airtightness with this aluminum container. Friction stir welding can be applied to castings such as aluminum die-casting, and a rupture phenomenon that occurs due to the influence of bubbles inside the casting during laser welding. No pinholes occur due to, and stable airtight quality can be obtained. Moreover, it is a preferable joining method because it does not apply much heat and warpage is reduced.

次に摩擦撹拌接合による製造工程を説明する。   Next, the manufacturing process by friction stir welding will be described.

容器2とカバーユニット3の組み立ては、図2の平面Bによる切断断面の構成図である図5に示すように、カバー8がプレート10より外周側に少し長くなっており、この長い分が、容器2の開口面5に対応した天面側の外縁2aの内周に設けた段差の低面に載せ、外縁2aの両面がカバー8、プレート10のそれぞれの外面とスペーサ12を介して面一になるようにしている。   The assembly of the container 2 and the cover unit 3 is as shown in FIG. 5, which is a configuration diagram of a cut section taken along the plane B in FIG. 2, and the cover 8 is slightly longer on the outer peripheral side than the plate 10. It is placed on the lower surface of the step provided on the inner periphery of the outer edge 2 a on the top surface side corresponding to the opening surface 5 of the container 2, and both surfaces of the outer edge 2 a are flush with the outer surfaces of the cover 8 and the plate 10 and the spacers 12. It is trying to become.

そして、図の矢印で示す、外縁2aとカバー8、プレート10のそれぞれとの境界を摩擦撹拌接合して、放熱空間14と受熱空間16を密封している。   The boundary between the outer edge 2a, the cover 8, and the plate 10, indicated by the arrows in the figure, is friction stir welded to seal the heat radiation space 14 and the heat receiving space 16.

図6に、摩擦撹拌接合する範囲を破線部で示す。図6(a)は冷却装置1のカバー8側から見た図で、カバー8の全周を摩擦撹拌接合している。図6(b)は冷却装置1のプレート10側から見た図で、プレート10の全周を摩擦撹拌接合している。   FIG. 6 shows a range where friction stir welding is performed by a broken line portion. FIG. 6A is a view of the cooling device 1 as viewed from the cover 8 side, and the entire periphery of the cover 8 is friction stir welded. FIG. 6B is a view as seen from the plate 10 side of the cooling device 1, and the entire periphery of the plate 10 is friction stir welded.

上記構成における、高発熱部品20の冷媒による冷却作用について説明する。   The cooling action by the refrigerant of the high heat generating component 20 in the above configuration will be described.

図7は垂直に設置された冷却装置の断面図(図1の平面Cでの切断断面)で、高発熱部品20から熱を受けた冷媒21が気化方向22に気化し、複数のフィン7が設けられた上部において液化し、液化方向23で還流する。このサイクルを繰り返すことで高発熱部品20の冷却を行う。   FIG. 7 is a cross-sectional view of the cooling device installed vertically (cut cross-section along the plane C in FIG. 1). The refrigerant 21 that receives heat from the high heat-generating component 20 is vaporized in the vaporization direction 22, and the plurality of fins 7 are formed. It liquefies in the upper part provided and refluxes in the liquefaction direction 23. By repeating this cycle, the high heat generating component 20 is cooled.

ここで、冷媒21は容器2内の高発熱部品20の設置高さまで封入されている。   Here, the refrigerant 21 is sealed up to the installation height of the high heat generating component 20 in the container 2.

次に本発明の最も主要な特徴について説明する。   Next, the most important features of the present invention will be described.

背景技術で述べたように、従来の冷却装置は冷媒の通路(蒸発部)を押し出し型材で形成しているため、摩擦撹拌接合できる通路の強度はあるが、高発熱部品20の様々な配置には適用できない。   As described in the background art, in the conventional cooling device, the refrigerant passage (evaporating part) is formed of an extruded mold material, so that there is strength of the passage where friction stir welding can be performed, but in various arrangements of the high heat generating component 20. Is not applicable.

本発明は、高発熱部品20の様々な配置にも適用可能にねじ止め用の突起を受熱面6に形成できる容器2形状で、さらにレーザ等の溶接には適さないアルミ鋳物の容器2を摩擦撹拌接合する点に特徴がある。   The present invention can be applied to various arrangements of the high heat-generating component 20 and has a shape of a container 2 in which a screwing projection can be formed on the heat receiving surface 6, and further rubs an aluminum casting container 2 that is not suitable for laser welding or the like. It is characterized by stir welding.

ここで摩擦撹拌接合できる強度に高めた構成は、スペーサ12である。   In this case, the spacer 12 is configured to have a strength capable of friction stir welding.

すなわち、上記摩擦撹拌接合による製造工程で説明した、外縁2aとプレート10の境界を摩擦撹拌接合する場合にはスペーサ12がないとプレート10が保持できず、摩擦撹拌接合できない。   That is, when the friction stir welding is performed on the boundary between the outer edge 2a and the plate 10 described in the manufacturing process by the friction stir welding, the plate 10 cannot be held without the spacer 12, and the friction stir welding cannot be performed.

さらに、スペーサ12を、コの字形状のスペーサA12aと、冷媒が通過する溝13を複数設けたスペーサB12bで構成し、スペーサB12bを放熱空間14と受熱空間16の境界に設けたことにより、放熱空間14と受熱空間16を連通させ、冷媒21の循環が可能となる。   Furthermore, the spacer 12 is constituted by a U-shaped spacer A12a and a spacer B12b provided with a plurality of grooves 13 through which the refrigerant passes, and the spacer B12b is provided at the boundary between the heat radiation space 14 and the heat receiving space 16, thereby dissipating heat. The space 14 and the heat receiving space 16 are communicated, and the refrigerant 21 can be circulated.

さらに複数のフィン7がカバー8とプレート10を貫通している構成により、受熱空間で気化した冷媒との接触効率が向上し、高発熱部品の冷却効率を向上できるとともに、複数のフィン7がカバー8とプレート10にロウ付けで固定されているため、放熱空間14が冷媒21の飽和蒸気圧によりフィン7の長手方向に膨らむことも防止できる。   Further, the structure in which the plurality of fins 7 penetrate the cover 8 and the plate 10 improves the contact efficiency with the refrigerant vaporized in the heat receiving space, can improve the cooling efficiency of the high heat generating components, and the plurality of fins 7 cover the cover. 8 and the plate 10 are fixed by brazing, so that the heat radiation space 14 can also be prevented from expanding in the longitudinal direction of the fin 7 due to the saturated vapor pressure of the refrigerant 21.

なお、本実施形態では、スペーサ12を、コの字形状のスペーサA12aと、溝13を複数設けたスペーサB12bで構成したが、摩擦撹拌接合の強度が保てれば、柱状のスペーサを多数設けてもよく、スペーサ12の形状は本実施形態に限定されないが、本実施形態の構成が部品点数も少なく好ましい。   In this embodiment, the spacer 12 is composed of the U-shaped spacer A12a and the spacer B12b provided with a plurality of grooves 13. However, as long as the strength of the friction stir welding can be maintained, a large number of columnar spacers may be provided. The shape of the spacer 12 is not limited to this embodiment, but the configuration of this embodiment is preferable because the number of parts is small.

以上のように本発明の冷却装置は、段差を有する複数のフィンと、前記複数のフィンの枚数分のスリットを長辺の一端側に長辺と平行に設けた長方形の平板のカバーと、前記複数のフィンの枚数分のスリットを設けたプレートと、前記カバーと前記プレート間に設けたスペーサと、を備えたカバーユニットと、底面に冷却対象の発熱部品の配置に対応した複数の突起を設けるとともに前記底面の対向面に開口を有する容器とで構成される冷却装置であって、前記カバーと前記スペーサと前記プレートにより放熱空間を形成し、前記カバーユニットは、前記複数のフィンを前記段差が前記カバーに当接するまで前記カバーのスリット、前記プレートのスリットに挿入し、前記放熱空間内に前記複数のフィンを存在させた状態でロウ付けにより形成し、前記容器の開口に、前記プレート側に突出した前記複数のフィンを挿入し、前記容器の底面と前記カバーで受熱空間を形成するように前記容器と前記カバーユニットを配置し、前記カバーと前記フレームの継ぎ目を摩擦撹拌接合し、前記放熱空間と前記受熱空間を密封するとともに前記放熱空間と前記受熱空間を連通させているため、複数の突起は容器の底面に自由に配置されることにより高発熱電子部品の様々な配置に対応できる。   As described above, the cooling device of the present invention includes a plurality of fins having steps, a rectangular flat plate cover provided with slits corresponding to the number of the plurality of fins on one end side of the long side in parallel with the long side, A cover unit having a plate provided with slits for the number of fins, a spacer provided between the cover and the plate, and a plurality of protrusions corresponding to the arrangement of the heat generating components to be cooled are provided on the bottom surface. And a cooling device configured with a container having an opening on the opposite surface of the bottom surface, wherein the cover, the spacer, and the plate form a heat radiation space, and the cover unit includes the plurality of fins with the steps. Insert into the slit of the cover and the slit of the plate until it comes into contact with the cover, and braze in a state where the plurality of fins are present in the heat dissipation space. And inserting the plurality of fins protruding toward the plate into the opening of the container, disposing the container and the cover unit so as to form a heat receiving space with the bottom surface of the container and the cover, and The joint of the frame is friction stir welded to seal the heat radiating space and the heat receiving space and communicate the heat radiating space and the heat receiving space, so that the plurality of protrusions are freely disposed on the bottom surface of the container. Applicable to various arrangements of high heat generation electronic components.

このため、本発明の冷却装置は、CPUや電力変換素子等の高発熱電子部品を使用する遠隔無線装置(RRU)等の冷却に用いることが出来る。   For this reason, the cooling device of the present invention can be used for cooling a remote radio device (RRU) or the like that uses highly heat generating electronic components such as a CPU and a power conversion element.

1 冷却装置
2 容器
3 カバーユニット
4 底面
5 開口面
6 受熱面
6a 突起
7、7b フィン
7a 段差
8 カバー
8a パイプ用孔
9、9a スリット
10 プレート
11、11a スリット
12 スペーサ
12a スペーサA
12b スペーサB
13 溝
14 放熱空間
15 パイプ
16 受熱空間
20 高発熱部品
21 冷媒
22 気化方向
23 液化方向
DESCRIPTION OF SYMBOLS 1 Cooling device 2 Container 3 Cover unit 4 Bottom surface 5 Opening surface 6 Heat receiving surface 6a Projection 7, 7b Fin 7a Step 8 Cover 8a Pipe hole 9, 9a Slit 10 Plate 11, 11a Slit 12 Spacer 12a Spacer A
12b Spacer B
13 Groove 14 Heat radiation space 15 Pipe 16 Heat receiving space 20 High heat generating component 21 Refrigerant 22 Evaporation direction 23 Liquefaction direction

Claims (2)

段差を有する複数のフィンと、
前記複数のフィンの枚数分のスリットを長辺の一端側に長辺と平行に設けた長方形の平板のカバーと、
前記複数のフィンの枚数分のスリットを設けたプレートと、
前記カバーと前記プレート間に設けたスペーサと、
を備えたカバーユニットと、
底面に冷却対象の発熱部品の配置に対応した複数の突起を設けるとともに前記底面の対向面に開口を有する容器を備え、
前記カバーユニットと前記容器とで構成した密閉空間内に充填した冷媒の相変換循環により発熱体を冷却する冷却装置であって、
前記カバーと前記スペーサと前記プレートにより放熱空間を形成し、
前記カバーユニットは、
前記複数のフィンを前記段差が前記カバーに当接するまで前記カバーのスリット、前記プレートのスリットに挿入し、前記放熱空間内に前記複数のフィンを存在させた状態でロウ付けにより形成し、
前記容器の開口に、前記プレート側に突出した前記複数のフィンを挿入し、前記容器の底面と前記カバーで受熱空間を形成するように前記容器と前記カバーユニットを配置し、
前記カバーと前記容器の継ぎ目を摩擦撹拌接合し、前記放熱空間と前記受熱空間を密封するとともに前記放熱空間と前記受熱空間を連通させることを特徴とする冷却装置。
A plurality of fins having steps;
A rectangular flat cover provided with slits for the number of the plurality of fins on one end side of the long side in parallel with the long side;
A plate provided with slits for the number of the plurality of fins;
A spacer provided between the cover and the plate;
A cover unit with
Provided with a plurality of protrusions corresponding to the arrangement of the heat-generating components to be cooled on the bottom surface and a container having an opening on the opposite surface of the bottom surface
A cooling device that cools a heating element by phase conversion circulation of a refrigerant filled in a sealed space constituted by the cover unit and the container,
A heat dissipation space is formed by the cover, the spacer, and the plate,
The cover unit is
Insert the plurality of fins into the slits of the cover and the slits of the plate until the step comes into contact with the cover, and form by brazing with the plurality of fins present in the heat dissipation space,
Inserting the plurality of fins protruding toward the plate into the opening of the container, and arranging the container and the cover unit so as to form a heat receiving space with the bottom surface of the container and the cover,
A cooling device characterized in that a joint between the cover and the container is friction stir welded to seal the heat radiation space and the heat receiving space and to communicate the heat radiation space and the heat receiving space.
スペーサは、プレートの全周に設けられるとともに、放熱空間と受熱空間の境界に設けられる前記スペーサは、冷媒が通過する溝を複数設けたことを特徴とする請求項1に記載の冷却装置。 The cooling device according to claim 1, wherein the spacer is provided on the entire circumference of the plate, and the spacer provided on the boundary between the heat radiation space and the heat receiving space is provided with a plurality of grooves through which the refrigerant passes.
JP2014051530A 2014-03-14 2014-03-14 Cooling device Pending JP2015175542A (en)

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CN112171569A (en) * 2019-06-18 2021-01-05 天津大起空调有限公司 Interval adjustable arrangement tooth device that heat exchanger assembly machine was used

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JP4043986B2 (en) * 2003-03-31 2008-02-06 古河電気工業株式会社 Heat sink with radiating fin and fixing method of radiating fin
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US7677299B2 (en) * 2004-11-10 2010-03-16 Wen-Chun Zheng Nearly isothermal heat pipe heat sink
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CN112171569A (en) * 2019-06-18 2021-01-05 天津大起空调有限公司 Interval adjustable arrangement tooth device that heat exchanger assembly machine was used
CN112171569B (en) * 2019-06-18 2022-05-17 天津大起空调有限公司 Interval adjustable arrangement tooth device that heat exchanger assembly machine was used

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