CN212344311U

CN212344311U - Temperature equalizing plate structure and temperature equalizing plate material plate

Info

Publication number: CN212344311U
Application number: CN202020890289.XU
Authority: CN
Inventors: 洪银树; 李明聪; 尹佐国
Original assignee: Sunonwealth Electric Machine Industry Co Ltd
Current assignee: Sunonwealth Electric Machine Industry Co Ltd
Priority date: 2020-05-18
Filing date: 2020-05-25
Publication date: 2021-01-12
Anticipated expiration: 2030-05-25
Also published as: CN113692174A; TW202144724A

Abstract

The utility model provides a temperature-uniforming plate structure and temperature-uniforming plate flitch for solve the complexity in the current temperature-uniforming plate production and cause the extravagant problem of material. The method comprises the following steps: a first sheet body; and the first sheet body or/and the second sheet body is/are provided with a groove, the groove is provided with an annular edge, the first sheet body and the second sheet body are combined to form a cavity by the groove, and the first sheet body or the second sheet body and the opposite annular edge form a liquid injection part.

Description

Temperature equalizing plate structure and temperature equalizing plate material plate

Technical Field

The utility model relates to a heat abstractor, especially, a carry out radiating samming plate structure and samming plate flitch to electronic component.

Background

Please refer to fig. 1, which is a disclosed vapor chamber 9, wherein a working fluid is filled in the vapor chamber 9, a heat source can heat the working fluid and vaporize the working fluid, the gaseous working fluid is evaporated to a side away from the heat source to release heat and then condensed, thereby carrying away the heat of the heat source to achieve the purpose of heat dissipation. A liquid injection convex part 91 is arranged around the existing temperature equalizing plate 9, and the liquid injection convex part 91 is provided with an opening or a liquid injection pipe communicated with the inside of the temperature equalizing plate 9, so as to inject working fluid into the inside of the temperature equalizing plate 9. In manufacturing the conventional vapor chamber 9, the liquid injection protrusion 91 must be formed by using a large amount of material, and the liquid injection protrusion 91 must be cut and sealed after the working fluid is injected, which causes complexity in manufacturing and waste of material.

In view of the above, there is still a need for improvement of the conventional thermal equalizing plate structure.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides a vapor chamber structure and a vapor chamber plate, which can be easily manufactured.

The utility model discloses a next purpose provides a temperature-uniforming plate structure and temperature-uniforming plate flitch, can reduce cost.

In the present invention, the directions or the similar terms thereof, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., refer to the directions of the drawings, and the directions or the similar terms thereof are only used to assist the explanation and understanding of the embodiments of the present invention, but not to limit the present invention.

The elements and components described throughout the present invention are referred to by the term "a" or "an" merely for convenience and to provide a general meaning of the scope of the invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.

The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.

The utility model discloses a temperature-uniforming plate structure, include: a first sheet body; and the first sheet body or/and the second sheet body is/are provided with a groove, the groove is provided with an annular edge, the first sheet body and the second sheet body are combined to form a cavity by the groove, and the first sheet body or the second sheet body and the opposite annular edge form a liquid injection part.

The utility model discloses a temperature-uniforming plate flitch, include: a first substrate having a plurality of first sheets, each first sheet having a plurality of penetrating portions around the first sheet, and a connecting rib between the penetrating portions; and a second substrate having a plurality of second sheets, each second sheet having a plurality of penetrating portions around the second sheet, a connecting rib between the penetrating portions, the first substrate and the second substrate being joined together, the first sheet or the second sheet and the opposite annular edge forming a liquid injection portion.

Therefore, the utility model discloses a temperature-uniforming plate structure and temperature-uniforming plate flitch can form this liquid portion of annotating through the surrounding edge of this first lamellar body and the surrounding edge of this second lamellar body jointly, does not need the extra convex notes liquid mouth of shaping to annotate liquid, compares in current temperature-uniforming plate and need cut off and carry out the banding with this liquid convex part again, the utility model discloses can simplify the process, realize promoting production efficiency's efficiency, in addition, because the surrounding edge through this first lamellar body and the surrounding edge of this second lamellar body form this liquid portion of annotating jointly, so, also only need less amount of sealing material can seal this liquid portion of annotating, can realize reduction in production cost's efficiency.

The first sheet body and/or the second sheet body is provided with at least one supporting column, and the supporting column is positioned between the first sheet body and the second sheet body. Therefore, the strength of the temperature-uniforming plate structure can be improved, and the temperature-uniforming plate structure has the effects of avoiding deformation and being not easy to bend.

The first sheet body is provided with a first opening part, or the second sheet body is provided with a second opening part, and the first opening part of the first sheet body or the second opening part of the second sheet body is locally opposite to the groove of the second sheet body or the groove of the first sheet body opposite to the groove of the second sheet body so as to form the liquid injection part. Therefore, the vapor chamber structure can be injected without forming an additional convex outlet, and has the effect of saving cost.

The first sheet body is provided with a first opening part, the second sheet body is provided with a second opening part, and the first opening part and the second opening part are partially aligned to form the liquid injection part. Therefore, the vapor chamber structure can be injected without forming an additional convex outlet, and has the effect of saving cost.

Wherein, the first opening is a groove on the ring edge, one end of the groove is connected with the groove, and the second opening is a through hole. Thus, the through hole and the groove can be communicated with each other to form the liquid injection part.

Wherein, the liquid injection part is formed by the overlapped part of the through hole and the groove, and the maximum size of the liquid injection part is not more than 5 mm. Thus, the opening can be closed with a small amount of the closing material, and the opening can be easily closed.

Wherein, the overlapped part of the through hole and the groove forms a round hole, and the diameter of the round hole is not more than 5 mm. Thus, the opening can be closed with a small amount of the closing material, and the opening can be easily closed.

Wherein, the overlapped part of the through hole and the groove forms a rectangular opening, and the distance between any two opposite sides of the rectangular opening is not more than 5 mm. Therefore, the opening is sealed by only a small amount of sealing materials, and the opening is easily sealed.

Wherein a closure member is coupled to the liquid injection portion. Thus, the working fluid can be prevented from leaking from the liquid injection portion.

Wherein the sealing member is a solder or a curing adhesive. Thus, the liquid injection part can be easily closed, and the closing step of the liquid injection part is simplified.

Wherein the connecting ribs of the first substrate and the connecting ribs of the second substrate are staggered. Therefore, the connecting ribs after the first substrate and the second substrate are combined can be easily cut, and the process is simplified.

Wherein, both sides of each connecting rib of the first substrate are respectively provided with an inner notch which is formed by inwards recessing the periphery of the annular edge. Therefore, the fracture of the cut connecting rib does not protrude out of the side peripheral surface of each annular edge, the processing step of grinding and trimming the cut part of the connecting rib can be omitted, and the process is simplified.

Wherein, both sides of each connecting rib of the second substrate are respectively provided with an inner notch which is formed by inwards recessing the periphery of the annular edge. Therefore, the fracture of the cut connecting rib does not protrude out of the side peripheral surface of each annular edge, the processing step of grinding and trimming the cut part of the connecting rib can be omitted, and the process is simplified.

Drawings

FIG. 1: a prior art thermal equalization plate diagram;

FIG. 2: the utility model discloses a first embodiment of the vapor chamber with an exploded perspective view;

FIG. 3: the utility model discloses an exploded perspective view of a second embodiment of the vapor chamber;

FIG. 4: the utility model discloses a combination diagram of an embodiment of the vapor chamber;

FIG. 5: an enlarged view of a as shown in fig. 4;

FIG. 6: the utility model discloses an exploded perspective view of a third embodiment of the vapor chamber;

FIG. 7: the utility model discloses a combined drawing of a vapor chamber of a third embodiment;

FIG. 8 a: a top view of the temperature-equalizing plate with the first sheet body;

FIG. 8 b: a top view of the temperature-equalizing plate with the second sheet body;

FIG. 9: the utility model discloses a local structure enlarged view after the combination of the temperature equalizing plate and the material plate;

FIG. 10: as shown in the enlarged view of B in fig. 9.

Description of the reference numerals

[ utility model ] to solve the problems

1 first sheet

11,21: groove

12,22 ring edge

121,221 peripheral edge

13,23 support column

14 first opening part

141 trench

2: the second sheet body

24 second opening part

241 through hole

3: first substrate

31,41 penetration part

32,42 connecting rib

33,43 inner concave opening

4: second substrate

P is liquid injection part

S is a chamber

C, closing part

T is samming plate structure

D, a temperature-equalizing plate

[ Prior Art ] A method for producing a semiconductor device

9: temperature equalizing plate

And 91, injecting a liquid convex part.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail as follows:

please refer to fig. 2, which is a first preferred embodiment of the temperature equalization plate structure T of the present invention, including a first plate 1 and a second plate 2, wherein the first plate 1 and the second plate 2 are connected to each other.

The temperature equalization plate structure T can be made of a material with high thermal conductivity, such as copper or aluminum, and can be used to directly or indirectly connect a heat source to dissipate heat of the heat source, such as a central processing unit of a mobile phone, a computer or other electrical products, or an electronic component, such as a chip, etc., on a circuit board, which generates heat due to operation. The vapor chamber structure T has a cavity for filling a working fluid, the working fluid may be water, alcohol or other liquid with low boiling point, preferably the working fluid may be a non-conductive liquid, so that the working fluid can absorb heat from the liquid state and evaporate into a gaseous state, the cavity may be in a vacuum-sealed state, so as to prevent the working fluid from dissipating after forming the gaseous state, and prevent the interior from being occupied by air and being compressed into the space after the working fluid forms the gaseous state, thereby affecting the heat dissipation efficiency.

The first sheet 1 may have a groove 11, the groove 11 may be configured to contain the working fluid, so that heat can be transferred between the first sheet 1 and the working fluid, for example, the first sheet 1 may serve as a heat absorption sheet, and the first sheet 1 may be configured to be connected to the heat generating source to absorb heat generated by the heat generating source.

The groove 11 can be formed by stamping or die-casting, so that the periphery of the groove 11 has a rim 12, the groove 11 can be formed by bending, or the groove 11 can be formed by etching, for example, dry etching, wet etching or plasma etching, so that the groove 11 can be formed in the first sheet 1 simply and the depth of the groove 11 can be controlled precisely in units of less than mm. For example, in a small electronic product, the thickness of the thinned temperature equalization plate structure T is not more than 1mm, and the groove 11 can be formed in the thinned temperature equalization plate structure T by etching, so that the processing difficulty is reduced. The first sheet body 1 and the second sheet body 2 can form a liquid injection part P and a cavity S, and the liquid injection part P is communicated with the cavity S, so that the temperature equalization plate structure T can inject the working fluid into the cavity S from the liquid injection part P (detailed later).

The second sheet 2 can be butt jointed with the first sheet 1 to form the cavity S in the groove 11 of the first sheet 1, the cavity S can be used for accommodating the working fluid to achieve the purpose of heat dissipation through the evaporation and condensation cycle of the working fluid, the second sheet 2 and the working fluid can transfer heat, for example, the second sheet 2 can be used as a heat dissipation sheet to transfer the heat carried by the working fluid out of the second sheet 2, for example, to dissipate the heat to the outside, or the second sheet 2 can be connected with fins, metal pipes or fans, and other members with heat conduction effect to carry the heat away from the second sheet 2 to achieve the purpose of heat dissipation.

Referring to fig. 3, which is a second preferred embodiment of the temperature equalization plate structure T of the present invention, in this embodiment, the second plate body 2 may also have at least one groove 21, the groove 21 may also be formed by stamping, die casting or the etching process, so that the periphery of the groove 21 forms an annular edge 22, the groove 21 of the second plate body 2 may be aligned with the groove 11 of the first plate body 1, so that the groove 21 of the second plate body 2 and the groove 11 of the first plate body 1 may form the cavity S together.

Referring to fig. 2 and 3, the first sheet body 1 may further have at least one supporting pillar 13, or the second sheet body 2 may also have at least one supporting pillar 23, or the first sheet body 1 and the second sheet body 2 each have at least one supporting

pillar

13,23, the supporting pillar 13 of the first sheet body 1 may abut against the second sheet body 2, and the supporting pillar 23 of the second sheet body 2 may abut against the first sheet body 1, or the supporting pillar 13 of the first sheet body 1 may abut against the supporting pillar 23 of the second sheet body 2, the supporting

pillars

13,23 may be assembled with the first sheet body 1 or the second sheet body 2 after being manufactured respectively, and then combined with the first sheet body 1 or the second sheet body 2, or the supporting

pillars

13,23 may be integrally formed with the first sheet body 1 or the second sheet body 2, the present invention is not limited, thereby, can promote the intensity of this temperature-uniforming plate structure T, have and avoid making this temperature-uniforming plate structure T produce the deformation to and be difficult for producing the effect of buckling.

Referring to fig. 2 to 4, in the present embodiment, the supporting columns 23 of the second sheet body 2 are aligned to the supporting columns 13 of the first sheet body 1, and the supporting

columns

13 and 23 can be welded together by spot welding or laser welding, so as to enhance the strength of the isothermal plate structure, and prevent the isothermal plate structure T from deforming and bending.

Referring to fig. 2 to 5, the liquid injection portion P can be formed on the first sheet body 1 or the second sheet body 2 by the opposite

annular edges

12 and 22, so that the temperature equalization plate structure T can inject liquid without forming an additional protruding opening, thereby saving cost. In detail, the first sheet body 1 or the second sheet body 2 can be combined with the opposite

annular edges

12,22 to form the cavity S by the

grooves

11,21, and the liquid injection part P is located at the portion of the

annular edges

12,22 for forming the cavity S, that is, the liquid injection part P can be adjacent to the periphery of the first sheet body 1 and the periphery of the second sheet body 2 to communicate with the cavity S. For example, the first sheet 1 may have a first opening 14, the second sheet 2 may have a second opening 24, the first opening 14 and the second opening 24 are partially aligned, and the first opening 14 or/and the second opening 24 are communicated with the chamber S. The first opening 14 and the second opening 24 can be openings with various geometric shapes, but the present invention is not limited thereto, and the first opening 14 and the second opening 24 can be respectively located at the circumferential edge or the periphery of the first sheet body 1 and the circumferential edge or the periphery of the second sheet body 2. For example, the first opening 14 can be a groove 141 and is located at the annular edge 12 of the first sheet 1, and one end of the first opening 14 is connected to the groove 11. The second opening 24 can be a through hole 241, the through hole 241 can be a round hole adjacent to the periphery of the second sheet 2, or the through hole 241 can be a hole recessed inward from the periphery of the second sheet 2, and the second opening 24 is partially aligned to the first opening 14, and the through hole 241 is partially aligned to the groove 141. In addition, when the second sheet body 2 has the ring edge 22, the second opening 24 can be the groove 141, and the first opening 14 can be the through hole 241, which is not limited by the present invention.

In the embodiment shown in fig. 3 to 5, the first sheet body 1 and the second sheet body 2 each have the

annular edges

12,22, the first opening portion 14 and the second opening portion 24 are respectively located at the

annular edges

12,22, such that the overlapped portion of the through hole 241 and the groove 141 can communicate with each other to communicate the second opening portion 24 with the outside to form the liquid filling portion P, preferably, the maximum size of the hole of the liquid filling portion P is not more than 5mm, for example, the overlapped portion of the through hole 241 and the groove 141 forms a circular hole, the diameter of the circular hole is not more than 5mm, or the overlapped portion of the through hole 241 and the groove 141 forms a rectangular opening, the distance between any two opposite sides of the rectangular opening is not more than 5mm, thereby, after injecting the working fluid from the liquid filling portion P into the cavity S, the liquid filling portion P can be sealed by a sealing member C, such as soldering tin or solidified adhesive, so as to fill the liquid injection part P, the liquid injection part P can be easily sealed, and the sealing step of the liquid injection part P is simplified.

Please refer to fig. 6 and fig. 7, which are a third preferred embodiment of the temperature equalization plate structure T of the present invention, the first sheet body 1 has the first opening 14, or the second sheet body 2 has the second opening 24, and the first opening 14 of the first sheet body 1 or the second opening 24 of the second sheet body 2 is locally aligned to the corresponding groove 21 of the second sheet body 2 or the groove 11 of the first sheet body 1. For example, the first sheet body 1 does not have the first opening portion 14, and the second sheet body 2 forms the second opening portion 24, so that the second opening portion 24 can be partially aligned with the groove 11 of the first sheet body 1 to form the liquid injection portion P, and for example, the second opening portion 24 can be the above circular hole, and a part of the circular hole is aligned with the groove 11, or the second opening portion 24 can be the above hole, which is recessed inward from the periphery of the second sheet body 2 to exceed the annular edge 12 of the first sheet body 1 to be partially aligned with the groove 11, so that the liquid injection portion P is formed by a portion overlapping with the groove 11.

Referring to fig. 8a and 8b, a preferred embodiment of a thermal equalization plate D of the present invention is shown, the thermal equalization plate D includes a first substrate (panel) 3 and a second substrate (panel) 4, the first substrate 3 can be formed with a plurality of the first sheet 1 structures of the above embodiments, and the second substrate 4 can be formed with a plurality of the second sheet 2 structures of the above embodiments. As shown in fig. 8a, a plurality of penetrating parts 31 are additionally provided around each rim 12, a connecting rib 32 is provided between the plurality of penetrating parts 31, and the plurality of penetrating parts 31 may be stamp holes (stamp-holes) or slot holes. In addition, the structure without the annular edge in each of the above embodiments may be formed by being surrounded by only the plurality of penetrating portions 31. As shown in fig. 8b, similarly, a plurality of penetrating portions 41 are additionally provided around each annular edge 22, a connecting rib 42 is formed between the plurality of penetrating portions 41, or a structure without annular edges in the above embodiments (such as the second sheet body 2 in fig. 2) can be formed by only surrounding the plurality of penetrating portions 41, the first substrate 3 and the second substrate 4 can be combined to form a plurality of the first sheet bodies 1 and a plurality of the second sheet bodies 2, for example, the plurality of grooves 11 of the first substrate 3 and the plurality of grooves 21 of the second substrate 4 can be aligned with each other, thereby obtaining a plurality of temperature equalization structure T by cutting the connecting

ribs

32, 42.

As shown in fig. 9 and 10, it should be noted that the connecting ribs 32 of the first substrate 3 and the connecting ribs 42 of the second substrate 4 may be misaligned with each other, so that after the first substrate 3 is combined with the second substrate 4, the connecting

ribs

32 and 42 are misaligned with each other, so that the connecting

ribs

32 and 42 can be easily cut, thereby facilitating the cutting process. Preferably, each of the two sides of each of the connecting ribs 32 of the first substrate 3 has an inner notch 33, and the inner notch 33 can be formed by inwardly recessing the peripheral edge 121 of the annular edge 12, so that when the connecting rib 32 at the position of the inner notch 33 is cut along the L-line, the remaining connecting ribs 32 do not exceed the surface of the peripheral edge 121 of each of the annular edges 12, and the processing step of grinding and trimming the cut portion of the connecting rib 32 can be omitted, thereby simplifying the process.

Similarly, each of the two sides of each of the connecting ribs 42 of the second substrate 4 may also have an inner notch 43, and the inner notch 43 may be formed by inwardly recessing the peripheral edge 221 of the annular rim 22, so that when the connecting rib 42 at the position of the inner notch 43 is cut along the L-line, the remaining connecting ribs 42 will not exceed the surface of the peripheral edge 221 of each annular rim 22, and the processing step of grinding and trimming the cut portion of the connecting rib 42 can be omitted, which also has the effect of simplifying the process.

To sum up, the utility model discloses a temperature-uniforming plate structure and temperature-uniforming plate flitch can form this liquid portion of annotating through the ring limit of this first lamellar body and the ring limit of this second lamellar body jointly, does not need the extra convex notes liquid mouth of shaping to annotate liquid, compares in current temperature-uniforming plate and need cut off and carry out the banding with this liquid convex part again, the utility model discloses can simplify the process, realize promoting production efficiency's efficiency, in addition, because the ring limit through this first lamellar body and the ring limit of this second lamellar body form this liquid portion of annotating jointly, so, also only need less amount of sealing material can seal this liquid portion of annotating, can realize reduction in production cost's efficiency.

Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention.

Claims

1. A vapor panel structure, comprising:

a first sheet; and

the first sheet body and the second sheet body are combined to form a cavity by the groove, and the first sheet body or the second sheet body and the opposite annular edge form a liquid injection part.

2. The vapor chamber structure of claim 1, wherein the first sheet and/or the second sheet has at least one support post, the support post being located between the first sheet and the second sheet.

3. The vapor chamber structure of claim 1, wherein the first sheet has a first opening, or the second sheet has a second opening, and the first opening of the first sheet or the second opening of the second sheet partially faces the groove of the second sheet or the groove of the first sheet to form the liquid injection portion.

4. The vapor-deposition plate structure of claim 1, wherein the first sheet has a first opening, the second sheet has a second opening, and the first opening and the second opening are partially aligned to form the liquid injection portion.

5. The temperature equalizing plate structure as claimed in claim 4, wherein the first opening is a groove on the annular edge, one end of the groove is connected to the groove, and the second opening is a through hole.

6. The temperature-equalizing plate structure as claimed in claim 5, wherein the liquid injection portion is formed by the overlapping portion of the through hole and the trench, and the maximum dimension of the liquid injection portion is not greater than 5 mm.

7. The vapor chamber plate structure of claim 6, wherein the overlapping portion of the via and the trench forms a circular hole, and the diameter of the circular hole is not greater than 5 mm.

8. The vapor-deposition plate structure of claim 6, wherein the overlapping portion of the via and the trench forms a rectangular opening, and the distance between any two opposite sides of the rectangular opening is not greater than 5 mm.

9. The vapor panel structure of claim 5, wherein a closure member is coupled to the liquid injection portion.

10. The vapor-deposition plate structure of claim 9, wherein the sealing element is a solder or a cured adhesive.

11. A vapor plate flitch, its characterized in that includes:

a first substrate having a plurality of first sheets of the vapor panel structure of any one of claims 1 to 10, each first sheet having a plurality of penetrating portions around the periphery thereof, each penetrating portion having a connecting rib therebetween; and

a second substrate having a plurality of second plates of the temperature equalizing plate structure as claimed in any one of claims 1 to 10, each second plate having a plurality of penetrating portions around each second plate, a connecting rib being provided between the penetrating portions, the first substrate and the second substrate being combined, the first plate or the second plate and the opposite annular edge forming a liquid injection portion.

12. The thermal equalization plate web of claim 11 wherein the connecting ribs of the first base plate and the connecting ribs of the second base plate are offset from one another.

13. The thermal equalizer plate of claim 11, wherein each of the connecting ribs of the first base plate has an inner recess formed by inwardly recessing the peripheral edge of the annular rim.

14. The thermal equalizer plate of claim 11, wherein each of the connecting ribs of the second base plate has an inner recess formed by inwardly recessing the peripheral edge of the annular rim.