TWI370326B - - Google Patents
Info
- Publication number
- TWI370326B TWI370326B TW099114096A TW99114096A TWI370326B TW I370326 B TWI370326 B TW I370326B TW 099114096 A TW099114096 A TW 099114096A TW 99114096 A TW99114096 A TW 99114096A TW I370326 B TWI370326 B TW I370326B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009209210 | 2009-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201109841A TW201109841A (en) | 2011-03-16 |
TWI370326B true TWI370326B (ja) | 2012-08-11 |
Family
ID=43732257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099114096A TW201109841A (en) | 2009-09-10 | 2010-05-03 | Photosensitive composition and printed wiring board |
Country Status (5)
Country | Link |
---|---|
JP (3) | JP4897922B2 (ja) |
KR (2) | KR101307144B1 (ja) |
CN (1) | CN102483571B (ja) |
TW (1) | TW201109841A (ja) |
WO (1) | WO2011030580A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5611769B2 (ja) * | 2010-10-29 | 2014-10-22 | 株式会社カネカ | 新規な白色感光性樹脂組成物及びその利用 |
JP4991960B1 (ja) * | 2011-02-14 | 2012-08-08 | 積水化学工業株式会社 | 2液混合型の第1,第2の液及びプリント配線板の製造方法 |
JP5789455B2 (ja) * | 2011-09-05 | 2015-10-07 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
JP5789454B2 (ja) * | 2011-09-05 | 2015-10-07 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
TWI541594B (zh) * | 2011-09-30 | 2016-07-11 | Taiyo Ink Mfg Co Ltd | A photosensitive resin composition, a hardened film thereof, and a printed wiring board |
JP5858739B2 (ja) * | 2011-11-15 | 2016-02-10 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
JP5887106B2 (ja) * | 2011-11-15 | 2016-03-16 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
JP5858740B2 (ja) * | 2011-11-15 | 2016-02-10 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
JP5858747B2 (ja) * | 2011-11-21 | 2016-02-10 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
JP5858746B2 (ja) * | 2011-11-21 | 2016-02-10 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
JP5878913B2 (ja) * | 2013-12-17 | 2016-03-08 | 互応化学工業株式会社 | 感光性樹脂組成物、ソルダーレジスト用組成物、プリント配線板、及び感光性樹脂組成物の製造方法 |
CN105467753B (zh) * | 2014-07-31 | 2020-01-14 | 太阳油墨(苏州)有限公司 | 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板 |
KR101929140B1 (ko) * | 2014-09-30 | 2018-12-13 | 다이요 잉키 세이조 가부시키가이샤 | 감광성 수지 조성물, 그의 드라이 필름 및 경화 피막 그리고 그들을 사용한 프린트 배선판 |
TWI554567B (zh) * | 2014-11-18 | 2016-10-21 | Chi Mei Corp | Alkali soluble resin and its photosensitive resin composition and its application |
CN105517648B (zh) | 2014-12-10 | 2017-06-20 | 互应化学工业株式会社 | 液体阻焊剂组合物和被覆印刷线路板 |
WO2016092596A1 (ja) * | 2014-12-10 | 2016-06-16 | 互応化学工業株式会社 | 液状ソルダーレジスト組成物及び被覆プリント配線板 |
KR102625987B1 (ko) * | 2015-03-25 | 2024-01-18 | 다이요 홀딩스 가부시키가이샤 | 2액 혼합형의 제1, 제2 액 및 프린트 배선판의 제조 방법 |
KR20160115718A (ko) * | 2015-03-25 | 2016-10-06 | 세키스이가가쿠 고교가부시키가이샤 | 2액 혼합형의 제1, 제2 액 및 프린트 배선판의 제조 방법 |
JP6448447B2 (ja) * | 2015-04-07 | 2019-01-09 | 日本化薬株式会社 | 白色活性エネルギー線硬化性樹脂組成物 |
CN107464873A (zh) * | 2017-05-03 | 2017-12-12 | 合肥彩虹蓝光科技有限公司 | 一种避免倒装芯片固晶漏电的方法 |
JP2021138916A (ja) | 2020-03-06 | 2021-09-16 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0987366A (ja) * | 1995-09-22 | 1997-03-31 | Hitachi Ltd | 感光性樹脂組成物とそれを用いた多層配線板の製法 |
JP2000019764A (ja) | 1998-07-01 | 2000-01-21 | Ricoh Co Ltd | 電子写真感光体およびそれを用いた画像形成装置 |
MY128169A (en) * | 1999-06-28 | 2007-01-31 | Showa Denko Kk | Abrasive composition for substrate for magnetic recording disks and process for producing substrate for magnetic recording disk. |
JP2001075281A (ja) * | 1999-09-02 | 2001-03-23 | Kansai Paint Co Ltd | 光硬化性樹脂組成物及び光硬化塗膜 |
KR100845657B1 (ko) * | 2004-07-07 | 2008-07-10 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성·열 경화성 수지 조성물과 그것을 사용한 건식필름, 및 그의 경화물 |
KR101221450B1 (ko) * | 2005-07-19 | 2013-01-11 | 주식회사 동진쎄미켐 | 유무기 복합 감광성 수지 조성물 |
JP4910610B2 (ja) | 2005-10-04 | 2012-04-04 | 日立化成工業株式会社 | 感光性樹脂組成物及び感光性フィルム |
JP4711208B2 (ja) * | 2006-03-17 | 2011-06-29 | 山栄化学株式会社 | 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。 |
JP4340272B2 (ja) | 2006-05-30 | 2009-10-07 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いたプリント配線板 |
US20100167204A1 (en) * | 2006-08-31 | 2010-07-01 | Jsr Corporation | Radiation-sensitive insulation resin composition, cured article, and electronic device |
KR100904348B1 (ko) * | 2006-10-24 | 2009-06-23 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성 열 경화성 수지 조성물 및 이것을 사용한 인쇄배선판 |
TWI357536B (en) * | 2006-10-24 | 2012-02-01 | Taiyo Ink Mfg Co Ltd | Photosetting and thermosetting solder resist ink c |
JP4994922B2 (ja) * | 2007-04-06 | 2012-08-08 | 太陽ホールディングス株式会社 | ソルダーレジスト組成物およびその硬化物 |
JP5464314B2 (ja) * | 2007-10-01 | 2014-04-09 | 山栄化学株式会社 | 無機フィラー及び有機フィラー含有硬化性樹脂組成物、並びにレジスト膜被覆プリント配線板及びその製造方法 |
CN100554335C (zh) * | 2007-10-17 | 2009-10-28 | 太阳油墨(苏州)有限公司 | 用于印刷电路板的外观检查的树脂组合物 |
KR101727101B1 (ko) * | 2008-08-26 | 2017-04-14 | 타무라 카켄 코포레이션 | 감광성 수지 조성물, 프린트 배선판용의 솔더 레지스트 조성물 및 프린트 배선판 |
JP5505726B2 (ja) * | 2009-10-28 | 2014-05-28 | ナガセケムテックス株式会社 | 複合樹脂組成物 |
JP2011170050A (ja) * | 2010-02-17 | 2011-09-01 | Taiyo Holdings Co Ltd | ソルダーレジスト組成物およびプリント配線板 |
-
2010
- 2010-04-05 KR KR1020127004277A patent/KR101307144B1/ko active IP Right Grant
- 2010-04-05 JP JP2010513521A patent/JP4897922B2/ja active Active
- 2010-04-05 WO PCT/JP2010/056183 patent/WO2011030580A1/ja active Application Filing
- 2010-04-05 CN CN201080038203XA patent/CN102483571B/zh active Active
- 2010-04-05 KR KR1020127004221A patent/KR101317963B1/ko active IP Right Grant
- 2010-05-03 TW TW099114096A patent/TW201109841A/zh unknown
- 2010-12-14 JP JP2010278458A patent/JP4891434B2/ja active Active
-
2011
- 2011-12-22 JP JP2011281761A patent/JP2012108523A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR101307144B1 (ko) | 2013-09-10 |
CN102483571B (zh) | 2013-10-23 |
CN102483571A (zh) | 2012-05-30 |
WO2011030580A1 (ja) | 2011-03-17 |
JPWO2011030580A1 (ja) | 2013-02-04 |
KR101317963B1 (ko) | 2013-10-14 |
JP4897922B2 (ja) | 2012-03-14 |
KR20120026140A (ko) | 2012-03-16 |
KR20120025634A (ko) | 2012-03-15 |
JP4891434B2 (ja) | 2012-03-07 |
JP2012108523A (ja) | 2012-06-07 |
JP2011081410A (ja) | 2011-04-21 |
TW201109841A (en) | 2011-03-16 |