TWI369369B - The method of preparing acid anhydride-type epoxy resin curing agent, acid anhydride-type epoxy resin curing agent, epoxy resin composistion, cured material thereof, and optical semiconductor device - Google Patents

The method of preparing acid anhydride-type epoxy resin curing agent, acid anhydride-type epoxy resin curing agent, epoxy resin composistion, cured material thereof, and optical semiconductor device

Info

Publication number
TWI369369B
TWI369369B TW094144198A TW94144198A TWI369369B TW I369369 B TWI369369 B TW I369369B TW 094144198 A TW094144198 A TW 094144198A TW 94144198 A TW94144198 A TW 94144198A TW I369369 B TWI369369 B TW I369369B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
curing agent
acid anhydride
type epoxy
resin curing
Prior art date
Application number
TW094144198A
Other languages
English (en)
Other versions
TW200628509A (en
Inventor
Ryuusuke Tanaka
Minoru Suzuki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200628509A publication Critical patent/TW200628509A/zh
Application granted granted Critical
Publication of TWI369369B publication Critical patent/TWI369369B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/91—Polymers modified by chemical after-treatment
    • C08G63/914—Polymers modified by chemical after-treatment derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/916—Dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094144198A 2004-12-21 2005-12-14 The method of preparing acid anhydride-type epoxy resin curing agent, acid anhydride-type epoxy resin curing agent, epoxy resin composistion, cured material thereof, and optical semiconductor device TWI369369B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004369323 2004-12-21

Publications (2)

Publication Number Publication Date
TW200628509A TW200628509A (en) 2006-08-16
TWI369369B true TWI369369B (en) 2012-08-01

Family

ID=36601559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144198A TWI369369B (en) 2004-12-21 2005-12-14 The method of preparing acid anhydride-type epoxy resin curing agent, acid anhydride-type epoxy resin curing agent, epoxy resin composistion, cured material thereof, and optical semiconductor device

Country Status (7)

Country Link
US (1) US7790812B2 (zh)
JP (1) JP4752766B2 (zh)
KR (1) KR100877281B1 (zh)
CN (1) CN101072808B (zh)
MY (1) MY141748A (zh)
TW (1) TWI369369B (zh)
WO (1) WO2006067955A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007277469A (ja) * 2006-04-11 2007-10-25 Kyocera Chemical Corp 注形用エポキシ樹脂組成物及び電気・電子部品装置
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
WO2009088059A1 (ja) * 2008-01-09 2009-07-16 Hitachi Chemical Company, Ltd. 熱硬化性樹脂組成物、エポキシ樹脂成形材料及び多価カルボン酸縮合体
CN102206325B (zh) * 2010-03-31 2012-09-05 朱瑞澄 一种耐热增韧甲基四氢苯酐的改性方法
CN102241868A (zh) * 2010-05-11 2011-11-16 上海赛沃化工材料有限公司 用于高压电力绝缘的环氧树脂组合物
JP5653877B2 (ja) * 2011-10-04 2015-01-14 信越化学工業株式会社 光半導体封止用硬化性組成物及びこれを用いた光半導体装置
ES2672005T3 (es) * 2013-04-19 2018-06-12 New Japan Chemical Co., Ltd. Nuevo anhídrido de ácido policarboxílico y utilización del mismo
JP2015199904A (ja) * 2014-04-03 2015-11-12 日本化薬株式会社 熱硬化性樹脂用硬化剤、それを用いた熱硬化性樹脂組成物、およびその熱硬化性樹脂組成物を封止材あるいは反射材として使用した光半導体装置
KR20180065162A (ko) * 2016-12-07 2018-06-18 서울바이오시스 주식회사 디스플레이 장치 및 그의 전극 연결 방법
CN111592657A (zh) * 2020-05-29 2020-08-28 福建师范大学 一种磷修饰zif-8材料及其制备方法与应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62253614A (ja) * 1986-01-11 1987-11-05 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH01132621A (ja) * 1987-11-17 1989-05-25 New Japan Chem Co Ltd 光学用エポキシ樹脂組成物
US5017679A (en) * 1989-08-30 1991-05-21 Eastman Kodak Company Polyesters terminated with carboxycyclohexanecarboxylate groups
GB9226500D0 (en) * 1992-12-19 1993-02-10 Ciba Geigy Ag Curable compositions
JPH09100439A (ja) * 1995-10-05 1997-04-15 Kansai Paint Co Ltd 上塗用ベースコート塗料組成物及びその塗装方法
DE19623371A1 (de) * 1996-06-12 1997-12-18 Herberts Gmbh Bindemittel- und Überzugsmittelzusammensetzung und deren Verwendung bei der Mehrschichtlackierung
CN1255525A (zh) * 1998-12-01 2000-06-07 中国科学院化学研究所 一种环氧树脂灌封料
JP3618238B2 (ja) 1998-12-25 2005-02-09 日亜化学工業株式会社 発光ダイオード
US6380352B1 (en) * 2000-08-29 2002-04-30 Eastman Chemical Company Polyester precursor purification process
JP2003012896A (ja) 2001-06-29 2003-01-15 Stanley Electric Co Ltd 耐紫外線エポキシ樹脂および該エポキシ樹脂を用いて封止が行われた発光ダイオードもしくは発光ダイオード用波長変換素子
JP2003026763A (ja) 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2003040972A (ja) 2001-07-26 2003-02-13 Japan Epoxy Resin Kk 光半導体用エポキシ樹脂組成物及び光半導体装置
JP4515009B2 (ja) 2002-01-30 2010-07-28 住友化学株式会社 発光ダイオード封止用樹脂組成物
JP3787658B2 (ja) * 2002-10-09 2006-06-21 よこはまティーエルオー株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
WO2006067955A1 (ja) 2006-06-29
US7790812B2 (en) 2010-09-07
CN101072808B (zh) 2010-08-11
JP4752766B2 (ja) 2011-08-17
US20090250825A1 (en) 2009-10-08
TW200628509A (en) 2006-08-16
CN101072808A (zh) 2007-11-14
JPWO2006067955A1 (ja) 2008-06-12
KR20070086046A (ko) 2007-08-27
KR100877281B1 (ko) 2009-01-07
MY141748A (en) 2010-06-30

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