JP5653877B2 - 光半導体封止用硬化性組成物及びこれを用いた光半導体装置 - Google Patents
光半導体封止用硬化性組成物及びこれを用いた光半導体装置 Download PDFInfo
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- JP5653877B2 JP5653877B2 JP2011219927A JP2011219927A JP5653877B2 JP 5653877 B2 JP5653877 B2 JP 5653877B2 JP 2011219927 A JP2011219927 A JP 2011219927A JP 2011219927 A JP2011219927 A JP 2011219927A JP 5653877 B2 JP5653877 B2 JP 5653877B2
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Images
Classifications
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- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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Description
(A)下記一般式(1)
CH2=CH−(X)a−Rf1−(X’)a−CH=CH2 (1)
[式中、Xは−CH2−、−CH2O−、−CH2OCH2−、及び−Y−NR1−CO−(Yは−CH2−又は下記構造式(2)
で表される2価のパーフルオロポリエーテル基である。]
で表される直鎖状ポリフルオロ化合物:100質量部、
(B)下記一般式(6)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基とを有する環状オルガノポリシロキサン:(A)成分のアルケニル基1モルに対してケイ素原子に直結した水素原子が0.5〜2.0モルとなる量、
(C)白金族金属系触媒:白金族金属原子換算で0.1〜500ppm、
(D)下記一般式(7)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基と、酸素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合したエポキシ基とを有する環状オルガノポリシロキサン:0.1〜10.0質量部、
(E)下記一般式(8)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基と、2価の炭化水素基を介してケイ素原子に結合した環状無水カルボン酸残基とを有する環状オルガノポリシロキサン:0.01〜5.0質量部、
を含有するものであることを特徴とする光半導体封止用硬化性組成物を提供する。
CfF2f+1− (9)
(式中、fは1〜10の整数である。)
上記のように、良好な透明性を有する硬化物を与え、かつ、各種基材、特にPPAに対して良好な接着性を有する光半導体封止用硬化性組成物、及び該組成物を硬化して得られる硬化物により光半導体素子が封止された光半導体装置が求められている。
[(A)成分]
本発明の(A)成分は、下記一般式(1)で表される直鎖状ポリフルオロ化合物である。
CH2=CH−(X)a−Rf1−(X’)a−CH=CH2 (1)
[式中、Xは−CH2−、−CH2O−、−CH2OCH2−、及び−Y−NR1−CO−(Yは−CH2−又は下記構造式(2)
で表される2価のパーフルオロポリエーテル基である。]
(B)成分は、下記一般式(6)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基とを有する環状オルガノポリシロキサンであり、上記(A)成分の架橋剤ないし鎖長延長剤として機能するものである。
CfF2f+1− (9)
(式中、fは1〜10、好ましくは3〜7の整数である。)
−CH2CH2−、
−CH2CH2CH2−、
−CH2CH2CH2OCH2−、
−CH2CH2CH2−NH−CO−、
−CH2CH2CH2−N(Ph)−CO−(但し、Phはフェニル基である。)、
−CH2CH2CH2−N(CH3)−CO−、
−CH2CH2CH2−O−CO−
等が挙げられる。
上記(B)成分の配合量は、(A)成分中に含まれるアルケニル基1モルに対して(B)成分中のSiH基(ケイ素原子に直結した水素原子)が0.5〜2.0モル、より好ましくは0.7〜1.5モルとなる量である。SiH基が0.5モルより少ないと、架橋度合が不十分となる結果、硬化物が得られず、また、2.0モルより多いと硬化時に発泡する恐れがある。
本発明の(C)成分である白金族金属系触媒は、ヒドロシリル化反応触媒である。ヒドロシリル化反応触媒は、組成物中に含有されるアルケニル基、特には(A)成分中のアルケニル基と、組成物中に含有されるSiH基、特には(B)成分中のSiH基との付加反応を促進する触媒である。このヒドロシリル化反応触媒は、一般に貴金属又はその化合物であり、高価格であることから、比較的入手し易い白金又は白金化合物がよく用いられる。
本発明の(D)成分は、下記一般式(7)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基と、酸素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合したエポキシ基とを有する環状オルガノポリシロキサンであり、本発明の組成物に自己接着性を与える接着付与剤である。
本発明の(E)成分は、下記一般式(8)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基と、2価の炭化水素基を介してケイ素原子に結合した環状無水カルボン酸残基とを有する環状オルガノポリシロキサンであり、本発明の(D)成分の接着付与能力を向上させて、本発明の組成物の自己接着性発現を促進させるためのものである。
(E)成分の配合量は、(A)成分100質量部に対して0.01〜5.0質量部であり、0.05〜2.0質量部であることが好ましい。0.01質量部未満の場合は、十分な接着促進効果が得られず、5.0質量部を超えると組成物の保存性が損なわれ、また、得られる硬化物の物理的強度が低下する。
本発明の光半導体封止用硬化性組成物においては、その実用性を高めるために、上記の(A)〜(E)成分以外にも、可塑剤、粘度調節剤、可撓性付与剤、無機質充填剤、反応制御剤、接着促進剤等の各種配合剤を必要に応じて添加することができる。これら添加剤の配合量は、本発明の目的を損なわない範囲、並びに組成物の特性及び硬化物の物性を損なわない限りにおいて任意である。
Rf2−(X’)aCH=CH2 (13)
[式中、X’、aは上記式(1)で説明したものと同じ、Rf2は、下記一般式(16)で表される基である。
(式中、DはCb’F2b’+1−(b’は1〜3)で表される基であり、c’は1〜200の整数、好ましくは2〜100の整数であり、かつ、前記(A)成分のRf1基に関するp+q(平均)及びuとsの和、並びにb〜dの和のいずれの和よりも小さい。)
D−O−(CF2O)d’(CF2CF2O)e’−D (15)
(式中、Dは上記と同じであり、d’及びe’はそれぞれ1〜200の整数、好ましくは1〜100の整数であり、かつ、d’とe’の和は、上記(A)成分のRf1基に関するp+q(平均)及びuとsの和、並びにb〜dの和のいずれの和よりも小さい。)
CF3O−(CF2CF2CF2O)n3−CF2CF3
CF3−[(OCF2CF2)n3(OCF2)m3]−O−CF3
(ここで、m3+n3=2〜201、m3=1〜200、n3=1〜200である。)
下記式(16)で示されるポリマー(粘度 4010mPa・s、ビニル基量0.030モル/100g)100部に、下記式(17)で示される環状オルガノポリシロキサン(SiH基量0.00394モル/g)7.6部、下記式(18)で示される環状オルガノポリシロキサン2.0部、下記式(19)で示される環状オルガノポリシロキサン0.50部、白金−ジビニルテトラメチルジシロキサン錯体のトルエン溶液(白金濃度0.5質量%)0.05部を順次添加し、均一になるように混合した。その後、脱泡操作を行うことにより組成物を調製した。
上記実施例1において、上記式(17)で示される環状オルガノポリシロキサンの代わりに、下記式(20)で示される環状オルガノポリシロキサン6.0部を添加した以外は実施例1と同様に組成物を調製した。
上記実施例1において、上記式(18)で示される環状オルガノポリシロキサンの代わりに、下記式(21)で示される環状オルガノポリシロキサン4.0部を添加した以外は実施例1と同様に組成物を調製した。
上記実施例1において、上記式(18)で示される環状オルガノポリシロキサンの代わりに、下記式(22)で示される環状オルガノポリシロキサン3.0部を添加した以外は実施例1と同様に組成物を調製した。
上記実施例1において、上記式(18)で示される環状オルガノポリシロキサンの代わりに、下記式(23)で示される環状オルガノポリシロキサン4.0部を添加した以外は実施例1と同様に組成物を調製した。
上記実施例1において、上記式(19)で示される環状オルガノポリシロキサンの代わりに、下記式(24)で示される環状オルガノポリシロキサン0.05部を添加した以外は実施例1と同様に組成物を調製した。
上記実施例1において、上記式(17)で示される環状オルガノポリシロキサンの代わりに、下記式(25)で示される直鎖状オルガノポリシロキサン(SiH基量0.00727モル/g)4.1部を添加した以外は実施例1と同様に組成物を調製した。
上記実施例1において、上記式(18)で示される環状オルガノポリシロキサンの代わりに、下記式(26)で示される直鎖状オルガノポリシロキサン5.0部を添加した以外は実施例1と同様に組成物を調製した。
上記実施例1において、上記式(19)で示される環状オルガノポリシロキサンの代わりに、下記式(27)で示される直鎖状オルガノポリシロキサン2.0部を添加した以外は実施例1と同様に組成物を調製した。
Claims (5)
- (A)下記一般式(1)
CH2=CH−(X)a−Rf1−(X’)a−CH=CH2 (1)
[式中、Xは−CH2−、−CH2O−、−CH2OCH2−、及び−Y−NR1−CO−(Yは−CH2−又は下記構造式(2)
で表される2価のパーフルオロポリエーテル基である。]
で表される直鎖状ポリフルオロ化合物:100質量部、
(B)下記一般式(6)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基とを有する環状オルガノポリシロキサン:(A)成分のアルケニル基1モルに対してケイ素原子に直結した水素原子が0.5〜2.0モルとなる量、
(C)白金族金属系触媒:白金族金属原子換算で0.1〜500ppm、
(D)下記一般式(7)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基と、酸素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合したエポキシ基とを有する環状オルガノポリシロキサン:0.1〜10.0質量部、
(E)下記一般式(8)で表される、一分子中にケイ素原子に直結した水素原子と、酸素原子又は窒素原子を含んでも良い2価の炭化水素基を介してケイ素原子に結合した一価のパーフルオロアルキル基又は一価のパーフルオロオキシアルキル基と、2価の炭化水素基を介してケイ素原子に結合した環状無水カルボン酸残基とを有する環状オルガノポリシロキサン:0.01〜5.0質量部、
を含有し、
硬化後の2mm厚の硬化物における、波長450nmの直線光の透過率が80%以上であり、かつ、硬化後の硬化物の25℃,589nm(ナトリウムのD線)での屈折率が1.30〜1.39であることを特徴とする光半導体封止用硬化性組成物。 - 前記(A)成分の直鎖状ポリフルオロ化合物のアルケニル基含有量が、0.005〜0.100mol/100gであることを特徴とする請求項1に記載の光半導体封止用硬化性組成物。
- 光半導体素子と、該光半導体素子を封止するための、請求項1乃至請求項3のいずれか1項に記載の光半導体封止用硬化性組成物を硬化して得られる硬化物とを有する光半導体装置。
- 前記光半導体素子が、発光ダイオードであることを特徴とする請求項4に記載の光半導体装置。
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