TWI368799B - Apparatus for applying a photosetting resin and method of applying a photosetting - Google Patents

Apparatus for applying a photosetting resin and method of applying a photosetting

Info

Publication number
TWI368799B
TWI368799B TW094132120A TW94132120A TWI368799B TW I368799 B TWI368799 B TW I368799B TW 094132120 A TW094132120 A TW 094132120A TW 94132120 A TW94132120 A TW 94132120A TW I368799 B TWI368799 B TW I368799B
Authority
TW
Taiwan
Prior art keywords
applying
photosetting
resin
photosetting resin
Prior art date
Application number
TW094132120A
Other languages
English (en)
Other versions
TW200624967A (en
Inventor
Keigo Imamura
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200624967A publication Critical patent/TW200624967A/zh
Application granted granted Critical
Publication of TWI368799B publication Critical patent/TWI368799B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Coating Apparatus (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Materials For Photolithography (AREA)
TW094132120A 2005-01-12 2005-09-16 Apparatus for applying a photosetting resin and method of applying a photosetting TWI368799B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005005395 2005-01-12
JP2005229560A JP4741897B2 (ja) 2005-01-12 2005-08-08 光硬化性樹脂の塗布装置及び塗布方法

Publications (2)

Publication Number Publication Date
TW200624967A TW200624967A (en) 2006-07-16
TWI368799B true TWI368799B (en) 2012-07-21

Family

ID=36677456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132120A TWI368799B (en) 2005-01-12 2005-09-16 Apparatus for applying a photosetting resin and method of applying a photosetting

Country Status (5)

Country Link
JP (1) JP4741897B2 (zh)
KR (1) KR100893739B1 (zh)
CN (1) CN101098760B (zh)
TW (1) TWI368799B (zh)
WO (1) WO2006075421A1 (zh)

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* Cited by examiner, † Cited by third party
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JP4741897B2 (ja) * 2005-01-12 2011-08-10 芝浦メカトロニクス株式会社 光硬化性樹脂の塗布装置及び塗布方法
TWI355970B (en) 2007-01-19 2012-01-11 Tokyo Electron Ltd Coating treatment apparatus, substrate treatment s
JP4884991B2 (ja) * 2007-01-19 2012-02-29 東京エレクトロン株式会社 塗布処理装置
KR100895863B1 (ko) * 2007-11-20 2009-05-06 세메스 주식회사 기판 제조 장치 및 그 방법
KR100901489B1 (ko) * 2007-11-21 2009-06-08 세메스 주식회사 기판 제조 장치 및 그 방법
KR100933027B1 (ko) * 2007-11-21 2009-12-21 세메스 주식회사 기판 제조 장치 및 그 방법
JP2011000545A (ja) * 2009-06-19 2011-01-06 Sharp Corp 液滴塗布状態判定装置および液滴塗布状態判定方法及びそれを用いた液滴塗布装置
WO2011027874A1 (ja) 2009-09-04 2011-03-10 ソニーケミカル＆インフォメーションデバイス株式会社 充填装置
JP5455583B2 (ja) * 2009-11-30 2014-03-26 キヤノン株式会社 インプリント装置
US20130129913A1 (en) * 2011-11-21 2013-05-23 Shenzhen China Star Optoellectronics Technolohy Co., Ltd. Coating apparatus and coating method
CN102520554A (zh) * 2011-11-21 2012-06-27 深圳市华星光电技术有限公司 涂布装置及涂布方法
KR101416769B1 (ko) * 2012-11-15 2014-07-09 안성룡 가경화 장치
KR101502786B1 (ko) * 2012-12-17 2015-03-17 주식회사 프로텍 Ｔｆｔ ｌｃｄ 패널 제조 장치
CN104185370A (zh) * 2013-05-24 2014-12-03 索尼电子(无锡)有限公司 具有防水层的基板、基板中防水层的形成方法和加工设备
CN104423101A (zh) * 2013-08-21 2015-03-18 北京京东方光电科技有限公司 一种封框胶涂布装置、方法以及实现对盒的方法
JP2014064022A (ja) * 2013-11-11 2014-04-10 Canon Inc インプリント装置
CN103895345B (zh) * 2014-03-27 2016-01-20 华中科技大学 一种多功能电流体喷墨打印系统及方法
CN104096660B (zh) * 2014-07-16 2016-08-24 京东方科技集团股份有限公司 一种点胶治具
JP5933060B2 (ja) * 2015-03-13 2016-06-08 キヤノン株式会社 インプリント装置および方法ならびに物品製造方法
CN105772340B (zh) 2016-05-16 2019-07-05 京东方科技集团股份有限公司 液态光固化胶涂覆装置和方法
CN105797902A (zh) * 2016-05-17 2016-07-27 复旦大学 智能自清洗双固化涂装系统
JP6905325B2 (ja) * 2016-10-31 2021-07-21 デクセリアルズ株式会社 積層体の製造方法
KR102039822B1 (ko) * 2018-04-09 2019-11-01 주식회사 프로텍 사이드 실링 디스펜서
KR101970444B1 (ko) * 2018-12-14 2019-04-18 문득수 단방향 또는 양방향 디스플레이 패널의 레진 도포장치, 그리고 이를 활용한 레진 도포방법
JP2020120085A (ja) * 2019-01-28 2020-08-06 日本特殊陶業株式会社 配線基板の製造方法及び配線基板の製造装置
JP2020136640A (ja) * 2019-02-26 2020-08-31 トヨタ自動車株式会社 膜の製造方法
JP7286250B2 (ja) * 2019-08-07 2023-06-05 株式会社ディスコ 保護部材形成装置
KR102354878B1 (ko) * 2019-08-22 2022-01-25 에이피시스템 주식회사 용액 도포장치, 용액 도포방법 및 이를 이용한 합착 방법
KR20220077315A (ko) 2020-12-01 2022-06-09 삼성디스플레이 주식회사 표시 장치, 그 표시 장치 제조 장치, 및 그 표시 장치의 제조 방법

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JPS6211570A (ja) * 1985-07-05 1987-01-20 Honda Motor Co Ltd 自動塗布装置
JPH0721254Y2 (ja) * 1992-09-18 1995-05-17 徹也 北城 紫外線硬化型樹脂材料の塗付兼硬化装置
JP3113502B2 (ja) * 1994-05-31 2000-12-04 キヤノン株式会社 封止装置
JPH08298394A (ja) * 1995-04-26 1996-11-12 Tescon:Kk ディスペンサー装置
JPH11128800A (ja) * 1997-10-27 1999-05-18 Fujitsu Ten Ltd 接着剤塗布装置
JP2001282147A (ja) * 2000-03-31 2001-10-12 Minolta Co Ltd 積層型表示パネルの製造方法
JP4558973B2 (ja) * 2001-04-20 2010-10-06 株式会社小森コーポレーション 印刷機またはコーティング装置
KR100850472B1 (ko) * 2002-07-05 2008-08-07 엘지디스플레이 주식회사 유브이 경화장치를 포함하는 홀로그래픽 확산층 복제장비
KR100724475B1 (ko) * 2002-11-13 2007-06-04 엘지.필립스 엘시디 주식회사 액정 표시패널의 실 디스펜서 및 이를 이용한 실 패턴의단선 검출방법
JP4200758B2 (ja) * 2002-12-26 2008-12-24 株式会社日立ハイテクノロジーズ パネルの樹脂塗布方法、ディスプレイ用パネルの製造方法及び樹脂塗布装置
JP4393093B2 (ja) * 2003-03-31 2010-01-06 シャープ株式会社 液剤描画装置
JP2004322460A (ja) * 2003-04-24 2004-11-18 Konica Minolta Medical & Graphic Inc 画像記録装置
JP4741897B2 (ja) * 2005-01-12 2011-08-10 芝浦メカトロニクス株式会社 光硬化性樹脂の塗布装置及び塗布方法

Also Published As

Publication number Publication date
TW200624967A (en) 2006-07-16
CN101098760B (zh) 2010-12-08
KR100893739B1 (ko) 2009-04-17
WO2006075421A1 (ja) 2006-07-20
JP2006218470A (ja) 2006-08-24
CN101098760A (zh) 2008-01-02
JP4741897B2 (ja) 2011-08-10
KR20070074660A (ko) 2007-07-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees