TWI367925B - Adhesive sheet for light-emitting diode device and light-emitting diode device - Google Patents

Adhesive sheet for light-emitting diode device and light-emitting diode device

Info

Publication number
TWI367925B
TWI367925B TW094102250A TW94102250A TWI367925B TW I367925 B TWI367925 B TW I367925B TW 094102250 A TW094102250 A TW 094102250A TW 94102250 A TW94102250 A TW 94102250A TW I367925 B TWI367925 B TW I367925B
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
diode device
adhesive sheet
emitting
Prior art date
Application number
TW094102250A
Other languages
English (en)
Other versions
TW200536918A (en
Inventor
Koji Itoh
Shigeyoshi Ishii
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200536918A publication Critical patent/TW200536918A/zh
Application granted granted Critical
Publication of TWI367925B publication Critical patent/TWI367925B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW094102250A 2004-02-02 2005-01-26 Adhesive sheet for light-emitting diode device and light-emitting diode device TWI367925B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004025723A JP2005217369A (ja) 2004-02-02 2004-02-02 発光ダイオード装置用接着シート及び発光ダイオード装置

Publications (2)

Publication Number Publication Date
TW200536918A TW200536918A (en) 2005-11-16
TWI367925B true TWI367925B (en) 2012-07-11

Family

ID=34835832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102250A TWI367925B (en) 2004-02-02 2005-01-26 Adhesive sheet for light-emitting diode device and light-emitting diode device

Country Status (7)

Country Link
US (2) US7646088B2 (zh)
JP (1) JP2005217369A (zh)
KR (1) KR101058701B1 (zh)
CN (1) CN1926214B (zh)
MY (1) MY145701A (zh)
TW (1) TWI367925B (zh)
WO (1) WO2005076376A2 (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217369A (ja) * 2004-02-02 2005-08-11 Three M Innovative Properties Co 発光ダイオード装置用接着シート及び発光ダイオード装置
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
DE102006010729A1 (de) 2005-12-09 2007-06-14 Osram Opto Semiconductors Gmbh Optisches Element, Herstellungsverfahren hierfür und Verbund-Bauteil mit einem optischen Element
JP2007208061A (ja) * 2006-02-02 2007-08-16 Sharp Corp 半導体発光素子，その製造方法，半導体発光素子アセンブリ
JP4963839B2 (ja) * 2006-02-06 2012-06-27 昭和電工株式会社 発光装置
WO2007125815A1 (ja) * 2006-04-24 2007-11-08 Nitto Denko Corporation 画像表示装置用補強シート、画像表示装置およびその補強方法
CN100368895C (zh) * 2006-05-30 2008-02-13 友达光电股份有限公司 使用发光二极管的背光模块
US8330176B2 (en) 2007-02-13 2012-12-11 3M Innovative Properties Company LED devices having lenses and methods of making same
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
JP2009103916A (ja) * 2007-10-23 2009-05-14 Sekisui Plastics Co Ltd 光反射板及びこれを用いた照明体
JP4976982B2 (ja) * 2007-10-30 2012-07-18 パナソニック株式会社 Ｌｅｄユニット
JP5123031B2 (ja) * 2008-04-10 2013-01-16 日東電工株式会社 光半導体素子封止用シート
JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ｌｅｄランプの製造方法
KR200454942Y1 (ko) * 2009-05-06 2011-08-08 김선종 발광 스티커
US7855394B2 (en) * 2009-06-18 2010-12-21 Bridgelux, Inc. LED array package covered with a highly thermal conductive plate
JP5394840B2 (ja) * 2009-07-15 2014-01-22 ユニチカ株式会社 エッチング保護材
CN102473819A (zh) * 2009-08-27 2012-05-23 京瓷株式会社 发光装置
CN102339936B (zh) * 2010-07-27 2015-04-29 展晶科技(深圳)有限公司 发光装置封装结构及其制造方法
KR101251796B1 (ko) * 2011-06-27 2013-04-08 재 동 윤 기판 제조 방법, 기판 및 이를 구비한 엘이디 타입 조명등용 기구
WO2013018360A1 (ja) * 2011-08-01 2013-02-07 三井化学株式会社 反射材用熱可塑性樹脂組成物、反射板および発光ダイオード素子
CN103814448B (zh) * 2011-11-29 2015-07-01 夏普株式会社 发光器件的制造方法
WO2013094395A1 (ja) * 2011-12-22 2013-06-27 日東電工株式会社 半導体装置、光半導体装置および放熱部材
ITMI20120135A1 (it) * 2012-02-02 2013-08-03 Diab Int Ab Procedimento per la produzione di schiume di pet e schiume di pet ottenute con questo procedimento
JP6062675B2 (ja) * 2012-07-24 2017-01-18 シャープ株式会社 発光装置及び照明装置
KR102294163B1 (ko) * 2014-12-05 2021-08-27 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 모듈
US20190267525A1 (en) 2018-02-26 2019-08-29 Semicon Light Co., Ltd. Semiconductor Light Emitting Devices And Method Of Manufacturing The Same
EP3997187A4 (en) * 2019-07-10 2023-03-01 Hewlett-Packard Development Company, L.P. REPOSITIONABLE, OPTICALLY TRANSPARENT ADHESIVE COMPOSITIONS

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765023B2 (ja) 1985-12-13 1995-07-12 ソニーケミカル株式会社 フィルム状導電異方性接着剤
JPS6414235A (en) * 1987-07-08 1989-01-18 Showa Denko Kk Crosslinked ethylenic copolymer mixture
JPH075759B2 (ja) * 1987-07-08 1995-01-25 昭和電工株式会社 エチレン系共重合体の混合物の肉薄物
JPH0778109B2 (ja) * 1987-09-07 1995-08-23 昭和電工株式会社 エチレン系共重合体の混合物の肉薄物
JP2948412B2 (ja) * 1992-05-08 1999-09-13 ローム株式会社 側面発光型の半導体発光素子を製造する方法
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US6051652A (en) * 1995-10-31 2000-04-18 3M Innovative Properties Company Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive
EP1249479B1 (en) * 1996-07-15 2004-02-18 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for joining members
JP3022796B2 (ja) 1997-02-04 2000-03-21 積水化学工業株式会社 硬化型粘接着シート及び部材の接合方法
JP4201858B2 (ja) * 1997-05-13 2008-12-24 スリーエム カンパニー 熱硬化性接着剤組成物、その製造方法および接着構造
US6309502B1 (en) * 1997-08-19 2001-10-30 3M Innovative Properties Company Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
JP2000053934A (ja) * 1998-07-28 2000-02-22 Minnesota Mining & Mfg Co <3M> 接着剤組成物およびその前駆体
JP3349111B2 (ja) * 1999-03-15 2002-11-20 株式会社シチズン電子 表面実装型発光ダイオード及びその製造方法
JP3449538B2 (ja) * 1999-06-11 2003-09-22 スタンレー電気株式会社 光電変換素子およびその製造方法
JP2001107009A (ja) * 1999-09-30 2001-04-17 Three M Innovative Properties Co 熱硬化性接着剤組成物及びそれを用いた接着構造
JP2001144333A (ja) * 1999-11-10 2001-05-25 Sharp Corp 発光装置とその製造方法
JP2002332465A (ja) * 2001-04-25 2002-11-22 Three M Innovative Properties Co 熱硬化性接着剤組成物
JP2003292908A (ja) * 2002-04-02 2003-10-15 Three M Innovative Properties Co 導電性及び熱伝導性を有する熱硬化型接着シート
JP2005217369A (ja) * 2004-02-02 2005-08-11 Three M Innovative Properties Co 発光ダイオード装置用接着シート及び発光ダイオード装置

Also Published As

Publication number Publication date
CN1926214A (zh) 2007-03-07
KR101058701B1 (ko) 2011-08-22
TW200536918A (en) 2005-11-16
WO2005076376A3 (en) 2006-03-09
CN1926214B (zh) 2010-06-23
US7973403B2 (en) 2011-07-05
JP2005217369A (ja) 2005-08-11
MY145701A (en) 2012-03-30
US20080237617A1 (en) 2008-10-02
US20100065878A1 (en) 2010-03-18
KR20070001978A (ko) 2007-01-04
US7646088B2 (en) 2010-01-12
WO2005076376A2 (en) 2005-08-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees