TWI367863B - Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing - Google Patents

Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing

Info

Publication number
TWI367863B
TWI367863B TW096137695A TW96137695A TWI367863B TW I367863 B TWI367863 B TW I367863B TW 096137695 A TW096137695 A TW 096137695A TW 96137695 A TW96137695 A TW 96137695A TW I367863 B TWI367863 B TW I367863B
Authority
TW
Taiwan
Prior art keywords
polishing
powder
processes
preparation
oxide particles
Prior art date
Application number
TW096137695A
Other languages
English (en)
Other versions
TW200831412A (en
Inventor
Guillaume Criniere
Original Assignee
Rhodia Operations
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhodia Operations filed Critical Rhodia Operations
Publication of TW200831412A publication Critical patent/TW200831412A/zh
Application granted granted Critical
Publication of TWI367863B publication Critical patent/TWI367863B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01FCOMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00Compounds of rare earth metals
    • C01F17/20Compounds containing only rare earth metals as the metal element
    • C01F17/206Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224Oxides or hydroxides of lanthanides
    • C01F17/235Cerium oxides or hydroxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1436Composite particles, e.g. coated particles
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/70Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/04Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/50Agglomerated particles
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/51Particles with a specific particle size distribution
    • C01P2004/52Particles with a specific particle size distribution highly monodisperse size distribution
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Catalysts (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW096137695A 2006-10-09 2007-10-08 Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing TWI367863B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0608838A FR2906800B1 (fr) 2006-10-09 2006-10-09 Suspension liquide et poudre de particules d'oxyde de cerium, procedes de preparation de celles-ci et utilisation dans le polissage

Publications (2)

Publication Number Publication Date
TW200831412A TW200831412A (en) 2008-08-01
TWI367863B true TWI367863B (en) 2012-07-11

Family

ID=38158014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096137695A TWI367863B (en) 2006-10-09 2007-10-08 Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing

Country Status (9)

Country Link
US (1) US8317888B2 (zh)
EP (1) EP2081871B1 (zh)
JP (1) JP5586229B2 (zh)
KR (4) KR20120030575A (zh)
CN (2) CN102627310B (zh)
ES (1) ES2628504T3 (zh)
FR (1) FR2906800B1 (zh)
TW (1) TWI367863B (zh)
WO (1) WO2008043703A2 (zh)

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CN103497732B (zh) 2010-11-22 2016-08-10 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基板的研磨方法及基板
KR101886892B1 (ko) 2010-11-22 2018-08-08 히타치가세이가부시끼가이샤 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
SG10201606827RA (en) 2012-02-21 2016-10-28 Hitachi Chemical Co Ltd Polishing agent, polishing agent set, and substrate polishing method
KR102004570B1 (ko) 2012-02-21 2019-07-26 히타치가세이가부시끼가이샤 연마제, 연마제 세트 및 기체의 연마 방법
KR102034331B1 (ko) 2012-05-22 2019-10-18 히타치가세이가부시끼가이샤 슬러리, 연마액 세트, 연마액, 기체의 연마 방법 및 기체
SG11201407031VA (en) * 2012-05-22 2014-12-30 Hitachi Chemical Co Ltd Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
SG11201407087XA (en) 2012-05-22 2014-12-30 Hitachi Chemical Co Ltd Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
JP5943074B2 (ja) * 2012-05-22 2016-06-29 日立化成株式会社 スラリー、研磨液セット、研磨液及び基体の研磨方法
WO2015091495A1 (en) 2013-12-16 2015-06-25 Rhodia Operations Liquid suspension of cerium oxide particles
RU2563015C2 (ru) * 2014-01-30 2015-09-10 Общество с ограниченной ответственностью "Научно-производственная компания "Русредмет"(ООО НПК"Русредмет") Способ выделения церия из нитратных растворов, содержащих сумму редкоземельных элементов
JP6169120B2 (ja) * 2014-03-13 2017-07-26 第一稀元素化学工業株式会社 セリウム含有溶液及びその製造方法
TWI635905B (zh) 2014-06-24 2018-09-21 羅地亞經營管理公司 金屬摻雜氧化鈰組合物
KR101773543B1 (ko) 2015-06-30 2017-09-01 유비머트리얼즈주식회사 연마 입자, 연마 슬러리 및 연마 입자의 제조 방법
CN108025276A (zh) 2015-09-23 2018-05-11 罗地亚经营管理公司 疏水改性的氧化铈颗粒及其用途
FR3041528A1 (fr) 2015-09-25 2017-03-31 Rhodia Operations Composition cosmetique photoprotectrice
FR3047736A1 (fr) * 2016-02-17 2017-08-18 Rhodia Operations Composition de peinture formulee en phase aqueuse
FR3047737A1 (fr) * 2016-02-17 2017-08-18 Rhodia Operations Composition fluide pour proteger le bois
JP2017228576A (ja) * 2016-06-20 2017-12-28 日立化成株式会社 研磨液及び研磨方法
KR20190089945A (ko) 2016-12-02 2019-07-31 로디아 오퍼레이션스 산화세륨의 현탁액
JP6827318B2 (ja) * 2016-12-28 2021-02-10 花王株式会社 酸化セリウム砥粒
JP7326166B2 (ja) 2017-06-15 2023-08-15 ローディア オペレーションズ セリウム系粒子
FR3074162A1 (fr) 2017-11-24 2019-05-31 Rhodia Operations Particules d'oxyde de cerium / silice
US11814547B2 (en) 2018-09-28 2023-11-14 Kao Corporation Polishing liquid composition for silicon oxide film
KR102282872B1 (ko) * 2019-11-11 2021-07-28 주식회사 켐톤 세륨 산화물 입자의 제조방법, 연마입자 및 이를 포함하는 연마용 슬러리 조성물
EP4065658A1 (en) 2019-11-26 2022-10-05 Rhodia Operations Liquid dispersion and powder of cerium based core-shell particles, process for producing the same and uses thereof in polishing
WO2021105174A1 (en) * 2019-11-26 2021-06-03 Rhodia Operations Cerium based particles, process for producing the same and uses thereof in polishing
CN114671451A (zh) * 2020-12-25 2022-06-28 安集微电子(上海)有限公司 一种氧化铈的合成方法及其使用方法
JP2024511723A (ja) 2021-03-12 2024-03-15 ローディア オペレーションズ 酸化セリウム粒子、その製造プロセス及びその化学機械研磨における使用
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Also Published As

Publication number Publication date
JP2010505735A (ja) 2010-02-25
KR20120030575A (ko) 2012-03-28
CN101522567B (zh) 2014-06-04
US8317888B2 (en) 2012-11-27
KR101139110B1 (ko) 2012-07-05
FR2906800A1 (fr) 2008-04-11
KR101475174B1 (ko) 2014-12-22
EP2081871A2 (fr) 2009-07-29
FR2906800B1 (fr) 2008-11-28
JP5586229B2 (ja) 2014-09-10
US20100072417A1 (en) 2010-03-25
KR20090064566A (ko) 2009-06-19
CN101522567A (zh) 2009-09-02
ES2628504T3 (es) 2017-08-03
CN102627310B (zh) 2017-06-20
CN102627310A (zh) 2012-08-08
WO2008043703A2 (fr) 2008-04-17
KR20130140228A (ko) 2013-12-23
KR20130045954A (ko) 2013-05-06
EP2081871B1 (fr) 2017-05-03
TW200831412A (en) 2008-08-01
WO2008043703A3 (fr) 2008-08-14

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