TWI367863B - Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing - Google Patents

Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing

Info

Publication number
TWI367863B
TWI367863B TW096137695A TW96137695A TWI367863B TW I367863 B TWI367863 B TW I367863B TW 096137695 A TW096137695 A TW 096137695A TW 96137695 A TW96137695 A TW 96137695A TW I367863 B TWI367863 B TW I367863B
Authority
TW
Taiwan
Prior art keywords
polishing
powder
processes
preparation
oxide particles
Prior art date
Application number
TW096137695A
Other languages
English (en)
Chinese (zh)
Other versions
TW200831412A (en
Inventor
Guillaume Criniere
Original Assignee
Rhodia Operations
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhodia Operations filed Critical Rhodia Operations
Publication of TW200831412A publication Critical patent/TW200831412A/zh
Application granted granted Critical
Publication of TWI367863B publication Critical patent/TWI367863B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C01P2004/52—Particles with a specific particle size distribution highly monodisperse size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Catalysts (AREA)
TW096137695A 2006-10-09 2007-10-08 Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing TWI367863B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0608838A FR2906800B1 (fr) 2006-10-09 2006-10-09 Suspension liquide et poudre de particules d'oxyde de cerium, procedes de preparation de celles-ci et utilisation dans le polissage

Publications (2)

Publication Number Publication Date
TW200831412A TW200831412A (en) 2008-08-01
TWI367863B true TWI367863B (en) 2012-07-11

Family

ID=38158014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096137695A TWI367863B (en) 2006-10-09 2007-10-08 Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing

Country Status (9)

Country Link
US (1) US8317888B2 (enExample)
EP (1) EP2081871B1 (enExample)
JP (1) JP5586229B2 (enExample)
KR (4) KR101475174B1 (enExample)
CN (2) CN102627310B (enExample)
ES (1) ES2628504T3 (enExample)
FR (1) FR2906800B1 (enExample)
TW (1) TWI367863B (enExample)
WO (1) WO2008043703A2 (enExample)

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US9982177B2 (en) 2010-03-12 2018-05-29 Hitachi Chemical Company, Ltd Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
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JP5590144B2 (ja) 2010-11-22 2014-09-17 日立化成株式会社 スラリー、研磨液セット、研磨液、及び、基板の研磨方法
WO2013125445A1 (ja) 2012-02-21 2013-08-29 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
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JP6169120B2 (ja) * 2014-03-13 2017-07-26 第一稀元素化学工業株式会社 セリウム含有溶液及びその製造方法
TW201822886A (zh) * 2014-06-24 2018-07-01 法商羅地亞經營管理公司 金屬摻雜氧化鈰組合物
KR101773543B1 (ko) 2015-06-30 2017-09-01 유비머트리얼즈주식회사 연마 입자, 연마 슬러리 및 연마 입자의 제조 방법
JP6991964B2 (ja) 2015-09-23 2022-01-13 ローディア オペレーションズ 疎水的に改質された酸化セリウム粒子およびそれらの使用
FR3041528A1 (fr) * 2015-09-25 2017-03-31 Rhodia Operations Composition cosmetique photoprotectrice
FR3047736A1 (fr) * 2016-02-17 2017-08-18 Rhodia Operations Composition de peinture formulee en phase aqueuse
FR3047737A1 (fr) 2016-02-17 2017-08-18 Rhodia Operations Composition fluide pour proteger le bois
JP2017228576A (ja) * 2016-06-20 2017-12-28 日立化成株式会社 研磨液及び研磨方法
EP3548436A1 (fr) 2016-12-02 2019-10-09 Rhodia Operations Suspension d'oxyde de cerium
JP6827318B2 (ja) * 2016-12-28 2021-02-10 花王株式会社 酸化セリウム砥粒
WO2018229005A1 (en) 2017-06-15 2018-12-20 Rhodia Operations Cerium based particles
FR3074162A1 (fr) 2017-11-24 2019-05-31 Rhodia Operations Particules d'oxyde de cerium / silice
JP6939741B2 (ja) * 2018-08-31 2021-09-22 信越化学工業株式会社 希土類化合物粒子の製造方法
US11814547B2 (en) 2018-09-28 2023-11-14 Kao Corporation Polishing liquid composition for silicon oxide film
KR102282872B1 (ko) * 2019-11-11 2021-07-28 주식회사 켐톤 세륨 산화물 입자의 제조방법, 연마입자 및 이를 포함하는 연마용 슬러리 조성물
EP4065659A1 (en) * 2019-11-26 2022-10-05 Rhodia Operations Cerium based particles, process for producing the same and uses thereof in polishing
CN114599754B (zh) 2019-11-26 2024-09-13 罗地亚经营管理公司 基于铈的核-壳颗粒的液体分散体和粉末、其生产方法及其在抛光中的用途
CN114671451A (zh) * 2020-12-25 2022-06-28 安集微电子（上海）有限公司 一种氧化铈的合成方法及其使用方法
IL305292A (en) 2021-03-12 2023-10-01 Rhodia Operations Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing
JP2024513308A (ja) 2021-03-12 2024-03-25 ローディア オペレーションズ 酸化セリウム粒子、その製造プロセス及び化学機械研磨でのその使用
JP7511105B2 (ja) 2021-03-26 2024-07-05 Ａｇｃ株式会社 化学強化ガラス及び化学強化ガラスの製造方法
IL308442A (en) 2021-05-17 2024-01-01 Rhodia Operations Liquid and powder dispersion of cerium-based shell-core particles, a process for their production and their uses in polishing
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KR102679084B1 (ko) 2021-08-30 2024-06-27 주식회사 케이씨텍 산화세륨 연마입자 및 연마 슬러리 조성물
KR20240138088A (ko) 2022-01-28 2024-09-20 에이지씨 가부시키가이샤 연마제, 연마제용 첨가액 및 연마 방법
CN119768483A (zh) 2022-09-07 2025-04-04 Ａｇｃ株式会社 研磨剂、研磨剂用添加液和研磨方法
CN115403063B (zh) * 2022-09-30 2024-08-06 深圳市聚芯半导体材料有限公司 一种二氧化铈颗粒及其制备方法和应用
CN120282859A (zh) 2022-10-20 2025-07-08 Ａｇｃ株式会社 研磨方法和半导体部件的制造方法
CN118725745A (zh) * 2023-03-31 2024-10-01 华为技术有限公司 分散液及其应用
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WO2025133363A1 (en) 2023-12-21 2025-06-26 Specialty Operations France Compositions comprising cerium oxide/polyoxometalate particles and ion exchange polymer, and their use in proton exchange membranes or electrocatalyst layers
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Also Published As

Publication number Publication date
WO2008043703A2 (fr) 2008-04-17
KR20130045954A (ko) 2013-05-06
US8317888B2 (en) 2012-11-27
JP2010505735A (ja) 2010-02-25
ES2628504T3 (es) 2017-08-03
CN101522567B (zh) 2014-06-04
KR20090064566A (ko) 2009-06-19
CN102627310B (zh) 2017-06-20
FR2906800B1 (fr) 2008-11-28
US20100072417A1 (en) 2010-03-25
TW200831412A (en) 2008-08-01
EP2081871A2 (fr) 2009-07-29
CN101522567A (zh) 2009-09-02
FR2906800A1 (fr) 2008-04-11
KR20130140228A (ko) 2013-12-23
KR101139110B1 (ko) 2012-07-05
WO2008043703A3 (fr) 2008-08-14
CN102627310A (zh) 2012-08-08
JP5586229B2 (ja) 2014-09-10
KR101475174B1 (ko) 2014-12-22
EP2081871B1 (fr) 2017-05-03
KR20120030575A (ko) 2012-03-28

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