TWI365677B - Encapsulation assembly for electronic devices - Google Patents
Encapsulation assembly for electronic devicesInfo
- Publication number
- TWI365677B TWI365677B TW093134578A TW93134578A TWI365677B TW I365677 B TWI365677 B TW I365677B TW 093134578 A TW093134578 A TW 093134578A TW 93134578 A TW93134578 A TW 93134578A TW I365677 B TWI365677 B TW I365677B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic devices
- encapsulation assembly
- encapsulation
- assembly
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
- C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51913903P | 2003-11-12 | 2003-11-12 | |
US61922204P | 2004-10-15 | 2004-10-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200524461A TW200524461A (en) | 2005-07-16 |
TWI365677B true TWI365677B (en) | 2012-06-01 |
Family
ID=34623092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093134578A TWI365677B (en) | 2003-11-12 | 2004-11-12 | Encapsulation assembly for electronic devices |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1683209A2 (fr) |
JP (1) | JP4980718B2 (fr) |
KR (1) | KR20060113710A (fr) |
TW (1) | TWI365677B (fr) |
WO (1) | WO2005050751A2 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI493799B (zh) * | 2012-08-24 | 2015-07-21 | Apple Inc | 連接器及封閉一連接器的方法 |
TWI750421B (zh) * | 2018-10-30 | 2021-12-21 | 立景光電股份有限公司 | 顯示面板 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080211090A1 (en) * | 2005-07-05 | 2008-09-04 | Koninklijke Philips Electronics, N.V. | Packed Semiconductor Sensor Chip For Use In Liquids |
DE102005053722B4 (de) | 2005-11-10 | 2007-08-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile |
US20070172971A1 (en) * | 2006-01-20 | 2007-07-26 | Eastman Kodak Company | Desiccant sealing arrangement for OLED devices |
KR100673765B1 (ko) | 2006-01-20 | 2007-01-24 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
KR100671647B1 (ko) * | 2006-01-26 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 |
KR100732817B1 (ko) * | 2006-03-29 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
DE102006016260A1 (de) | 2006-04-06 | 2007-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanische Gehäusung mit mindestens zwei Kavitäten mit unterschiedlichem Innendruck und/oder unterschiedlicher Gaszusammensetzung sowie Verfahren zu deren Herstellung |
US7800303B2 (en) * | 2006-11-07 | 2010-09-21 | Corning Incorporated | Seal for light emitting display device, method, and apparatus |
KR20080051756A (ko) * | 2006-12-06 | 2008-06-11 | 삼성에스디아이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
TW200836580A (en) * | 2007-02-28 | 2008-09-01 | Corning Inc | Seal for light emitting display device and method |
TWI378592B (en) * | 2007-09-04 | 2012-12-01 | Iner Aec Executive Yuan | Sealing material for solid oxide fuel cells |
DE102007053849A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Anordnung umfassend ein optoelektronisches Bauelement |
ITMI20071903A1 (it) * | 2007-10-04 | 2009-04-05 | Getters Spa | Metodo per la produzione di pannelli solari mediante l'impiego di un tristrato polimerico comprendente un sistema getter composito |
EP2053026B1 (fr) * | 2007-10-26 | 2014-04-02 | Institute of Nuclear Energy Research, Atomic Energy Council | Matériau d'étanchéité pour piles à combustible d'oxyde solide |
KR100976457B1 (ko) * | 2008-10-22 | 2010-08-17 | 삼성모바일디스플레이주식회사 | 유기전계발광표시장치 및 그 제조방법 |
KR100993415B1 (ko) * | 2009-03-24 | 2010-11-09 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시 장치 |
KR101180234B1 (ko) * | 2009-04-03 | 2012-09-05 | (주)엘지하우시스 | 디자인층을 구비한 건물 일체형 태양전지 모듈 |
US8440479B2 (en) * | 2009-05-28 | 2013-05-14 | Corning Incorporated | Method for forming an organic light emitting diode device |
CN102804440B (zh) * | 2009-06-24 | 2016-01-20 | 三菱化学株式会社 | 有机电子器件及其制造方法 |
US8505337B2 (en) | 2009-07-17 | 2013-08-13 | Corning Incorporated | Methods for forming fritted cover sheets and glass packages comprising the same |
JP5824809B2 (ja) | 2010-02-10 | 2015-12-02 | 日本電気硝子株式会社 | シール材及びそれを用いたシール方法 |
KR101297375B1 (ko) * | 2011-09-05 | 2013-08-19 | 주식회사 에스에프에이 | 평면디스플레이용 화학 기상 증착장치 |
JP2014007198A (ja) * | 2012-06-21 | 2014-01-16 | Kaneka Corp | 結晶シリコン系光電変換装置およびその製造方法 |
JP6192912B2 (ja) * | 2012-09-14 | 2017-09-06 | 株式会社カネカ | 有機el装置 |
JP6192911B2 (ja) * | 2012-09-10 | 2017-09-06 | 株式会社カネカ | 有機el装置及びその製造方法 |
US9450202B2 (en) | 2012-10-31 | 2016-09-20 | Industrial Technology Research Institute | Environmental sensitive electronic device package having side wall barrier structure |
TWI581422B (zh) * | 2013-05-15 | 2017-05-01 | 財團法人工業技術研究院 | 環境敏感電子元件封裝體 |
US8829507B2 (en) | 2012-12-06 | 2014-09-09 | General Electric Company | Sealed organic opto-electronic devices and related methods of manufacturing |
JP6185304B2 (ja) * | 2013-06-28 | 2017-08-23 | 株式会社カネカ | 結晶シリコン系光電変換装置およびその製造方法 |
CN104030578B (zh) * | 2014-07-03 | 2016-08-17 | 王磊 | 真空复合隔离围护构件 |
CN107046104A (zh) * | 2017-01-10 | 2017-08-15 | 广东欧珀移动通信有限公司 | Oled封装结构及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2127740B (en) * | 1982-09-30 | 1985-10-23 | Burr Brown Res Corp | Improved hermetic sealing process |
JPS61136247A (ja) * | 1984-12-07 | 1986-06-24 | Toshiba Corp | 半導体装置 |
US6426484B1 (en) * | 1996-09-10 | 2002-07-30 | Micron Technology, Inc. | Circuit and method for heating an adhesive to package or rework a semiconductor die |
JPH11121167A (ja) * | 1997-10-16 | 1999-04-30 | Tdk Corp | 有機el素子 |
JP2000040585A (ja) * | 1998-07-21 | 2000-02-08 | Tdk Corp | 有機el素子モジュール |
US6255239B1 (en) * | 1998-12-04 | 2001-07-03 | Cerdec Corporation | Lead-free alkali metal-free glass compositions |
JP2001057287A (ja) * | 1999-08-20 | 2001-02-27 | Tdk Corp | 有機el素子 |
US6333460B1 (en) * | 2000-04-14 | 2001-12-25 | International Business Machines Corporation | Structural support for direct lid attach |
JP2002299043A (ja) * | 2001-03-30 | 2002-10-11 | Sanyo Electric Co Ltd | 有機電界発光型ディスプレイの封止構造 |
WO2003005774A1 (fr) * | 2001-05-24 | 2003-01-16 | Orion Electric Co., Ltd. | Bac d'encapsulation de diodes electroluminescentes organiques et son procede de fabrication |
US6933537B2 (en) * | 2001-09-28 | 2005-08-23 | Osram Opto Semiconductors Gmbh | Sealing for OLED devices |
JP3942017B2 (ja) * | 2002-03-25 | 2007-07-11 | 富士フイルム株式会社 | 発光素子 |
JP2005086032A (ja) * | 2003-09-09 | 2005-03-31 | Kyocera Corp | 圧電振動子収納用容器 |
-
2004
- 2004-11-10 WO PCT/US2004/037597 patent/WO2005050751A2/fr active Application Filing
- 2004-11-10 EP EP04800977A patent/EP1683209A2/fr not_active Ceased
- 2004-11-10 JP JP2006539838A patent/JP4980718B2/ja not_active Expired - Fee Related
- 2004-11-10 KR KR1020067009170A patent/KR20060113710A/ko active Search and Examination
- 2004-11-12 TW TW093134578A patent/TWI365677B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI493799B (zh) * | 2012-08-24 | 2015-07-21 | Apple Inc | 連接器及封閉一連接器的方法 |
TWI750421B (zh) * | 2018-10-30 | 2021-12-21 | 立景光電股份有限公司 | 顯示面板 |
Also Published As
Publication number | Publication date |
---|---|
KR20060113710A (ko) | 2006-11-02 |
JP2007516611A (ja) | 2007-06-21 |
EP1683209A2 (fr) | 2006-07-26 |
WO2005050751A2 (fr) | 2005-06-02 |
WO2005050751A3 (fr) | 2005-07-28 |
TW200524461A (en) | 2005-07-16 |
JP4980718B2 (ja) | 2012-07-18 |
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