TWI362908B - - Google Patents
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- Publication number
- TWI362908B TWI362908B TW094130585A TW94130585A TWI362908B TW I362908 B TWI362908 B TW I362908B TW 094130585 A TW094130585 A TW 094130585A TW 94130585 A TW94130585 A TW 94130585A TW I362908 B TWI362908 B TW I362908B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- wiring
- metal
- layer
- insulating film
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 202
- 229910052751 metal Inorganic materials 0.000 claims description 202
- 239000010410 layer Substances 0.000 claims description 176
- 239000011229 interlayer Substances 0.000 claims description 83
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 43
- 238000004519 manufacturing process Methods 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 40
- 239000010949 copper Substances 0.000 claims description 40
- 229920002120 photoresistant polymer Polymers 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 229920001169 thermoplastic Polymers 0.000 claims description 30
- 239000004416 thermosoftening plastic Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 230000003746 surface roughness Effects 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 8
- 238000004377 microelectronic Methods 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920006255 plastic film Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 150000002632 lipids Chemical class 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 8
- 238000000576 coating method Methods 0.000 claims 8
- 238000000059 patterning Methods 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 3
- 150000002739 metals Chemical class 0.000 claims 3
- 229920006267 polyester film Polymers 0.000 claims 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 239000004519 grease Substances 0.000 claims 1
- 150000003949 imides Chemical class 0.000 claims 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims 1
- 229920000768 polyamine Polymers 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000004383 yellowing Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 322
- 230000015572 biosynthetic process Effects 0.000 description 23
- 239000011162 core material Substances 0.000 description 19
- 238000002474 experimental method Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- CCEKAJIANROZEO-UHFFFAOYSA-N sulfluramid Chemical group CCNS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F CCEKAJIANROZEO-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004257966 | 2004-09-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200623999A TW200623999A (en) | 2006-07-01 |
| TWI362908B true TWI362908B (OSRAM) | 2012-04-21 |
Family
ID=36036371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094130585A TW200623999A (en) | 2004-09-06 | 2005-09-06 | Member for interconnecting wiring films and method for producing the same |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20080264678A1 (OSRAM) |
| JP (1) | JPWO2006028090A1 (OSRAM) |
| KR (1) | KR20070101213A (OSRAM) |
| CN (1) | CN101120622B (OSRAM) |
| TW (1) | TW200623999A (OSRAM) |
| WO (1) | WO2006028090A1 (OSRAM) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5526575B2 (ja) * | 2009-03-30 | 2014-06-18 | 凸版印刷株式会社 | 半導体素子用基板の製造方法および半導体装置 |
| US8508045B2 (en) | 2011-03-03 | 2013-08-13 | Broadcom Corporation | Package 3D interconnection and method of making same |
| CN102858085B (zh) * | 2011-06-30 | 2016-01-20 | 昆山华扬电子有限公司 | 厚薄交叉型半蚀刻印制板的制作方法 |
| JP5815640B2 (ja) * | 2012-12-11 | 2015-11-17 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | 電子部品の製造方法。 |
| JP5610039B2 (ja) * | 2013-06-10 | 2014-10-22 | 株式会社村田製作所 | 配線基板の製造方法 |
| KR102212827B1 (ko) * | 2014-06-30 | 2021-02-08 | 엘지이노텍 주식회사 | 인쇄회로기판, 패키지 기판 및 이의 제조 방법 |
| KR102377304B1 (ko) * | 2017-09-29 | 2022-03-22 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조방법 |
| CN110246801B (zh) * | 2018-03-07 | 2021-07-16 | 长鑫存储技术有限公司 | 连接结构及其制造方法、半导体器件 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823943B2 (ja) * | 1975-07-16 | 1983-05-18 | 松下電器産業株式会社 | 絶縁体の貫通電極形成方法 |
| JPS63164225A (ja) * | 1986-12-26 | 1988-07-07 | Furukawa Electric Co Ltd:The | 電気接続用テ−プ状リ−ド |
| JPH0878508A (ja) * | 1994-09-02 | 1996-03-22 | Fujitsu Ltd | ウェーハ保持プレート |
| JPH11260961A (ja) * | 1998-03-12 | 1999-09-24 | Sumitomo Bakelite Co Ltd | 半導体搭載用基板とその製造方法及び半導体チップの実装方法 |
| TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
| JP4322402B2 (ja) * | 2000-06-22 | 2009-09-02 | 大日本印刷株式会社 | プリント配線基板及びその製造方法 |
| JP3769587B2 (ja) * | 2000-11-01 | 2006-04-26 | 株式会社ノース | 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置 |
| KR100495958B1 (ko) * | 2001-03-28 | 2005-06-16 | 가부시키가이샤 노스 | 다층배선기판, 다층배선기판의 제조방법, 다층배선기판의연마기 및 배선기판형성용 금속판 |
| JP3983552B2 (ja) * | 2002-01-16 | 2007-09-26 | 三井金属鉱業株式会社 | 多層プリント配線板の構成材料及び両面プリント配線板の製造方法 |
| JP4045143B2 (ja) * | 2002-02-18 | 2008-02-13 | テセラ・インターコネクト・マテリアルズ，インコーポレイテッド | 配線膜間接続用部材の製造方法及び多層配線基板の製造方法 |
-
2005
- 2005-09-06 KR KR1020077007837A patent/KR20070101213A/ko not_active Ceased
- 2005-09-06 US US11/662,024 patent/US20080264678A1/en not_active Abandoned
- 2005-09-06 CN CN2005800348292A patent/CN101120622B/zh not_active Expired - Fee Related
- 2005-09-06 WO PCT/JP2005/016331 patent/WO2006028090A1/ja not_active Ceased
- 2005-09-06 TW TW094130585A patent/TW200623999A/zh not_active IP Right Cessation
- 2005-09-06 JP JP2006535762A patent/JPWO2006028090A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070101213A (ko) | 2007-10-16 |
| US20080264678A1 (en) | 2008-10-30 |
| WO2006028090A1 (ja) | 2006-03-16 |
| CN101120622A (zh) | 2008-02-06 |
| TW200623999A (en) | 2006-07-01 |
| CN101120622B (zh) | 2010-07-28 |
| JPWO2006028090A1 (ja) | 2008-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |