TWI361455B - - Google Patents

Download PDF

Info

Publication number
TWI361455B
TWI361455B TW095142662A TW95142662A TWI361455B TW I361455 B TWI361455 B TW I361455B TW 095142662 A TW095142662 A TW 095142662A TW 95142662 A TW95142662 A TW 95142662A TW I361455 B TWI361455 B TW I361455B
Authority
TW
Taiwan
Prior art keywords
drying
supply
carrier gas
mixed fluid
processed
Prior art date
Application number
TW095142662A
Other languages
English (en)
Chinese (zh)
Other versions
TW200731386A (en
Inventor
Hiroshi Tanaka
Hidetoshi Nakao
Naoki Shindo
Atushi Yamashita
Kotaro Tsurusaki
Tsukasa Hirayama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200731386A publication Critical patent/TW200731386A/zh
Application granted granted Critical
Publication of TWI361455B publication Critical patent/TWI361455B/zh

Links

Classifications

    • H10P52/00
    • H10P72/0406
    • H10P72/0408
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00Coating apparatus
    • Y10S118/90Semiconductor vapor doping
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
TW095142662A 2005-11-18 2006-11-17 Drying device, drying method, substrate treating device, substrate treating method and computer readable recording medium having program TW200731386A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005334538 2005-11-18
JP2006216464A JP4758846B2 (ja) 2005-11-18 2006-08-09 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム

Publications (2)

Publication Number Publication Date
TW200731386A TW200731386A (en) 2007-08-16
TWI361455B true TWI361455B (cg-RX-API-DMAC10.html) 2012-04-01

Family

ID=38052054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142662A TW200731386A (en) 2005-11-18 2006-11-17 Drying device, drying method, substrate treating device, substrate treating method and computer readable recording medium having program

Country Status (4)

Country Link
US (1) US7581335B2 (cg-RX-API-DMAC10.html)
JP (1) JP4758846B2 (cg-RX-API-DMAC10.html)
KR (1) KR101061926B1 (cg-RX-API-DMAC10.html)
TW (1) TW200731386A (cg-RX-API-DMAC10.html)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4758846B2 (ja) * 2005-11-18 2011-08-31 東京エレクトロン株式会社 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム
US20080155852A1 (en) * 2006-12-29 2008-07-03 Olgado Donald J K Multiple substrate vapor drying systems and methods
JP4805862B2 (ja) 2007-02-21 2011-11-02 富士通セミコンダクター株式会社 基板処理装置、基板処理方法、及び半導体装置の製造方法
JP5104174B2 (ja) * 2007-10-01 2012-12-19 富士通株式会社 洗浄乾燥装置及び洗浄乾燥方法
KR100921520B1 (ko) * 2007-10-05 2009-10-12 세메스 주식회사 척 세정 장치 및 방법 그리고 이를 구비하는 기판 처리장치 및 그의 척 세정 방법
JP5122371B2 (ja) * 2008-05-26 2013-01-16 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラムならびに記憶媒体
US20110186088A1 (en) * 2010-01-31 2011-08-04 Miller Kenneth C Substrate nest with drip remover
JP5522028B2 (ja) 2010-03-09 2014-06-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
DE202011110123U1 (de) * 2011-11-29 2013-02-21 Rena Gmbh Vorrichtung zum Trocknen von Substraten
US9254510B2 (en) * 2012-02-03 2016-02-09 Stmicroelectronics, Inc. Drying apparatus with exhaust control cap for semiconductor wafers and associated methods
CN103377972B (zh) * 2012-04-30 2016-12-28 细美事有限公司 基板处理装置和供给处理溶液的方法
KR101430750B1 (ko) * 2012-04-30 2014-08-14 세메스 주식회사 기판 처리 장치 및 이의 처리 유체 공급 방법
JP6454470B2 (ja) * 2013-03-14 2019-01-16 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
US9829249B2 (en) * 2015-03-10 2017-11-28 Mei, Llc Wafer dryer apparatus and method
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
US9810480B2 (en) * 2015-06-12 2017-11-07 Targeted Microwave Solutions Inc. Methods and apparatus for electromagnetic processing of phyllosilicate minerals
CN205561438U (zh) * 2016-03-23 2016-09-07 常州捷佳创精密机械有限公司 一种槽式烘干结构
US10656525B2 (en) * 2017-09-01 2020-05-19 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Photoresist baking apparatus
US10890377B2 (en) * 2018-05-01 2021-01-12 Rochester Institute Of Technology Volcano-shaped enhancement features for enhanced pool boiling
US10801777B2 (en) * 2018-09-30 2020-10-13 HKC Corporation Limited Baking device
TWI792146B (zh) * 2021-01-07 2023-02-11 弘塑科技股份有限公司 晶圓浸泡清洗裝置
CN118009647B (zh) * 2024-04-09 2024-06-07 常州比太科技有限公司 一种硅片生产烘干装置及其烘干方法

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2174170A (en) * 1936-05-05 1939-09-26 Celluloid Corp Manufacture of stiffening material
US2376095A (en) * 1942-10-15 1945-05-15 Davison Chemical Corp Dehydrating process
US2443443A (en) * 1943-09-22 1948-06-15 Chavannes Marc Alfred Apparatus for producing films
US3218728A (en) * 1963-04-08 1965-11-23 Fmc Corp Low pressure carrier gas sublimation
US3396477A (en) * 1966-11-07 1968-08-13 Pillsbury Co Agglomerating apparatus
AU511678B2 (en) * 1977-08-29 1980-08-28 Airco Inc. Recovering solvents from drying ovens
US4497121A (en) * 1981-05-04 1985-02-05 Polaroid Corporation Process simulator
US4876802A (en) * 1983-12-21 1989-10-31 Gerhard Gergely Process and means for the heat treatment of powdery or granulate material
US4736758A (en) * 1985-04-15 1988-04-12 Wacom Co., Ltd. Vapor drying apparatus
LU86156A1 (fr) * 1985-11-12 1987-06-26 Xrg Systems Procede et dispositif pour extraire des liquides d'agregate et de melanges gaz-vapeur
US5105557A (en) * 1991-03-11 1992-04-21 Vadasz Jozsef T System for rapidly drying parts
US5361514A (en) * 1991-10-30 1994-11-08 Westinghouse Electric Corporation Removal of volatile and semi-volatile contaminants from solids using thermal desorption and gas transport at the solids entrance
US5675909A (en) * 1992-02-10 1997-10-14 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Environment Microwave-assisted separations using volatiles
US5732476A (en) * 1992-02-10 1998-03-31 Pare; J.R. Jocelyn Microwave-assisted separations using volatiles, and apparatus therefor
JP3003016B2 (ja) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 処理装置及び処理方法
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US5634978A (en) * 1994-11-14 1997-06-03 Yieldup International Ultra-low particle semiconductor method
US5964958A (en) * 1995-06-07 1999-10-12 Gary W. Ferrell Methods for drying and cleaning objects using aerosols
US5715612A (en) * 1995-08-17 1998-02-10 Schwenkler; Robert S. Method for precision drying surfaces
US5752532A (en) * 1995-08-17 1998-05-19 Schwenkler; Robert S. Method for the precision cleaning and drying surfaces
US5954911A (en) * 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
KR980012044A (ko) * 1996-03-01 1998-04-30 히가시 데츠로 기판건조장치 및 기판건조방법
DE19654043C2 (de) * 1996-12-23 1998-05-28 Martin Dipl Ing Knabe Trockner mit Abgasreinigung mittels thermischer Nachverbrennung
US5906862A (en) * 1997-04-02 1999-05-25 Minnesota Mining And Manufacturing Company Apparatus and method for drying a coating on a substrate
JP3151613B2 (ja) * 1997-06-17 2001-04-03 東京エレクトロン株式会社 洗浄・乾燥処理方法及びその装置
US6695926B1 (en) * 1997-07-09 2004-02-24 Ses Co., Ltd. Treatment method of semiconductor wafers and the like and treatment system for the same
JP3341148B2 (ja) 1997-12-19 2002-11-05 東京エレクトロン株式会社 洗浄・乾燥処理装置及び洗浄・乾燥処理方法
JP3897404B2 (ja) * 1997-07-22 2007-03-22 オメガセミコン電子株式会社 ベーパ乾燥装置及び乾燥方法
US5884640A (en) * 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates
JP4140742B2 (ja) * 1997-08-07 2008-08-27 東京エレクトロン株式会社 圧力及び流量の制御方法並びにその装置
US5913981A (en) * 1998-03-05 1999-06-22 Micron Technology, Inc. Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall
US6158141A (en) * 1998-05-07 2000-12-12 Sony Corporation Apparatus and method for drying semiconductor substrate
US6207020B1 (en) * 1998-05-12 2001-03-27 International Paper Company Method for conditioning paper and paperboard webs
US6216709B1 (en) * 1998-09-04 2001-04-17 Komag, Inc. Method for drying a substrate
TW442836B (en) * 1998-11-24 2001-06-23 Toho Kasei Co Ltd Wafer drying device and method
US6955516B2 (en) * 2001-11-02 2005-10-18 Applied Materials, Inc. Single wafer dryer and drying methods
US6128830A (en) * 1999-05-15 2000-10-10 Dean Bettcher Apparatus and method for drying solid articles
US6729040B2 (en) * 1999-05-27 2004-05-04 Oliver Design, Inc. Apparatus and method for drying a substrate using hydrophobic and polar organic compounds
WO2000074111A2 (en) * 1999-05-27 2000-12-07 Lam Research Corporation Apparatus and methods for drying batches of wafers
US6625901B1 (en) * 1999-05-27 2003-09-30 Oliver Design, Inc. Apparatus and method for drying a thin substrate
TR200201096T2 (tr) * 1999-10-21 2002-09-23 Aspen Systems, Inc. Hızlı aerojel üretim prosesi.
ES2223875T3 (es) * 2000-01-10 2005-03-01 Honeywell International Inc. Metodo para la fumigacion de sistemas cerrados.
US6286231B1 (en) * 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
WO2001053766A1 (en) * 2000-01-17 2001-07-26 Toho Kasei Co., Ltd. Method and device for drying substrate
US20040250700A1 (en) * 2000-04-19 2004-12-16 Renaud Regis Phillip Method and apparatus for treating refuse with steam
US20020069899A1 (en) * 2000-06-26 2002-06-13 Verhaverbeke Steven Verhaverbeke Method and apparatus for removing adhered moisture form a wafer
JP4069316B2 (ja) * 2000-07-24 2008-04-02 東京エレクトロン株式会社 洗浄処理方法および洗浄処理装置
KR100417040B1 (ko) * 2000-08-03 2004-02-05 삼성전자주식회사 웨이퍼를 건조시키기 위한 방법 및 이를 수행하기 위한웨이퍼 건조장치
JP3837016B2 (ja) * 2000-09-28 2006-10-25 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
US6401361B1 (en) * 2000-11-15 2002-06-11 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for drying wafers by a solvent
KR20040014467A (ko) * 2001-03-15 2004-02-14 아크리온 엘엘씨 건조 증기 발생기
KR100435808B1 (ko) * 2001-06-26 2004-06-10 삼성전자주식회사 마란고니 방식 웨이퍼 건조 방법 및 그 방법에 적합한 장치
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
KR100456527B1 (ko) * 2001-12-11 2004-11-09 삼성전자주식회사 마란고니 효과를 증대시키기 위한 건조 장비 및 건조 방법
JP3684356B2 (ja) * 2002-03-05 2005-08-17 株式会社カイジョー 洗浄物の乾燥装置及び乾燥方法
JP3939178B2 (ja) * 2002-03-25 2007-07-04 大日本スクリーン製造株式会社 高圧乾燥装置、高圧乾燥方法および基板処理装置
US6988327B2 (en) * 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
KR100493849B1 (ko) * 2002-09-30 2005-06-08 삼성전자주식회사 웨이퍼 건조 장치
US7093375B2 (en) * 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
AT412999B (de) * 2002-11-12 2005-09-26 Wiedl Alfred Anlage zum trocknen von gütern
JP2004198066A (ja) * 2002-12-20 2004-07-15 Matsui Mfg Co 粉粒体材料の乾燥貯留装置及び粉粒体材料の供給システム
JP3592702B1 (ja) * 2003-08-12 2004-11-24 エス・イー・エス株式会社 基板処理方法及び基板処理装置
US6928748B2 (en) * 2003-10-16 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Method to improve post wafer etch cleaning process
KR100564582B1 (ko) * 2003-10-28 2006-03-29 삼성전자주식회사 전자 소자 기판의 표면 처리 장치 및 이를 이용한 표면처리 방법
JP4357943B2 (ja) * 2003-12-02 2009-11-04 エス・イー・エス株式会社 基板処理法及び基板処理装置
US7181863B2 (en) * 2004-03-09 2007-02-27 Sez America, Inc. Wafer dryer and method for drying a wafer
JP4493649B2 (ja) * 2004-04-02 2010-06-30 東京エレクトロン株式会社 基板処理装置、基板処理方法、記録媒体およびソフトウエア
US7637029B2 (en) * 2005-07-08 2009-12-29 Tokyo Electron Limited Vapor drying method, apparatus and recording medium for use in the method
JP4758846B2 (ja) * 2005-11-18 2011-08-31 東京エレクトロン株式会社 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム
JP4812563B2 (ja) * 2006-08-29 2011-11-09 大日本スクリーン製造株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
JP4758846B2 (ja) 2011-08-31
KR101061926B1 (ko) 2011-09-02
US7581335B2 (en) 2009-09-01
JP2007165833A (ja) 2007-06-28
TW200731386A (en) 2007-08-16
US20070113423A1 (en) 2007-05-24
KR20070053112A (ko) 2007-05-23

Similar Documents

Publication Publication Date Title
TWI361455B (cg-RX-API-DMAC10.html)
US6328809B1 (en) Vapor drying system and method
JP3502947B2 (ja) 半導体の超微粒子洗浄装置
JP3592702B1 (ja) 基板処理方法及び基板処理装置
US20080230101A1 (en) Substrate treating apparatus
KR20200016805A (ko) 기판 처리 장치의 파티클 제거 방법 및 기판 처리 장치
KR20110102180A (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JPH1183316A (ja) 乾燥処理装置及び乾燥処理方法
JP3560962B1 (ja) 基板処理法及び基板処理装置
JP2004321971A (ja) 洗浄装置および基板処理装置
JP2007208247A (ja) 基板を洗浄するための装置およびシステム
JP4903992B2 (ja) 半導体基板の洗浄及び乾燥システム及びそれを利用した洗浄及び乾燥方法
TW202437339A (zh) 基板處理方法
US11927886B2 (en) Substrate treating method
JP5015847B2 (ja) 基板処理装置、基板処理方法、プログラムならびに記録媒体
JP2002050600A (ja) 基板処理方法及び基板処理装置
KR100564582B1 (ko) 전자 소자 기판의 표면 처리 장치 및 이를 이용한 표면처리 방법
JP4007980B2 (ja) 基板乾燥方法及び基板乾燥装置
JPH09162156A (ja) 処理方法及び処理装置
JP4541422B2 (ja) 基板処理装置および基板処理方法
KR101052821B1 (ko) 기판 처리 장치 및 그 방법
JP2005166848A (ja) 基板処理法及び基板処理装置
CN210349782U (zh) 干燥装置及基板处理装置
JP2000124179A (ja) 基板処理方法
JPH11283947A (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees