TWI361455B - - Google Patents

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Publication number
TWI361455B
TWI361455B TW095142662A TW95142662A TWI361455B TW I361455 B TWI361455 B TW I361455B TW 095142662 A TW095142662 A TW 095142662A TW 95142662 A TW95142662 A TW 95142662A TW I361455 B TWI361455 B TW I361455B
Authority
TW
Taiwan
Prior art keywords
drying
supply
carrier gas
mixed fluid
processed
Prior art date
Application number
TW095142662A
Other languages
English (en)
Chinese (zh)
Other versions
TW200731386A (en
Inventor
Hiroshi Tanaka
Hidetoshi Nakao
Naoki Shindo
Atushi Yamashita
Kotaro Tsurusaki
Tsukasa Hirayama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200731386A publication Critical patent/TW200731386A/zh
Application granted granted Critical
Publication of TWI361455B publication Critical patent/TWI361455B/zh

Links

Classifications

    • H10P72/0406—
    • H10P52/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H10P72/0408—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00—Coating apparatus
    • Y10S118/90—Semiconductor vapor doping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
TW095142662A 2005-11-18 2006-11-17 Drying device, drying method, substrate treating device, substrate treating method and computer readable recording medium having program TW200731386A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005334538 2005-11-18
JP2006216464A JP4758846B2 (ja) 2005-11-18 2006-08-09 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム

Publications (2)

Publication Number Publication Date
TW200731386A TW200731386A (en) 2007-08-16
TWI361455B true TWI361455B (OSRAM) 2012-04-01

Family

ID=38052054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142662A TW200731386A (en) 2005-11-18 2006-11-17 Drying device, drying method, substrate treating device, substrate treating method and computer readable recording medium having program

Country Status (4)

Country Link
US (1) US7581335B2 (OSRAM)
JP (1) JP4758846B2 (OSRAM)
KR (1) KR101061926B1 (OSRAM)
TW (1) TW200731386A (OSRAM)

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JP5122371B2 (ja) * 2008-05-26 2013-01-16 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラムならびに記憶媒体
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US10656525B2 (en) * 2017-09-01 2020-05-19 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Photoresist baking apparatus
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TWI792146B (zh) * 2021-01-07 2023-02-11 弘塑科技股份有限公司 晶圓浸泡清洗裝置
CN118009647B (zh) * 2024-04-09 2024-06-07 常州比太科技有限公司 一种硅片生产烘干装置及其烘干方法

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Also Published As

Publication number Publication date
JP2007165833A (ja) 2007-06-28
KR101061926B1 (ko) 2011-09-02
US7581335B2 (en) 2009-09-01
JP4758846B2 (ja) 2011-08-31
TW200731386A (en) 2007-08-16
US20070113423A1 (en) 2007-05-24
KR20070053112A (ko) 2007-05-23

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