TWI359631B - - Google Patents
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- Publication number
- TWI359631B TWI359631B TW97129750A TW97129750A TWI359631B TW I359631 B TWI359631 B TW I359631B TW 97129750 A TW97129750 A TW 97129750A TW 97129750 A TW97129750 A TW 97129750A TW I359631 B TWI359631 B TW I359631B
- Authority
- TW
- Taiwan
- Prior art keywords
- stencil
- hole
- conductive paste
- substrate
- double
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 8
- 239000012790 adhesive layer Substances 0.000 claims 3
- 210000000988 bone and bone Anatomy 0.000 claims 1
- 239000000126 substance Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 2
- 206010036790 Productive cough Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97129750A TW201008429A (en) | 2008-08-06 | 2008-08-06 | Double-sided flexible printed circuit and the processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97129750A TW201008429A (en) | 2008-08-06 | 2008-08-06 | Double-sided flexible printed circuit and the processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201008429A TW201008429A (en) | 2010-02-16 |
| TWI359631B true TWI359631B (enExample) | 2012-03-01 |
Family
ID=44827450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97129750A TW201008429A (en) | 2008-08-06 | 2008-08-06 | Double-sided flexible printed circuit and the processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201008429A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI514944B (zh) * | 2010-04-01 | 2015-12-21 | Inktec Co Ltd | 雙層印刷電路板及其製備方法 |
| TWI594671B (zh) * | 2014-12-17 | 2017-08-01 | Flexible circuit board micro-aperture conductive through-hole structure and manufacturing method |
-
2008
- 2008-08-06 TW TW97129750A patent/TW201008429A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201008429A (en) | 2010-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |