TW201008429A - Double-sided flexible printed circuit and the processing method thereof - Google Patents
Double-sided flexible printed circuit and the processing method thereof Download PDFInfo
- Publication number
- TW201008429A TW201008429A TW97129750A TW97129750A TW201008429A TW 201008429 A TW201008429 A TW 201008429A TW 97129750 A TW97129750 A TW 97129750A TW 97129750 A TW97129750 A TW 97129750A TW 201008429 A TW201008429 A TW 201008429A
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- substrate
- stencil
- double
- printed circuit
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title abstract description 3
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000007639 printing Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 45
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000001680 brushing effect Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 238000001459 lithography Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000006188 syrup Substances 0.000 description 3
- 235000020357 syrup Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 230000035922 thirst Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97129750A TW201008429A (en) | 2008-08-06 | 2008-08-06 | Double-sided flexible printed circuit and the processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97129750A TW201008429A (en) | 2008-08-06 | 2008-08-06 | Double-sided flexible printed circuit and the processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201008429A true TW201008429A (en) | 2010-02-16 |
| TWI359631B TWI359631B (enExample) | 2012-03-01 |
Family
ID=44827450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97129750A TW201008429A (en) | 2008-08-06 | 2008-08-06 | Double-sided flexible printed circuit and the processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201008429A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI514944B (zh) * | 2010-04-01 | 2015-12-21 | Inktec Co Ltd | 雙層印刷電路板及其製備方法 |
| TWI594671B (zh) * | 2014-12-17 | 2017-08-01 | Flexible circuit board micro-aperture conductive through-hole structure and manufacturing method |
-
2008
- 2008-08-06 TW TW97129750A patent/TW201008429A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI514944B (zh) * | 2010-04-01 | 2015-12-21 | Inktec Co Ltd | 雙層印刷電路板及其製備方法 |
| TWI594671B (zh) * | 2014-12-17 | 2017-08-01 | Flexible circuit board micro-aperture conductive through-hole structure and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI359631B (enExample) | 2012-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |