CN101657072B - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
- Publication number
- CN101657072B CN101657072B CN2008103040448A CN200810304044A CN101657072B CN 101657072 B CN101657072 B CN 101657072B CN 2008103040448 A CN2008103040448 A CN 2008103040448A CN 200810304044 A CN200810304044 A CN 200810304044A CN 101657072 B CN101657072 B CN 101657072B
- Authority
- CN
- China
- Prior art keywords
- layer
- metal
- conductive layer
- manufactured hole
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 163
- 239000002184 metal Substances 0.000 claims abstract description 163
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 63
- 238000007747 plating Methods 0.000 claims abstract description 19
- 239000000126 substance Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 254
- 239000000758 substrate Substances 0.000 claims description 55
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 150000002739 metals Chemical class 0.000 abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000011259 mixed solution Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- DBMPSFYQYJMEND-UHFFFAOYSA-L [Cu](Cl)Cl.S(=O)(=O)(O)O Chemical compound [Cu](Cl)Cl.S(=O)(=O)(O)O DBMPSFYQYJMEND-UHFFFAOYSA-L 0.000 description 1
- VCFCCSHKRUCZGF-UHFFFAOYSA-L [Na+].[Na+].OS(O)(=O)=O.[O-]S(=O)(=O)OOS([O-])(=O)=O Chemical compound [Na+].[Na+].OS(O)(=O)=O.[O-]S(=O)(=O)OOS([O-])(=O)=O VCFCCSHKRUCZGF-UHFFFAOYSA-L 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- GVDZRXUHIYPWEP-UHFFFAOYSA-L dipotassium;sulfonatooxy sulfate;sulfuric acid Chemical compound [K+].[K+].OS(O)(=O)=O.[O-]S(=O)(=O)OOS([O-])(=O)=O GVDZRXUHIYPWEP-UHFFFAOYSA-L 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- FWFGVMYFCODZRD-UHFFFAOYSA-N oxidanium;hydrogen sulfate Chemical compound O.OS(O)(=O)=O FWFGVMYFCODZRD-UHFFFAOYSA-N 0.000 description 1
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103040448A CN101657072B (zh) | 2008-08-19 | 2008-08-19 | 电路板制作方法 |
US12/426,276 US20100044237A1 (en) | 2008-08-19 | 2009-04-19 | Method for manufacturing printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103040448A CN101657072B (zh) | 2008-08-19 | 2008-08-19 | 电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101657072A CN101657072A (zh) | 2010-02-24 |
CN101657072B true CN101657072B (zh) | 2011-12-21 |
Family
ID=41695342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008103040448A Active CN101657072B (zh) | 2008-08-19 | 2008-08-19 | 电路板制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100044237A1 (zh) |
CN (1) | CN101657072B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104659017A (zh) * | 2013-11-20 | 2015-05-27 | 宏启胜精密电子(秦皇岛)有限公司 | 中介板及其制作方法 |
CN105789938B (zh) * | 2014-12-23 | 2020-08-04 | 南京中兴软件有限责任公司 | 机架内部供电方法、总线式供电板以及通信设备 |
CN107027264B (zh) * | 2015-06-24 | 2019-04-16 | 碁鼎科技秦皇岛有限公司 | 散热片及其制作方法及电子设备 |
CN107404804B (zh) * | 2016-05-20 | 2020-05-22 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
KR102421980B1 (ko) * | 2017-07-26 | 2022-07-18 | 삼성전기주식회사 | 인쇄회로기판 |
CN112770518A (zh) * | 2019-10-21 | 2021-05-07 | 深南电路股份有限公司 | 电路板及其制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5891606A (en) * | 1996-10-07 | 1999-04-06 | Motorola, Inc. | Method for forming a high-density circuit structure with interlayer electrical connections method for forming |
JP2002076617A (ja) * | 2000-08-28 | 2002-03-15 | Matsushita Electric Works Ltd | プリント配線板の製造方法及びプリント配線板 |
CN1794900A (zh) * | 2004-12-24 | 2006-06-28 | 日本Cmk株式会社 | 印刷电路板及其制造方法 |
CN101192542A (zh) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | 电路板结构及其制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6039889A (en) * | 1999-01-12 | 2000-03-21 | Fujitsu Limited | Process flows for formation of fine structure layer pairs on flexible films |
JP2002252446A (ja) * | 2001-02-23 | 2002-09-06 | Sony Chem Corp | フレキシブル配線基板の製造方法 |
KR100882664B1 (ko) * | 2001-03-14 | 2009-02-06 | 이비덴 가부시키가이샤 | 다층 프린트 배선판 |
-
2008
- 2008-08-19 CN CN2008103040448A patent/CN101657072B/zh active Active
-
2009
- 2009-04-19 US US12/426,276 patent/US20100044237A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5891606A (en) * | 1996-10-07 | 1999-04-06 | Motorola, Inc. | Method for forming a high-density circuit structure with interlayer electrical connections method for forming |
JP2002076617A (ja) * | 2000-08-28 | 2002-03-15 | Matsushita Electric Works Ltd | プリント配線板の製造方法及びプリント配線板 |
CN1794900A (zh) * | 2004-12-24 | 2006-06-28 | 日本Cmk株式会社 | 印刷电路板及其制造方法 |
CN101192542A (zh) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | 电路板结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101657072A (zh) | 2010-02-24 |
US20100044237A1 (en) | 2010-02-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101466207B (zh) | 电路板及其制作方法 | |
CN101453838A (zh) | 电路板的制作方法 | |
CN101657072B (zh) | 电路板制作方法 | |
JP6068123B2 (ja) | プリント配線基板の製造方法およびその方法により製造されたプリント配線基板 | |
EP1102524A1 (en) | Double-sided printed wiring board and method for manufacturing multilayer printed wiring board having three or more layers | |
JP2006108613A (ja) | プリント基板およびその製造方法 | |
KR101475340B1 (ko) | 다층 플렉시블 회로 기판 및 그 제조 방법 | |
CN102215640B (zh) | 电路板制作方法 | |
CN101442885B (zh) | 电路板导孔的制作方法 | |
US11690178B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
CN114928945B (zh) | 超细线路印刷线路板的制作工艺 | |
CN101460011A (zh) | 电路板制作方法及电路板 | |
CN114302561A (zh) | 具有超低铜残留半导通孔多层板的制作方法 | |
JP3754217B2 (ja) | プリント配線板の製造方法 | |
KR20230050343A (ko) | 프린트 배선판의 제조방법 | |
TWI626873B (zh) | 印刷配線板之製造方法 | |
JP2011166028A (ja) | Cof基板の製造方法 | |
JP6065357B2 (ja) | プリント配線板の製造方法 | |
JP2004186354A (ja) | 多層配線基板の製造方法 | |
TW200930201A (en) | Printed circuit board and method for manufacturing the same | |
CN114340223A (zh) | 基于高纵横比选择性半导通孔多层板的制作方法 | |
CN114206001A (zh) | 高耐压mems封装载板及其制作工艺 | |
JPH10335785A (ja) | 回路形成方法 | |
JPH10154730A (ja) | Tabテープにブラインドビアホールを形成する方法、その方法によって形成されたtabテープ、フィルム及びフレキシブル基板 | |
TW201010559A (en) | Method for manufacturing printed circuit boards |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161201 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Patentee after: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20220707 Address after: Area B, Room 403, block B, Rongchao Binhai building, No. 2021, haixiu Road, n26 District, Haiwang community, Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Liding semiconductor technology (Shenzhen) Co.,Ltd. Patentee after: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240220 Address after: SL11, No. 8 Langdong Road, Yanchuan Community, Yanluo Street, Bao'an District, Shenzhen City, Guangdong Province, 518105 Patentee after: Liding semiconductor technology (Shenzhen) Co.,Ltd. Country or region after: China Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Country or region after: Taiwan, China Address before: 518105 area B, Room 403, block B, Rongchao Binhai building, No. 2021, haixiu Road, n26 District, Haiwang community, Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Liding semiconductor technology (Shenzhen) Co.,Ltd. Country or region before: China Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. Country or region before: Taiwan, China |
|
TR01 | Transfer of patent right |