TWI356280B - - Google Patents

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Publication number
TWI356280B
TWI356280B TW096138698A TW96138698A TWI356280B TW I356280 B TWI356280 B TW I356280B TW 096138698 A TW096138698 A TW 096138698A TW 96138698 A TW96138698 A TW 96138698A TW I356280 B TWI356280 B TW I356280B
Authority
TW
Taiwan
Prior art keywords
carboxyl group
resin composition
white
patent application
aromatic ring
Prior art date
Application number
TW096138698A
Other languages
English (en)
Chinese (zh)
Other versions
TW200830047A (en
Inventor
Yoshikazu Daigo
Shigeru Ushiki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200830047A publication Critical patent/TW200830047A/zh
Application granted granted Critical
Publication of TWI356280B publication Critical patent/TWI356280B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW096138698A 2006-10-24 2007-10-16 Photocurable thermosetting resin composition and printed wiring board using the same TW200830047A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006288943 2006-10-24

Publications (2)

Publication Number Publication Date
TW200830047A TW200830047A (en) 2008-07-16
TWI356280B true TWI356280B (fr) 2012-01-11

Family

ID=39390256

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096138698A TW200830047A (en) 2006-10-24 2007-10-16 Photocurable thermosetting resin composition and printed wiring board using the same

Country Status (3)

Country Link
KR (1) KR100904348B1 (fr)
CN (2) CN103558735A (fr)
TW (1) TW200830047A (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4711354B2 (ja) * 2007-07-17 2011-06-29 ソニーケミカル＆インフォメーションデバイス株式会社 画像表示装置の製造方法
US8042976B2 (en) * 2007-11-30 2011-10-25 Taiyo Holdings Co., Ltd. White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
TWI408150B (zh) * 2008-10-17 2013-09-11 Taiyo Ink Mfg Co Ltd A solder resist composition and a printed circuit board using the same
CN102483571B (zh) * 2009-09-10 2013-10-23 积水化学工业株式会社 感光性组合物及印刷布线板
JP4855507B2 (ja) * 2009-09-18 2012-01-18 株式会社タムラ製作所 反射板機能を有するプリント配線板の製造方法
JP4975834B2 (ja) * 2010-02-17 2012-07-11 太陽ホールディングス株式会社 ソルダーレジスト組成物およびプリント配線板
JP2011170050A (ja) * 2010-02-17 2011-09-01 Taiyo Holdings Co Ltd ソルダーレジスト組成物およびプリント配線板
JP2011216687A (ja) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd 白色塗膜層及びその形成方法、並びにプリント配線板
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
TWI519581B (zh) * 2010-12-28 2016-02-01 Tamura Seisakusho Kk White hardening resin composition
WO2012111356A1 (fr) * 2011-02-14 2012-08-23 積水化学工業株式会社 Premier et second liquide de type mélange de deux liquides, et procédé de fabrication de carte de circuit imprimé
JP5244991B1 (ja) * 2012-03-30 2013-07-24 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物、硬化物、プリント配線板、及び光源モジュール
JP6082733B2 (ja) * 2012-05-17 2017-02-15 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
CN103576452B (zh) * 2012-07-25 2017-02-22 上海孚赛特新材料股份有限公司 一种光固化以及热固化树脂组合物
CN104570606B (zh) * 2014-12-24 2019-05-31 欧利生东邦涂料（东莞）有限公司 光固化热固化性组合物及其制备方法以及印刷线路板用油墨
CN108594597A (zh) * 2018-05-09 2018-09-28 欧利生东邦涂料（东莞）有限公司 一种光固化热固化性组合物
CN109868005A (zh) * 2019-02-25 2019-06-11 江苏艾森半导体材料股份有限公司 具有高附着力的光热双固化阻焊油墨及其使用方法
CN116783550A (zh) * 2020-12-16 2023-09-19 韩国太阳油墨有限公司 阻焊剂组合物、干膜、印刷线路板及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3637277B2 (ja) * 2000-03-21 2005-04-13 大塚化学ホールディングス株式会社 難燃剤、及び難燃性樹脂組成物、及び成形物、及び電子部品
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board

Also Published As

Publication number Publication date
CN103558735A (zh) 2014-02-05
KR100904348B1 (ko) 2009-06-23
CN101169590A (zh) 2008-04-30
TW200830047A (en) 2008-07-16
KR20080036920A (ko) 2008-04-29

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