TWI354348B - Substrate moving apparatus - Google Patents

Substrate moving apparatus Download PDF

Info

Publication number
TWI354348B
TWI354348B TW096129807A TW96129807A TWI354348B TW I354348 B TWI354348 B TW I354348B TW 096129807 A TW096129807 A TW 096129807A TW 96129807 A TW96129807 A TW 96129807A TW I354348 B TWI354348 B TW I354348B
Authority
TW
Taiwan
Prior art keywords
stage
substrate
rotation
moving
plane mirror
Prior art date
Application number
TW096129807A
Other languages
English (en)
Chinese (zh)
Other versions
TW200818386A (en
Inventor
Taniguchi Shinya
Wada Yasuyuki
Hayashi Hideki
Koyagi Yasuyuki
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200818386A publication Critical patent/TW200818386A/zh
Application granted granted Critical
Publication of TWI354348B publication Critical patent/TWI354348B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW096129807A 2006-10-04 2007-08-13 Substrate moving apparatus TWI354348B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006273234A JP5032821B2 (ja) 2006-10-04 2006-10-04 基板移動装置

Publications (2)

Publication Number Publication Date
TW200818386A TW200818386A (en) 2008-04-16
TWI354348B true TWI354348B (en) 2011-12-11

Family

ID=39375601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096129807A TWI354348B (en) 2006-10-04 2007-08-13 Substrate moving apparatus

Country Status (3)

Country Link
JP (1) JP5032821B2 (ko)
KR (1) KR100907779B1 (ko)
TW (1) TWI354348B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5349163B2 (ja) * 2009-06-25 2013-11-20 株式会社日立ハイテクノロジーズ 露光装置、露光方法、及び表示用パネル基板の製造方法
JP2013026383A (ja) * 2011-07-20 2013-02-04 Dainippon Screen Mfg Co Ltd 位置合わせ装置、位置合わせ方法、および、描画装置
TWI447348B (zh) * 2012-02-10 2014-08-01 Nat Synchrotron Radiation Res Ct 平台定位系統及其方法
CN103227134B (zh) * 2013-03-18 2016-02-17 无锡先导智能装备股份有限公司 一种电池组件的搬运筛选装置及搬运筛选方法
CN106931878A (zh) * 2015-12-31 2017-07-07 上海微电子装备有限公司 一种干涉仪测量装置及其控制方法
JP7374790B2 (ja) * 2020-01-30 2023-11-07 株式会社Screenホールディングス 搬送装置および搬送方法
WO2022190706A1 (ja) * 2021-03-09 2022-09-15 株式会社Screenホールディングス 露光方法および露光装置
CN113793826B (zh) * 2021-11-16 2022-03-08 西安奕斯伟材料科技有限公司 硅片方位调准装置及硅片缺陷检测设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62200726A (ja) * 1986-02-28 1987-09-04 Canon Inc 露光装置
JPH01202833A (ja) * 1988-02-09 1989-08-15 Toshiba Corp 高精度xyステージ装置
JP3295846B2 (ja) * 1989-06-08 2002-06-24 株式会社ニコン 位置測定方法、位置測定装置、位置決め方法、位置決め装置、および露光装置
JPH1074687A (ja) * 1996-08-29 1998-03-17 Nikon Corp ステージ装置
JP3790902B2 (ja) * 1997-06-03 2006-06-28 株式会社ニコン ステージ構造体
JPH1197512A (ja) * 1997-07-25 1999-04-09 Nikon Corp 位置決め装置及び位置決め方法並びに位置決め処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP2005191150A (ja) * 2003-12-24 2005-07-14 Nikon Corp ステージ装置及び露光装置並びにデバイスの製造方法

Also Published As

Publication number Publication date
TW200818386A (en) 2008-04-16
JP2008091785A (ja) 2008-04-17
KR20080031612A (ko) 2008-04-10
KR100907779B1 (ko) 2009-07-15
JP5032821B2 (ja) 2012-09-26

Similar Documents

Publication Publication Date Title
TWI354348B (en) Substrate moving apparatus
TWI271602B (en) A correcting method and an exposure method of exposure device, and an exposure device
TW561523B (en) Exposure device, exposure method, and manufacturing method of devices
KR100572615B1 (ko) 패턴 묘화장치 및 패턴 묘화방법
US9001306B2 (en) Exposure apparatus, exposure method, and method of manufacturing device
TW594431B (en) Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
US4704020A (en) Projection optical apparatus
US20020113218A1 (en) Method and apparatus for positioning substrate and the like
JP2002280287A (ja) 位置検出方法、位置検出装置、露光方法、露光装置、及びデバイス製造方法
KR960018773A (ko) 노광 방법 및 그 장치
TWI734111B (zh) 標記位置檢測裝置、描繪裝置以及標記位置檢測方法
US6927854B2 (en) Projection exposure device and position alignment device and position alignment method
TW201608345A (zh) 描繪裝置
JP2022000707A (ja) 感光性の層を露光するための装置および方法
TW200305788A (en) Exposure device and exposure method
US5936712A (en) Exposure method and apparatus including focus control
JP2006268032A (ja) 描画装置および描画装置の校正方法
TWI794438B (zh) 晶片位置測定裝置
JP2000349014A (ja) 重ね合わせ測定装置及び該装置を用いた半導体デバイス製造方法
JP2004363313A (ja) 位置ずれ計測方法および装置、並びに位置ずれ計測用レチクル
JPH09246356A (ja) 表面位置設定方法
JPH07201713A (ja) 露光装置及び露光方法
TWI856625B (zh) 描繪位置資訊取得方法以及描繪方法
USRE37359E1 (en) Projection exposure method and apparatus capable of performing focus detection with high accuracy
JPH01194322A (ja) 半導体焼付装置