WO2022190706A1 - 露光方法および露光装置 - Google Patents
露光方法および露光装置 Download PDFInfo
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- WO2022190706A1 WO2022190706A1 PCT/JP2022/003515 JP2022003515W WO2022190706A1 WO 2022190706 A1 WO2022190706 A1 WO 2022190706A1 JP 2022003515 W JP2022003515 W JP 2022003515W WO 2022190706 A1 WO2022190706 A1 WO 2022190706A1
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- main scanning
- scanning direction
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- 238000003384 imaging method Methods 0.000 claims description 80
- 238000012360 testing method Methods 0.000 claims description 55
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Definitions
- the present invention relates to a technique for exposing a substrate, such as a semiconductor wafer or a glass substrate, to form a pattern on the substrate.
- Patent Documents 1 and 2 a stage on which a substrate (photosensitive material, substrate to be exposed) is placed is moved in the main scanning direction, and a pattern extending in the main scanning direction is formed by irradiating the photosensitive material with light from an exposure head. is described on a substrate.
- a positional deviation occurs between the stage and the exposure head, making it impossible to irradiate light onto an appropriate position on the photosensitive material. Therefore, in Patent Documents 1 and 2, this problem is addressed by adjusting the pattern of light emitted from the exposure head.
- Patent Document 2 focuses on the yawing of the stage.
- the method of controlling the position of the stage based on the results of measuring the yawing of the stage with a laser displacement gauge to eliminate the effects of yawing has been pointed out as a problem that it is necessary to equip the apparatus with an expensive laser displacement gauge.
- Japanese Patent Laid-Open No. 2002-200000 a software method is adopted in which the light pattern is adjusted by correcting the data given to the exposure head, instead of the hardware method of controlling the position of the stage.
- a driving mechanism drives an object to be driven, such as a stage or an exposure head, in the main scanning direction, and irradiates light from the exposure head onto an appropriate position of a substrate placed on the stage.
- the purpose is to provide technology that enables
- one of the stage on which the substrate is placed and the exposure head that irradiates the irradiation range with light is driven by the drive mechanism in the main scanning direction.
- An exposure apparatus includes a stage on which a substrate is placed, an exposure head that irradiates an irradiation range with light, a driving mechanism that drives one of the stage and the exposure head to be driven in a main scanning direction, By driving the driving target in the main scanning direction by the driving mechanism, the driving target moves in the first movement range in the main scanning direction, and the substrate relatively passes through the irradiation range in the main scanning direction.
- the control unit driving in the first movement range
- At least one of the position of the object to be driven in the sub-scanning direction and the amount of rotation of the object to be driven in the yaw direction is corrected by the driving mechanism according to the position of the object in the main scanning direction during execution of the first main scanning drive. Take corrective action.
- one of the stage and the exposure head to be driven is driven in the main scanning direction by the drive mechanism, so that the driven object moves to the first position in the main scanning direction.
- the substrate While moving within the movement range, the substrate relatively passes through the irradiation range in the main scanning direction (first main scanning drive).
- the exposure head In parallel with the first main scanning drive, the exposure head irradiates the irradiation range with light, thereby exposing a region extending in the main scanning direction on the substrate (exposure operation).
- one of the stage on which the substrate is placed and the exposure head that irradiates the irradiation range with light is driven by a drive mechanism in the main scanning direction.
- a step of performing first main scanning driving in which the object moves in a first movement range in the main scanning direction and the substrate relatively passes through the irradiation range in the main scanning direction; and main scanning of the driven object in the first movement range.
- the sub-scanning of the driven object is performed during the execution of the first main scanning drive.
- An exposure apparatus includes a stage on which a substrate is placed, an exposure head that irradiates an irradiation range with light, and a driving target of one of the stage and the exposure head that is driven in a main scanning direction. and a first straightness correction amount indicating a first straightness correction amount for correcting the position of the driven object in the sub-scanning direction according to the position of the driven object in the main scanning direction within the first moving range in the main scanning direction.
- a control unit that performs an exposure operation for exposing a region extending in the main scanning direction on the substrate by irradiating light from the exposure head to an irradiation range while performing the first main scanning drive; 1 Based on the straightness correction information, a first straightness correction operation is performed to correct the position of the driven object in the sub-scanning direction by the driving mechanism during the first main scanning drive.
- one of the stage and the exposure head to be driven is driven in the main scanning direction by the drive mechanism, so that the driven object moves to the first position in the main scanning direction.
- the substrate While moving within the movement range, the substrate relatively passes through the irradiation range in the main scanning direction (first main scanning drive). Then, in parallel with the first main scanning drive, a region extending in the main scanning direction on the substrate is exposed by irradiating the irradiation range with light from the exposure head (exposure operation).
- the first The drive mechanism corrects the position of the driven object in the sub-scanning direction during execution of the main scanning drive (first straightness correction operation).
- first straightness correction operation it is possible to irradiate light from the exposure head to an appropriate position of the substrate placed on the stage while ensuring the straightness when the driving mechanism drives the driving target such as the stage or the exposure head in the main scanning direction. It is possible.
- the exposure method may be configured such that in the first straightness correction operation, the position of the driven object in the sub-scanning direction is corrected based on the first straightness correction information created in the correction information creation operation.
- the first straightness correction information is created based on the result of determining the position in the sub-scanning direction of the driven object moving in the main scanning direction within the first moving range by the drive mechanism, that is, based on the result of determining the straightness in advance. (correction information creation operation). Then, when performing the exposure operation while performing the first main scanning drive, the straightness of the object to be driven can be ensured based on the first straightness correction information created in this way.
- correction information creation operation exposure is performed so as to create first straightness correction information based on the result of measuring the position in the sub-scanning direction of the driven object moving in the main scanning direction within the first moving range by a laser interferometer.
- a method may be configured. With such a configuration, the straightness of the driven object can be easily obtained by measurement with a laser interferometer.
- the stage moves in the second movement range in the main scanning direction, and the test substrate passing through the imaging range of the camera in the main scanning direction; and second straightness correction information indicating a second straightness correction amount for correcting the position of the stage in the sub-scanning direction in accordance with the position of the stage in the main scanning direction in the second movement range.
- the test substrate is exposed by irradiating the test substrate passing through the irradiation range with light from the exposure head while executing the first main scanning drive.
- First straightness correction information based on the result of obtaining the position in the sub-scanning direction of the stage moving in the first movement range based on the step of acquiring the mark image and the position in the sub-scanning direction of the exposure mark indicated by the exposure mark image.
- the exposure method may be configured such that the step of creating is executed in the correction information creating operation. With such a configuration, the straightness of the driven object can be obtained without using an expensive laser interferometer.
- the exposure method may be configured as provided in an integrated circuit. In such a configuration, the position detection section and the imaging timing control section are provided in the same integrated circuit. The position can be transmitted to the imaging timing control section. Therefore, it is possible to perform imaging by the camera at an appropriate timing according to the position of the driven object.
- the method further comprises the step of detecting the position of the driven object in the main scanning direction by the position detection unit and transmitting the detected position to the correction timing control unit for controlling the execution timing of the first straightness correction operation by the drive mechanism.
- the driving mechanism is caused to perform the first straightness correction operation at a timing corresponding to the position of the driven object in the main scanning direction received from the position detection section, and the position detection section and the correction timing control section are implemented by the same integrated circuit.
- the method of exposure may be configured as provided in. In such a configuration, the position detection section and the correction timing control section are provided in the same integrated circuit.
- the position can be sent to the Correction Timing Control. Therefore, the position of the driven object in the sub-scanning direction can be corrected at an appropriate timing according to the position of the driven object.
- a plurality of exposure positions that are different in the sub-scanning direction are set for the substrate, and the position of the drive target is driven between a plurality of sub-scanning positions that are different in the sub-scanning direction and correspond to the plurality of exposure positions.
- the first straightness correction information is provided for each of a plurality of sub-scanning positions, and in the first straightness correction operation, the sub-scanning position of the driven object is based on the first straightness correction information provided for the sub-scanning position where the driven object is positioned.
- the exposure method may be configured to correct the position in the scanning direction. With such a configuration, it is possible to ensure the straightness of the driven object at each of the plurality of sub-scanning positions.
- the first straightness correction information is provided for each of a plurality of set positions different in the sub-scanning direction, the plurality of set positions is less than the plurality of sub-scanning positions, and the first straightness correction operation includes a plurality of set positions Based on the first straightness correction information provided for the set position closest to the sub-scanning position where the driven object is located, or based on the first straightness correction information provided for the set position closest to the sub-scanning position where the driven object is located. Exposure is performed so as to correct the position of the object to be driven in the sub-scanning direction by linear interpolation using the correction information and the first straightness correction information provided for the set position second closest to the sub-scanning position where the object to be driven is positioned.
- a method may be configured. With such a configuration, it is possible to secure the straightness of the driven object at each of the plurality of sub-scanning positions while suppressing memory resources required for storing the first straightness correction information.
- one of the stage on which the substrate is placed and the exposure head that irradiates the irradiation range with light is driven by the drive mechanism in the main scanning direction.
- performing first main scanning driving in which the object moves in a first movement range in the main scanning direction and the substrate relatively passes through the irradiation range in the main scanning direction; and main scanning of the driven object in the first movement range.
- the first yawing correction information indicating the first yawing correction amount for correcting the amount of rotation of the driven object in the yaw direction according to the position in the direction
- the yaw direction of the driven object is changed during execution of the first main scanning drive.
- An exposure apparatus includes a stage on which a substrate is placed, an exposure head that irradiates an irradiation range with light, and a driving target of one of the stage and the exposure head that is driven in the main scanning direction.
- a control unit that performs an exposure operation for exposing a region extending in the main scanning direction on the substrate by irradiating light from the exposure head to an irradiation range while executing one main scanning drive; Based on the yawing correction information, a first yawing correction operation is performed in which the drive mechanism corrects the amount of rotation of the driven object in the yaw direction during execution of the first main scanning drive.
- one of the stage and the exposure head to be driven is driven in the main scanning direction by the drive mechanism, so that the driven object moves to the first position in the main scanning direction.
- the substrate While moving within the movement range, the substrate relatively passes through the irradiation range in the main scanning direction (first main scanning drive). Then, in parallel with the first main scanning drive, a region extending in the main scanning direction on the substrate is exposed by irradiating the irradiation range with light from the exposure head (exposure operation).
- the first The drive mechanism corrects the amount of rotation of the driven object in the yaw direction during execution of the main scanning drive (first yawing correction operation).
- first yawing correction operation it is possible to suppress the yawing of the driven object such as the stage or the exposure head when the driven object such as the stage or the exposure head is driven in the main scanning direction by the drive mechanism, thereby exposing the substrate placed on the stage to the appropriate position. Light can be emitted from the head.
- the step of executing a first correction information creating operation of creating first yawing correction information based on the result of obtaining the amount of rotation in the yaw direction of the driven object moving in the first movement range in the main scanning direction by the driving mechanism is further performed.
- the exposure method may be configured such that in the first yawing correction operation, the amount of rotation of the driven object in the yaw direction is corrected based on the first yawing correction information created in the first correction information creation operation. .
- the first yawing correction information is created based on the result of determining the position in the yaw direction of the driven object moving in the main scanning direction within the first movement range by the drive mechanism, that is, based on the result of determining the yawing in advance (first correction information creation operation). Then, when performing the exposure operation while performing the first main scanning drive, the yawing of the driven object can be suppressed based on the first yawing correction information created in this way.
- the amount of rotation in the yaw direction of the driven object moving in the first movement range is measured by a yaw measurement device, and the position of the driven object in the main scanning direction and the amount of rotation in the yaw direction are associated.
- the step of creating the first yawing correction information based on the result of the first yawing measurement in the first correction information creation operation. You may With such a configuration, the yaw of the driven object can be easily obtained by measuring the laser interferometer of the yaw measuring device.
- the yaw measuring instrument is used by being attached to the exposure apparatus when measuring yaw. Therefore, when the yawing measurement is completed, the yaw measuring device can be removed from the exposure apparatus. Therefore, it is not necessary to equip the exposure apparatus itself with a yaw measuring device, and it is possible to suppress an increase in the cost of the exposure apparatus.
- the driving target moves in the second movement range in the main scanning direction, and the substrate relatively passes through the imaging range of the camera in the main scanning direction.
- the exposure method may be configured such that, in the exposure operation, the pattern of light emitted from the exposure head to the substrate is adjusted according to the position of the alignment mark obtained in the alignment mark obtaining operation.
- the driven object by driving the driven object in the main scanning direction by the drive mechanism, the driven object moves within the second movement range in the main scanning direction, and the substrate relatively passes through the imaging range of the camera in the main scanning direction. (second main scanning drive). Then, in parallel with the second main scanning drive, the alignment mark image is captured by the camera capturing an image of the alignment mark passing through the imaging range, and the position of the alignment mark indicated by this alignment mark image is obtained (alignment mark image). mark acquisition behavior).
- the second The drive mechanism corrects the amount of rotation of the driven object in the yaw direction during execution of the main scanning drive (second yawing correction operation).
- second yawing correction operation it is possible to accurately acquire the position of the alignment mark on the substrate by suppressing the yawing of the driven object such as the stage or the exposure head when the driven object such as the stage or the exposure head is driven in the main scanning direction by the drive mechanism. It becomes possible.
- the exposure method may be configured such that in the second yawing correction operation, the amount of rotation of the driven object in the yaw direction is corrected based on the second yawing correction information created in the second correction information creating operation.
- the second yaw correction information is created based on the result of determining the position in the yaw direction of the driven object moving in the main scanning direction within the second movement range by the drive mechanism, that is, based on the result of determining the yawing in advance (second correction information creation operation). Then, when performing the alignment mark acquisition operation while performing the second main scanning drive, yawing of the driven object can be suppressed based on the second yawing correction information created in this way.
- a step of attaching a yaw measurement device that measures the amount of rotation of the stage in the yaw direction using a laser interferometer to the exposure apparatus comprising the stage, exposure head, and drive mechanism The amount of rotation in the yaw direction of the driven object moving in the second movement range is measured by a yaw measurement device, and the position of the driven object in the main scanning direction and the amount of rotation in the yaw direction are associated. and the step of creating the second yawing correction information based on the result of the second yawing measurement in the second correction information creation operation. You may With such a configuration, the yaw of the driven object can be easily obtained by measuring the laser interferometer of the yaw measuring device.
- the yaw measuring instrument is used by being attached to the exposure apparatus when measuring yaw. Therefore, when the yawing measurement is completed, the yaw measuring device can be removed from the exposure apparatus. Therefore, it is not necessary to equip the exposure apparatus itself with a yaw measuring device, and it is possible to suppress an increase in the cost of the exposure apparatus.
- the position detection unit detects the position of the driven object in the main scanning direction, transmits the position to the imaging timing control unit that controls the execution timing of imaging by the camera, and the imaging timing control unit detects the position
- the alignment mark is captured by causing the camera to capture an image at a timing corresponding to the position of the driven object in the main scanning direction received from the detection unit, and the position detection unit and the imaging timing control unit are built in the same integrated circuit.
- the exposure method may be configured as provided in . In such a configuration, the position detection section and the imaging timing control section are provided in the same integrated circuit. The position can be transmitted to the imaging timing control section. Therefore, it is possible to perform imaging by the camera at an appropriate timing according to the position of the driven object.
- the method may further include the step of detecting the position of the object to be driven in the main scanning direction by the position detection unit and transmitting the position to the correction timing control unit for controlling the execution timing of the first yawing correction operation by the drive mechanism.
- the exposure method may be configured as provided in . In such a configuration, the position detection section and the correction timing control section are provided in the same integrated circuit. The position can be sent to the Correction Timing Control. Therefore, the amount of rotation of the driven object in the yaw direction can be corrected at an appropriate timing according to the position of the driven object.
- a plurality of exposure positions that are different in the sub-scanning direction are set for the substrate, and the position of the drive target is driven between a plurality of sub-scanning positions that are different in the sub-scanning direction and correspond to the plurality of exposure positions.
- the first yawing correction information is provided for each of the plurality of sub-scanning positions, and in the first yawing correction operation, the sub-scanning position of the driven object is based on the first yawing correction information provided for the sub-scanning position where the driven object is positioned.
- the exposure method may be configured to correct the position in the scanning direction. With such a configuration, it is possible to suppress yawing of the driven object at each of the plurality of sub-scanning positions.
- the first yawing correction information is provided for each of a plurality of set positions that are different in the sub-scanning direction, the plurality of set positions is less than the plurality of sub-scanning positions, and the first yawing correction operation includes a plurality of set positions Of these, the first yawing correction is provided based on the first yawing correction information provided for the set position closest to the sub-scanning position where the driven target is located, or the first yawing correction provided for the set position closest to the sub-scanning position where the driven target is located.
- the exposure method corrects the position of the object to be driven in the sub-scanning direction by linear interpolation using the first yawing correction information provided for the set position second closest to the sub-scanning position where the object to be driven is positioned.
- the substrate placed on the stage is properly positioned by ensuring the straightness when the driving mechanism drives the driving target such as the stage or the exposure head in the main scanning direction. It is possible to irradiate the light from the exposure head to the desired position.
- the yawing of the driven object such as the stage or the exposure head when the driven object such as the stage or the exposure head is driven in the main scanning direction by the drive mechanism is suppressed while suppressing the cost increase. It is possible to irradiate light from the exposure head to an appropriate position of the substrate placed on the substrate.
- FIG. 1 is a front view schematically showing a schematic configuration of an exposure apparatus according to the present invention
- FIG. FIG. 2 is a block diagram showing an example of an electrical configuration included in the exposure apparatus of FIG. 1
- FIG. 2 is a perspective view schematically showing an example of a position measuring instrument that measures the position of a stage using a laser interferometer
- FIG. 4 is a block diagram showing an example of a detailed configuration of a control unit that executes alignment mark acquisition operation and exposure operation; The figure which shows an example of a straightness correction table.
- FIG. 4 is a diagram showing an example of a yawing correction table
- 4 is a flow chart showing an example of an alignment mark acquisition operation and an exposure operation;
- FIG. 7 is a side view schematically showing the operation of the exposure apparatus executed according to the flowchart of FIG. 6;
- FIG. 7 is a diagram schematically showing an example of a substrate on which the flowchart of FIG. 6 is executed;
- 4 is a flowchart showing an example of a method for creating a yawing correction table;
- 4 is a flow chart showing an example of a method for creating a straightness correction table;
- FIG. 11 is a diagram schematically showing operations performed in creating a straightness correction table in FIG. 10;
- FIG. 11 is a diagram schematically showing operations performed in creating a straightness correction table in FIG. 10;
- FIG. 11 is a diagram schematically showing operations performed in creating a straightness correction table in FIG. 10;
- FIG. 5 is a block diagram showing a configuration for executing another example of a straightness correction table creation method;
- FIG. 11 is a perspective view showing a configuration for executing another example of the method of creating a straightness correction table;
- FIG. 1 is a front view schematically showing the schematic configuration of the exposure apparatus according to the present invention
- FIG. 2 is a block diagram showing an example of the electrical configuration of the exposure apparatus of FIG.
- the horizontal direction is the X direction
- the horizontal direction is the Y direction orthogonal to the X direction
- the vertical direction is the Z direction
- the rotational direction ⁇ (yaw direction) as appropriate.
- the exposure apparatus 1 draws a pattern on the photosensitive material by irradiating the substrate We (substrate to be exposed) on which a layer of photosensitive material such as resist is formed with laser light of a predetermined pattern.
- the substrate We various substrates such as a semiconductor substrate, a printed circuit board, a color filter substrate, a flat panel display glass substrate provided in a liquid crystal display device or a plasma display device, and an optical disk substrate can be applied.
- the exposure apparatus 1 includes a main body 11 , and the main body 11 is composed of a main body frame 111 and a cover panel (not shown) attached to the main body frame 111 . Various components of the exposure apparatus 1 are arranged inside and outside the main body 11 .
- the interior of the main body 11 of the exposure apparatus 1 is divided into a processing area 112 and a transfer area 113 .
- a stage 2 , a stage driving mechanism 3 , an exposure unit 4 and an alignment unit 5 are mainly arranged in the processing area 112 .
- An illumination unit 6 for supplying illumination light to the alignment unit 5 is arranged outside the main body 11 .
- a transport device 7 such as a transport robot for carrying the substrate We into and out of the processing area 112 is arranged.
- a controller 8 is arranged inside the main body 11, and the controller 8 is electrically connected to each part of the exposure apparatus 1 and controls the operation of each part.
- a cassette mounting section 114 for mounting the cassette C is arranged outside the main body 11 of the exposure apparatus 1, at a position adjacent to the transfer area 113.
- the transfer device 7 arranged in the delivery area 113 inside the main body 11 transports the unprocessed substrates We housed in the cassette C mounted on the cassette mounting portion 114.
- the substrates We are taken out and loaded into the processing area 112 , and the processed substrates We are unloaded from the processing area 112 and stored in the cassette C.
- FIG. Delivery of the cassette C to the cassette mounting portion 114 is performed by an external transport device (not shown).
- the loading of the unprocessed substrates We and the unloading of the processed substrates We are executed by the transfer device 7 according to instructions from the control unit 8 .
- the stage 2 has a flat plate-like outer shape and horizontally holds the substrate We placed on its upper surface.
- a plurality of suction holes are formed in the upper surface of the stage 2, and the substrate We placed on the stage 2 is moved to the stage 2 by applying a negative pressure (suction pressure) to the suction holes. affixed to the top of the This stage 2 is driven by a stage driving mechanism 3 .
- the stage drive mechanism 3 is an XYZ- ⁇ drive mechanism that moves the stage 2 in the Y direction (main scanning direction), X direction (sub-scanning direction), Z direction, and rotational direction ⁇ (yaw direction).
- the stage drive mechanism 3 includes a Y-axis robot 31 which is a single-axis robot extending in the Y direction, a table 32 driven in the Y direction by the Y-axis robot 31, and an upper surface of the table 32 extending in the X direction.
- the X-axis robot 33 which is a single-axis robot, the table 34 driven in the X direction by the X-axis robot 33, and the stage 2 supported on the upper surface of the table 34 are driven in the rotation direction ⁇ with respect to the table 34. and an axis robot 35 .
- the stage drive mechanism 3 drives the stage 2 in the Y direction with the Y-axis servomotor 311 of the Y-axis robot 31, and drives the stage 2 in the X direction with the X-axis servomotor 331 of the X-axis robot 33.
- the stage 2 can be driven in the rotation direction ⁇ by the ⁇ -axis servomotor 351 of the ⁇ -axis robot 35 .
- the stage drive mechanism 3 can drive the stage 2 in the Z direction by a Z-axis robot (not shown in FIG. 1).
- the stage driving mechanism 3 operates the Y-axis robot 31, the X-axis robot 33, the ⁇ -axis robot 35, and the Z-axis robot according to commands from the control unit 8, thereby moving the substrate We placed on the stage 2. to move.
- the exposure unit 4 has an exposure head 41 arranged above the substrate We on the stage 2 and a light irradiation section 43 for irradiating the exposure head 41 with laser light.
- the light irradiation section 43 has a laser driving section 431 , a laser oscillator 432 and an illumination optical system 433 .
- a laser beam emitted from the laser oscillator 432 by the operation of the laser drive unit 431 is irradiated onto the exposure head 41 via the illumination optical system 433 .
- the exposure head 41 modulates the laser light irradiated from the light irradiation unit 43 by the spatial light modulator, and irradiates the substrate We moving directly under it.
- a pattern is drawn on the substrate We by exposing the substrate We to the laser light in this manner (exposure operation).
- the alignment unit 5 has an alignment camera 51 arranged above the substrate We on the stage 2 .
- the alignment camera 51 has a lens barrel, an objective lens, and a CCD image sensor, and picks up images of alignment marks provided on the upper surface of the substrate We moving directly below it.
- a CCD image sensor provided in the alignment camera 51 is configured by, for example, an area image sensor (two-dimensional image sensor).
- the illumination unit 6 is connected to the lens barrel of the alignment camera 51 via a fiber 61 and supplies illumination light to the alignment camera 51 .
- the illumination light guided by the fiber 61 extending from the illumination unit 6 is guided to the upper surface of the substrate We via the lens barrel of the alignment camera 51, and the reflected light from the substrate We enters the CCD image sensor via the objective lens. .
- the upper surface of the substrate We is imaged to obtain a captured image.
- the alignment camera 51 is electrically connected to the control section 8 , acquires a captured image according to an instruction from the control section 8 , and transmits the captured image to the control section 8 .
- the control unit 8 acquires the position of the alignment mark indicated by the captured image captured by the alignment camera 51 (alignment mark acquisition operation). Further, the control unit 8 controls the exposure unit 4 based on the position of the alignment mark, thereby adjusting the pattern of the laser light emitted from the exposure head 41 to the substrate We in the exposure operation. Then, the control unit 8 draws the pattern on the substrate We by irradiating the substrate We with laser light modulated according to the pattern to be drawn from the exposure head 41 .
- a main PC (Personal Computer) 91 is provided for the exposure apparatus 1, and the main PC 91 executes image processing for alignment marks. That is, the control unit 8 acquires from the main PC 91 the position of the alignment mark calculated by the main PC 91 from the captured image of the alignment mark. Furthermore, a position measuring device 92 for measuring the position of the stage 2 by a laser interferometer can be detachably attached to the main body 11 of the exposure apparatus 1 .
- FIG. 3 is a perspective view schematically showing an example of a position measuring instrument that measures the position of the stage using a laser interferometer.
- the stage 2 moves in a movable range Yt in the Y direction, and the movable range Yt includes an alignment movement range Ya and an exposure movement range Ye.
- the alignment movement range Ya is the range in which the stage 2 moves in the Y direction for the alignment mark acquisition operation
- the exposure movement range Ye is the range in which the stage 2 moves in the Y direction for the exposure operation.
- the alignment movement range Ya and the exposure movement range Ye partially overlap. However, they do not necessarily have to overlap.
- the position measuring instrument 92 can measure the position of the stage 2 moving in the Y direction within the movable range Yt.
- This position measuring instrument 92 has two laser interferometers 921 and 922 and two mirrors 923 and 924 attached to the side surface of the stage 2 in the Y direction.
- Laser interferometers 921 and 922 emit laser light parallel to the Y direction
- mirrors 923 and 924 are mirror surfaces perpendicular to the Y direction. are opposed to each other in the Y direction.
- the laser interferometer 921 emits a laser beam toward the mirror 923 and measures the position of the stage 2 in the Y direction based on the result of detecting the laser beam reflected by the mirror 923 .
- the Y-axis laser length measuring device 92y is composed of a laser interferometer 921, and the Y-axis laser length measuring device 92y uses the measurement result of the laser interferometer 921 as the position of the stage 2 in the Y direction.
- output to A ⁇ Y-axis laser length measuring device 92d is composed of a laser interferometer 921 and a laser interferometer 922.
- the ⁇ Y-axis laser length measuring device 92d measures the Y-direction position of the stage 2 measured by the laser interferometer 921 and The tilt (in other words, difference) from the Y-direction position of the stage 2 measured by the interferometer 922 is output to the control unit 8 as the rotation amount of the stage 2 in the rotation direction ⁇ . Then, as will be described in detail later, the control unit 8 creates a yawing correction table Ty based on the result of measuring the position of the stage 2 by the position measuring device 92 (table creation operation).
- FIG. 4 is a block diagram showing an example of the detailed configuration of a control unit that executes alignment mark acquisition operation and exposure operation.
- the control unit 8 has an integrated circuit 81, for example, an FPGA (Field Programmable Gate Array), and a control board 85 configured by, for example, a CPU (Central Processing Unit) and memory.
- FPGA Field Programmable Gate Array
- CPU Central Processing Unit
- the integrated circuit 81 has a Y-axis counter 811 that counts the output of the Y-axis encoder 312 provided in the Y-axis servomotor 311 . Further, the integrated circuit 81 has an imaging timing output section 812 , an exposure timing output section 813 and an interrupt generation section 814 .
- the imaging timing output unit 812 gives the alignment camera 51 imaging timing generated according to the Y-direction position of the stage 2 received from the Y-axis counter 811, and the alignment camera 51 performs imaging at this imaging timing.
- the exposure timing output unit 813 gives the exposure timing generated according to the Y-direction position of the stage 2 indicated by the Y-axis counter 811 to the exposure head 41, and the exposure head 41 performs exposure at this exposure timing.
- the interrupt generator 814 gives correction timings based on the straightness correction table Ts and the yaw correction table Ty, and the position correction of the stage 2, which will be described later, is performed at these correction timings.
- the integrated circuit 81 has a Y-axis position information output section 817 .
- This Y-axis position information output unit 817 outputs the position of the stage 2 in the Y direction measured by the Y-axis laser length measurer 92y, the amount of rotation in the rotation direction ⁇ of the stage 2 measured by the ⁇ Y-axis laser length measurer 92d, and the Y A count value of the axis counter 811 is input.
- the Y-axis position information output unit 817 then outputs these inputs to the control board 85 .
- the control board 85 has an imaging timing control section 851 .
- the imaging timing control unit 851 stores the correspondence relationship between the count value of the Y-axis counter 811 indicating the position of the stage 2 in the Y direction and the imaging timing.
- the alignment camera 51 is made to perform imaging at the imaging timing based on this correspondence acquired from 851 .
- the control board 85 also has a Y-axis scale correction table section 852 that corrects the Y-direction positional error of the stage 2 output by the Y-axis encoder 312 .
- a calibration operation for correcting the position of the stage 2 is performed in advance. In this calibration operation, while the stage 2 is moved in the Y direction by the Y-axis servo motor 311, the Y-direction position of the stage 2 measured by the Y-axis laser length measuring device 92y and the Y-axis counter of the output of the Y-axis encoder 312 are measured.
- the exposure timing output unit 813 of the integrated circuit 81 corrects the output count value of the Y-axis encoder 312 received from the Y-axis counter 811 based on the table, and Generate exposure timing.
- the control board 85 also has an X-axis scale correction table section 853 and a ⁇ -axis scale correction table section 854 that are similarly provided for the X direction and the rotation direction ⁇ . That is, the X-axis scale correction table unit 853 stores a table (X-axis scale correction table) for correcting the error between the output value of the X-axis encoder provided in the X-axis servomotor 331 and the position of the stage 2 in the X direction. store and output a correction value for correcting this error.
- a table X-axis scale correction table
- the ⁇ -axis scale correction table section 854 is a table ( ⁇ -axis scale correction table) for correcting the error between the output value of the ⁇ -axis encoder provided in the ⁇ -axis servomotor 351 and the amount of rotation of the stage 2 in the rotation direction ⁇ . ) and outputs a correction value for correcting this error.
- FIG. 5A is a diagram showing an example of a straightness correction table.
- the left column of the straightness correction table Ts indicates the position of the stage 2 in the Y direction indicated by the Y-axis counter 811 (in other words, the count value of the Y-axis encoder 312 by the Y-axis counter 811) as the movable range.
- One count is shown over Yt, and the right column of the straightness correction table Ts shows the correction amount (X direction correction amount) for correcting the position of the stage 2 in the X direction.
- the straightness correction table Ts shows the correspondence relationship between the position of the stage 2 in the Y direction indicated by the Y-axis counter 811 and the correction amount of the position of the stage 2 in the X direction. Therefore, the Y-axis straightness correction table section 855 drives the stage 2 in the X direction by the stage driving mechanism 3 by the correction amount indicated by the straightness correction table Ts in association with the position of the stage 2 in the Y direction. This ensures the straightness of the stage 2 moving in the Y direction. As will be described later, the straightness correction table Ts is created by cooperation between the straightness correction table creation unit 856 provided in the control board 85 and the CPU 911 provided in the main PC 91 .
- the control board 85 is provided with an X-axis scale correction table section 853 and a Y-axis straightness correction table section 855 as functions for correcting the position of the stage 2 in the X direction. Therefore, the control board 85 includes an X-axis movement amount calculator 857 that synthesizes the correction amounts of both correction tables 853 and 855 . That is, the X-axis movement amount calculation unit 857 calculates the total correction amount obtained by adding the correction amount output by the X-axis scale correction table unit 853 and the correction amount output by the Y-axis straightness correction table unit 855 to the X-axis servo motor 331 . , and the X-axis servomotor 331 drives the stage 2 in the X direction by the total correction amount.
- the control board 85 also has an XY yawing correction table section 858 that stores a yawing correction table Ty (FIG. 5B).
- FIG. 5B is a diagram showing an example of a yawing correction table.
- the left column of the yawing correction table Ty indicates the position of the stage 2 in the Y direction indicated by the Y-axis counter 811 (in other words, the count value of the Y-axis encoder 312 by the Y-axis counter 811).
- One count is shown over Yt
- the right column of the yawing correction table Ty shows correction amounts ( ⁇ direction correction amounts) for correcting the position of the stage 2 in the rotation direction ⁇ .
- the yawing correction table Ty shows the correspondence relationship between the position of the stage 2 in the Y direction indicated by the Y-axis counter 811 and the correction amount of the position of the stage 2 in the rotation direction ⁇ . Therefore, the XY yawing correction table unit 858 drives the stage 2 in the rotation direction ⁇ by the stage driving mechanism 3 by the correction amount indicated by the yawing correction table Ty in association with the position of the stage 2 in the Y direction. Thereby, yawing of the stage 2 moving in the Y direction can be suppressed. Note that the yawing correction table Ty is created by the XY yawing correction table section 858, as will be described later.
- the control board 85 is provided with a ⁇ -axis scale correction table section 854 and an XY yaw correction table section 858 as functions for correcting the position of the stage 2 in the rotational direction ⁇ . Therefore, the control board 85 includes a ⁇ -axis movement amount calculator 859 that synthesizes the correction amounts of both correction tables 854 and 858 .
- the ⁇ -axis movement amount calculation unit 859 sends the total correction amount obtained by adding the correction amount output by the ⁇ -axis scale correction table unit 854 and the correction amount output by the XY yaw correction table unit 858 to the ⁇ -axis servomotor 351 .
- the ⁇ -axis servomotor 351 drives the stage 2 in the rotation direction ⁇ by the total correction amount.
- FIG. 6 is a flow chart showing an example of an alignment mark acquisition operation and an exposure operation
- FIG. 7 is a side view schematically showing the operation of the exposure apparatus executed according to the flow chart of FIG. 6, and
- FIG. 8 is the flow chart of FIG. is a diagram schematically showing an example of a substrate to be executed.
- positional correction (straightness correction) of the stage 2 by the Y-axis straightness correction table section 855 and positional correction (yawing correction) of the stage 2 by the XY yaw correction table section 858 are executed.
- the execution timing of these position corrections is controlled by the interrupt generator 814 .
- the interrupt generation unit 814 issues an execution command to the X-axis movement amount calculation unit 857 and the ⁇ -axis movement amount calculation unit 859 .
- the X-axis movement amount calculation unit 857 and the .theta.-axis movement amount calculation unit 859 execute position correction in charge each time an execution command is received.
- positional correction of the stage 2 is not performed for each count.
- the position of the stage 2 may be corrected for each count.
- the stage driving mechanism 3 starts driving the stage 2 in the Y direction.
- the stage 2 moves within the alignment movement range Ya, and the substrate We placed on the stage 2 passes through the imaging range Rc (FIG. 7) of the alignment camera 51 (step S102).
- the substrate We is provided with an alignment mark Ma. Therefore, the alignment camera 51 images the alignment mark Ma moving in the imaging range Rc to obtain the alignment mark image Ia (step S103, alignment mark obtaining operation).
- the front end of the stage 2 reaches one end of the alignment movement range Ya ("at the start of acquisition of the alignment mark" in FIG. 7), the front end of the stage 2 reaches the other end of the alignment movement range Ya (in FIG. 7).
- the alignment mark image Ia is picked up during the "at the end of acquisition of the alignment mark").
- the alignment mark image Ia is transmitted from the alignment camera 51 to the main PC 91 (Fig. 4).
- the CPU 911 of the main PC 91 extracts the position of the alignment mark Ma by executing image processing on the alignment mark image Ia and transmits it to the control section 8 .
- the control unit 8 acquires the position of the alignment mark Ma from the CPU 911 (alignment mark acquisition operation). Based on the position of the alignment mark Ma obtained by the alignment mark obtaining operation, the control unit 8 adjusts the pattern of light irradiated onto the substrate We.
- the stage 2 reaches one end of the exposure movement range Ye just before the stage 2 reaches the other end of the alignment movement range Ya.
- the stage 2 moves within the exposure movement range Ye, and the substrate We placed on the stage 2 passes through the irradiation range Re (FIG. 7) of the exposure head 41 (step S104).
- the exposure head 41 irradiates the irradiation range Re with laser light to expose the stripe region Rs extending in the Y direction on the substrate We (exposure operation).
- the laser light irradiated to the irradiation range Re is adjusted based on the position of the alignment mark Ma, as described above.
- the front end of the stage 2 reaches one end of the exposure movement range Ye ("at the start of the exposure operation" in FIG. 7), the front end of the stage 2 reaches the other end of the exposure movement range Ye (" The exposure operation is executed during the time when the exposure operation is completed.
- step S106 the stage drive mechanism 3 stops moving the stage 2 in the Y direction (step S106).
- a plurality of stripe regions Rs arranged in the Y direction are set on the substrate We, and one stripe region Rs is irradiated with laser light in one exposure operation. . Therefore, in step S107, it is confirmed whether the exposure operation has been performed for all the stripe regions Rs. If there is a striped region Rs that has not been exposed (that is, unexposed), the stage driving mechanism 3 drives the stage 2 in the X direction so that the irradiation range Re of the exposure head 41 is unexposed. It is positioned in the stripe region Rs (step S108), and steps S104 to S106 are repeated.
- the direction in which the stage 2 passes through the exposure movement range Ye in this exposure operation is opposite to that in the previous exposure operation. In this way, by executing a plurality of exposure operations while reciprocating the stage 2 in the Y direction, all the stripe regions Rs can be exposed.
- FIG. 9 is a flow chart showing an example of a method for creating a yawing correction table.
- step S ⁇ b>201 an operator or a work robot attaches the position measuring device 92 to the main body 11 of the exposure apparatus 1 .
- step S202 the stage driving mechanism 3 starts driving the stage 2 in the Y direction.
- the stage 2 moves within the movable range Yt including the alignment movement range Ya and the exposure movement range Ye.
- the straightness correction table Ts and the yaw correction table Ty have not yet been created, straightness correction and yawing correction cannot be executed.
- the Y-axis servomotor 311 operates, while the X-axis servomotor 331 and the ⁇ -axis servomotor 351 are stopped, and straightness correction and yawing correction are not functioning.
- the XY yaw correction table unit 858 stores the output value (rotation amount in the rotation direction ⁇ ) from the ⁇ Y-axis laser length measuring device 92d and , and the output value (position in the Y direction) from the Y-axis counter 811 are associated with each other and obtained for each count of the Y-axis counter 811 (step S204). Note that these are acquired via the Y-axis position information output unit 817 . As a result, a yaw measurement result indicating the correspondence between the count value of the Y-axis counter 811 and the amount of rotation in the rotation direction ⁇ of the stage 2 positioned at the position indicated by the count value is obtained.
- the XY yaw correction table unit 858 obtains the error between the reference rotation amount ⁇ 0 in the rotation direction ⁇ and the measured rotation amount of the stage 2 in the rotation direction ⁇ , and determines the rotation direction ⁇ required to eliminate the error. By obtaining the correction amount, a yawing correction table Ty is created and stored (step S206).
- FIG. 10 is a flow chart showing an example of a method of creating a straightness correction table
- FIGS. 11A, 11B and 12 are diagrams schematically showing the operations executed in creating the straightness correction table of FIG. If the position measuring device 92 is not attached to the main body 11 of the exposure apparatus 1 before the start of the flow chart of FIG. 10, the position measuring device 92 is attached to the main body 11 by an operator or a working robot.
- step S301 the test substrate Wt is placed on the stage 2.
- the test substrate Wt is, for example, a glass substrate.
- a plurality of test marks Mt are arranged in the Y direction.
- the positional relationship of each test mark Mt in the X direction is measured in advance and stored in the straightness correction table creation unit 856 .
- each test mark Mt is provided at the same position in the X direction, and a plurality of test marks Mt are arranged in parallel in the Y direction.
- a photosensitive material such as a resist is applied to the upper surface of the glass substrate of the test substrate Wt, and the alignment camera 51 can capture the test marks Mt through this photosensitive material.
- step S302 the stage driving mechanism 3 starts driving the stage 2 in the Y direction.
- the stage 2 moves within the alignment movement range Ya, and the test substrate Wt passes through the imaging range Rc of the alignment camera 51 .
- the straightness correction table Ts has not yet been created, straightness correction cannot be executed.
- the yawing correction table Ty has already been created, yawing correction can be executed. Therefore, while the Y-axis servomotor 311 of the stage drive mechanism 3 is driving the stage 2 in the Y direction, the ⁇ -axis servomotor 351 drives the stage 2 in the rotation direction ⁇ based on the yawing correction table Ty to perform yawing. Perform correction. On the other hand, the X-axis servomotor 331 is stopped and straightness correction is not performed.
- step S304 the alignment camera 51 images the test mark Mt moving in the imaging range Rc to acquire the test mark image It (FIG. 12).
- the front end of the stage 2 reaches one end of the alignment movement range Ya ("at the start of test mark acquisition" in FIG. 11A)
- the front end of the stage 2 reaches the other end of the alignment movement range Ya (in FIG. 11A).
- the test mark image It is picked up during the "end of test mark acquisition").
- test mark image It is transmitted from the alignment camera 51 to the main PC 91 in association with the count value of the Y-axis counter 811 when the test mark image It was captured (Fig. 4).
- the CPU 911 of the main PC 91 extracts the position of the test mark Mt in the X direction by executing image processing on the test mark image It. Then, the position of the test mark Mt in the X direction is associated with the count value of the Y-axis counter 811 when the test mark Mt was imaged, and is transmitted from the main PC 91 to the straightness correction table creation unit 856 of the control board 85 . be done.
- the X-direction position of the test mark Mt that is, the X-direction position of the stage 2 can be measured for the count values over the entire alignment movement range Ya (step S305).
- the straightness correction table creation unit 856 obtains the error between the reference position X0 in the X direction and the measured position of the stage 2 in the X direction for each count value, and corrects the X direction necessary to eliminate the error.
- a straightness correction table Ts for the alignment movement range Ya is created and stored in the Y-axis straightness correction table section 855 (step S306).
- step S307 the exposure head 41 irradiates the test substrate Wt moving in the irradiation range Re with the light beam, thereby writing the exposure mark Me on each test mark Mt of the test substrate Wt (FIG. 12).
- the front end of the stage 2 reaches one end of the exposure movement range Ye ("at the start of the exposure operation" in FIG. 11A)
- the front end of the stage 2 reaches the other end of the exposure movement range Ye (" The exposure operation is executed during the time when the exposure operation is completed.
- the stage driving mechanism 3 stops the movement of the stage 2 in the Y direction in step S309 (step S309), and moves the stage 2 to the starting point (one end) of the alignment movement range Ya in step S310 ("Exposure” in FIG. 11B). At the start of mark acquisition"). Subsequently, the Y-axis straightness correction table unit 855 turns on straightness correction using the straightness correction table Ts for the alignment movement range Ya created in step S306 (step SS311).
- step S312 the stage driving mechanism 3 starts driving the stage 2 in the Y direction.
- the stage 2 moves within the alignment movement range Ya, and the test substrate Wt passes through the imaging range Rc of the alignment camera 51 .
- the stage 2 has been subjected to straightness correction based on the straightness correction table Ts created in step S306.
- step S314 the alignment camera 51 images the exposure mark Me moving in the imaging range Rc to acquire the exposure mark image Ie (FIG. 12).
- the front end of the stage 2 reaches one end of the alignment movement range Ya ("at the start of exposure mark acquisition" in FIG. 11B)
- the front end of the stage 2 reaches the other end of the alignment movement range Ya (in FIG. 11B).
- the exposure mark image Ie is picked up during the "end of acquisition of the exposure mark").
- the exposure mark image Ie is transmitted from the alignment camera 51 to the main PC 91 in association with the count value of the Y-axis counter 811 when the exposure mark image Ie was captured (FIG. 4).
- the CPU 911 of the main PC 91 extracts the position of the exposure mark Me in the X direction by executing image processing on the exposure mark image Ie. Then, the position of the exposure mark Me in the X direction is associated with the count value of the Y-axis counter 811 when the image of the exposure mark Me was captured, and is transmitted from the main PC 91 to the straightness correction table creation section 856 of the control board 85 . be done.
- the exposure mark Me is drawn by the exposure head 41 irradiating the test substrate Wt placed on the stage 2 passing through the exposure movement range Ye with the light beam. Further, the position of the exposure mark Me in the X direction is obtained based on the image of the exposure mark Me captured by the alignment camera 51 while the stage 2 is passing through the alignment movement range Ya while performing straightness correction on the stage 2. be done.
- the X-direction position of each exposure mark Me obtained in this manner represents the straightness of the stage 2 in the exposure movement range Ye.
- the straightness correction table creation unit 856 obtains the error between the reference position X0 in the X direction and the measured position of the stage 2 in the X direction for each count value, and corrects the X direction necessary to eliminate the error.
- a straightness correction table Ts for the exposure movement range Ye is created and stored in the Y-axis straightness correction table section 855 (step S316).
- the alignment movement range Ya and the exposure movement range Ye partially overlap. For this overlapping portion, either the data obtained in step S306 or the data obtained in step S316 may be selected and adopted.
- the stage 2 moves to the exposure movement range Ye (first movement range) in the Y direction.
- the substrate We passes through the irradiation range Re in the Y direction (first main scanning drive (step S104)).
- the exposure head 41 irradiates the irradiation range Re with light, thereby exposing the stripe region Rs (region) extending in the Y direction on the substrate We (exposure operation (step S105)).
- straightness indicating the X-direction correction amount (first straightness correction amount) for correcting the position of the stage 2 in the X direction (sub-scanning direction) according to the position of the stage 2 in the Y direction in the exposure movement range Ye.
- the correction table Ts first straightness correction information
- the position of the stage 2 in the X direction during execution of the first main scanning drive (step S104) is corrected by the stage drive mechanism 3 (first straightness correction operation).
- the stage drive mechanism 3 first straightness correction operation
- a correction information creating operation (steps S307 to S316) is executed to create a straightness correction table Ts based on the result of obtaining the position in the X direction of the stage 2 moving in the Y direction in the exposure movement range Ye by the stage driving mechanism 3. process is provided. Then, in the first straightness correction operation, the position of the stage 2 in the X direction is corrected based on the straightness correction table Ts created in the correction information creation operation. In such a configuration, the straightness correction table Ts is created based on the result of determining the position in the X direction of the stage 2 moving in the Y direction in the exposure movement range Ye by the stage drive mechanism 3, that is, based on the result of determining the straightness in advance. (correction information creation operation). Then, when performing the exposure operation (step S105) while performing the first main scanning drive (step S104), the straightness of the stage 2 can be ensured based on the straightness correction table Ts thus created.
- step S303 the stage driving mechanism 3 drives the stage 2, on which the test substrate Wt with the test marks Mt (reference marks) is placed, in the Y direction so that the stage 2 can move within the alignment movement range in the Y direction.
- a second main scanning drive is performed in which the test substrate Wt passes through the imaging range Rc of the alignment camera 51 in the Y direction while moving Ya (second movement range).
- step S304 the alignment camera 51 images the test mark Mt passing through the imaging range Rc during execution of the second main scanning drive to acquire the test mark image It.
- an X-direction correction amount (second straightness correction amount) for correcting the X-direction position of the stage 2 according to the Y-direction position of the stage 2 in the alignment movement range Ya is indicated.
- a straightness correction table Ts (second straightness correction information) is created based on the position in the X direction of the test mark Mt indicated by the test mark image It. Further, in a state where the stage 2 moves in the exposure movement range Ye and the substrate We passes through the irradiation range Re in the Y direction (first main scanning driving), the test substrate Wt passing through the irradiation range Re is exposed to the light from the exposure head 41 . By irradiating the light beam, the exposure mark Me is drawn on the test substrate Wt.
- the stage 2 While correcting the position of the stage 2 in the X direction based on the straightness correction table Ts, the stage 2 moves within the alignment movement range Ya, and the test substrate Wt passes through the imaging range Rc of the alignment camera 51 in the Y direction.
- the exposure mark image Ie is obtained by imaging the exposure mark Me passing through the imaging range Rc with the alignment camera 51 (steps S310 to S314).
- a straightness correction table Ts is created based on the result of determining the X-direction position of the stage 2 moving in the exposure movement range Ye (step S315, S316).
- the position of the stage 2 in the Y direction is detected by the Y-axis counter 811 (position detection unit) and transmitted to the imaging timing output unit 812 (imaging timing control unit). Then, the image capturing timing output unit 812 captures an image of the alignment mark Ma of the substrate We by causing the alignment camera 51 to perform image capturing at a timing corresponding to the position of the stage 2 in the Y direction received from the Y-axis counter 811 .
- the Y-axis counter 811 and the imaging timing output section 812 are provided in the same integrated circuit 81 (FPGA).
- the position of the stage 2 in the Y direction can be transmitted to the imaging timing output section 812 while suppressing communication delay from the Y-axis counter 811 to the imaging timing output section 812 . Therefore, imaging by the alignment camera 51 can be performed at an appropriate timing according to the position of the stage 2 .
- the position of the stage 2 in the Y direction is detected by the Y-axis counter 811 (position detection unit) and transmitted to the interrupt generation unit 814 (correction timing control unit). Then, the interrupt generation unit 814 causes the stage drive mechanism 3 to perform straightness correction (first straightness correction operation) based on the straightness correction table Ts at a timing corresponding to the position of the stage 2 in the Y direction received from the Y-axis counter 811 . let it run.
- the Y-axis counter 811 and the interrupt generator 814 are provided in the same integrated circuit 81 (FPGA).
- the position of the stage 2 in the Y direction can be transmitted to the interrupt generator 814 while suppressing communication delay from the Y-axis counter 811 to the interrupt generator 814 . Therefore, the position of the stage 2 in the X direction can be corrected at an appropriate timing according to the position of the stage 2 .
- the stage 2 moves to the exposure movement range Ye (first movement range) in the Y direction.
- the substrate We passes through the irradiation range Re in the Y direction (Step S104 (first main scanning drive)).
- the exposure head 41 irradiates the irradiation range Re with light, thereby exposing the stripe region Rs extending in the Y direction on the substrate We (step S105 (exposure motion)).
- the stage driving mechanism 3 corrects the amount of rotation of the stage 2 in the rotational direction ⁇ during execution of the first main scanning drive (first yawing correction operation).
- the yawing of the stage 2 when the stage 2 is driven in the Y direction by the stage drive mechanism 3 is suppressed, and the exposure head 41 is positioned at an appropriate position on the substrate We placed on the stage 2 while suppressing the cost increase. It is possible to irradiate light from
- a first correction information creating operation (steps S201 to S206) of creating a yawing correction table Ty based on the result of obtaining the rotation amount in the rotation direction ⁇ of the stage 2 moving in the Y direction in the exposure movement range Ye by the stage drive mechanism 3 ) is executed.
- first correction information generation operation (steps S201 to S206 ) the amount of rotation of the stage 2 in the rotation direction ⁇ is corrected based on the yawing correction table Ty created in step 1).
- the yaw correction table Ty is created based on the result of obtaining the position in the rotation direction ⁇ of the stage 2 moving in the Y direction in the exposure movement range Ye by the stage driving mechanism 3, that is, based on the result of obtaining the yawing in advance (step S201-S206). Then, when performing the exposure operation (step S105) while moving the exposure movement range Ye of the stage 2 in step S104 (first main scanning drive), the stage 2 is moved based on the yawing correction table Ty thus created. yawing can be suppressed.
- a step (step S201) of attaching a position measuring device 92 (yawing measuring device) for measuring the amount of rotation of the stage 2 in the rotation direction ⁇ with a laser interferometer is provided to the exposure apparatus 1 . Then, by driving the stage 2 in the Y direction by the stage driving mechanism 3, the amount of rotation in the rotation direction ⁇ of the stage 2 moving in the exposure movement range Ye is measured by the position measuring device 92, and the Y direction of the stage 2 is measured. and the amount of rotation in the direction of rotation . (step S206). With such a configuration, the yawing of the stage 2 can be easily obtained by measurement with the laser interferometer of the position measuring device 92 .
- the position measuring device 92 is attached to the exposure apparatus 1 and used when measuring yawing. Therefore, the position measuring device 92 can be removed from the exposure apparatus 1 after the yawing measurement is completed. Therefore, it is not necessary to equip the exposure apparatus 1 itself with the position measuring device 92, and the cost increase of the exposure apparatus 1 can be suppressed.
- the stage 2 moves within the alignment movement range Ya (second movement range) in the Y direction, and the substrate We moves within the imaging range Rc of the alignment camera 51 .
- the alignment camera 51 captures an image of the alignment mark Ma passing through the imaging range Rc.
- the alignment mark image Ia is captured, and the position of the alignment mark Ma indicated by this alignment mark image Ia is acquired (step S103, alignment mark acquisition operation).
- a yawing correction table Ty showing the ⁇ -direction correction amount (second yawing correction amount) for correcting the rotation amount of the stage 2 in the rotation direction ⁇ according to the Y-direction position of the stage 2 in the alignment movement range Ya.
- the stage drive mechanism 3 second yawing correction operation
- a second correction information creating operation (steps S201 to S206) of creating a yawing correction table Ty based on the result of obtaining the rotation amount in the rotation direction ⁇ of the stage 2 moving in the Y direction in the alignment movement range Ya by the stage driving mechanism 3 ) is executed. Then, in the yawing correction (second yawing correction operation) executed in parallel with the movement of the alignment movement range Ya of the stage 2 (second main scanning drive) in step 102, the second correction information generating operation (steps S201 to S206 ), the amount of rotation of the stage 2 in the rotation direction ⁇ is corrected based on the yawing correction table Ty created in step 1).
- the yaw correction table Ty is created based on the result of obtaining the position in the rotation direction ⁇ of the stage 2 moving in the Y direction in the alignment movement range Ya by the stage drive mechanism 3, that is, based on the result of obtaining the yawing in advance (step S201-S206). Then, when executing the alignment mark acquisition operation (step S103) while executing the movement of the stage 2 in the alignment movement range Ya (second main scanning drive) in step S102, the yaw correction table Ty thus created is used as the basis for the alignment mark acquisition operation (step S103). Yawing of the driven object can be suppressed.
- a step (step S201) of attaching a position measuring device 92 (yawing measuring device) for measuring the amount of rotation of the stage 2 in the rotation direction ⁇ with a laser interferometer is provided to the exposure apparatus 1 . Then, by driving the stage 2 in the Y direction by the stage driving mechanism 3, the amount of rotation in the rotation direction ⁇ of the stage 2 moving in the alignment movement range Ya is measured by the position measuring device 92, and the rotation amount of the stage 2 in the Y direction is measured. , and the amount of rotation in the direction of rotation . (step S206). With such a configuration, the yawing of the stage 2 can be easily obtained by measurement with the laser interferometer of the position measuring device 92 .
- the position measuring device 92 is attached to the exposure apparatus 1 and used when measuring yawing. Therefore, the position measuring device 92 can be removed from the exposure apparatus 1 after the yawing measurement is completed. Therefore, it is not necessary to equip the exposure apparatus 1 itself with the position measuring device 92, and the cost increase of the exposure apparatus 1 can be suppressed.
- the position of the stage 2 in the Y direction is detected by the Y-axis counter 811 (position detection unit), and an image capturing operation for controlling the execution timing of image capturing by the alignment camera 51 (camera) is performed. It is transmitted to the timing output unit 812 (imaging timing control unit). Then, the imaging timing output unit 812 captures the alignment mark Ma by causing the alignment camera 51 to perform imaging at a timing corresponding to the position of the stage 2 in the Y direction received from the Y-axis counter 811 .
- the Y-axis counter 811 and the imaging timing output section 812 are provided in the same integrated circuit 81 (FPGA).
- the position of the stage 2 in the Y direction can be transmitted to the imaging timing output section 812 while suppressing communication delay from the Y-axis counter 811 to the imaging timing output section 812 . Therefore, imaging by the alignment camera 51 can be performed at an appropriate timing according to the position of the stage 2 .
- the position of the stage 2 in the Y direction is detected by the Y-axis counter 811, and an interrupt generation unit 814 (correction timing control unit) that controls the execution timing of yawing correction (first yawing correction operation) by the stage drive mechanism 3. sent to.
- the interrupt generator 814 causes the stage drive mechanism 3 to perform yawing correction at a timing corresponding to the Y-direction position of the stage 2 received from the Y-axis counter 811 .
- the Y-axis counter 811 and the interrupt generator 814 are provided in the same integrated circuit 81 (FPGA).
- the position of the stage 2 in the Y direction can be transmitted to the interrupt generator 814 while suppressing communication delay from the Y-axis counter 811 to the interrupt generator 814 . Therefore, the amount of rotation of the stage 2 in the rotation direction ⁇ can be corrected at an appropriate timing according to the position of the stage 2 .
- the exposure apparatus 1 corresponds to an example of the "exposure apparatus” of the first aspect of the present invention
- the stage 2 is an example of the "stage” and the "driving target” of the first aspect of the present invention.
- the stage driving mechanism 3 corresponds to an example of the “driving mechanism” of the first aspect of the present invention
- the exposure head 41 corresponds to an example of the "exposure head” of the first aspect of the present invention
- the alignment camera 51 corresponds to It corresponds to an example of the "camera” of the first aspect of the present invention
- the control section 8 corresponds to an example of the "control section” and the "storage section” of the first aspect of the present invention
- the integrated circuit 81 corresponds to the first aspect of the present invention.
- the Y-axis counter 811 corresponds to an example of the "position detector” of the first aspect of the present invention
- the imaging timing output unit 812 corresponds to the "integrated circuit" of the first aspect of the present invention
- the interrupt generation unit 814 corresponds to an example of the "correction timing control unit” of the first aspect of the present invention
- the alignment mark Ma corresponds to an example of the "alignment mark” of the first aspect of the present invention.
- the exposure mark Me corresponds to an example of the "exposure mark” of the first aspect of the present invention
- the test mark Mt corresponds to an example of the "reference mark” of the first aspect of the present invention
- the straightness correction table Ts for the range Ya corresponds to an example of the "second straightness correction information" of the first aspect of the present invention
- the straightness correction table Ts for the exposure movement range Ye is the "first straightness correction information" of the first aspect of the present invention.
- the imaging range Rc corresponds to an example of the "imaging range” of the first aspect of the present invention
- the irradiation range Re corresponds to an example of the "irradiation range” of the first aspect of the present invention
- the substrate We corresponds to an example of the "substrate” of the first aspect of the present invention
- the test substrate Wt corresponds to an example of the "test substrate” of the first aspect of the present invention
- the X direction corresponds to the first aspect of the present invention.
- the Y direction corresponds to an example of the "sub-scanning direction
- the Y direction corresponds to an example of the "main scanning direction” of the first aspect of the present invention
- the alignment movement range Ya is the "second movement range" of the first aspect of the present invention.
- the exposure movement range Ye corresponds to an example of the "first movement range” of the first aspect of the present invention
- step S104 or step S307 corresponds to the "first main scanning drive” of the first aspect of the present invention.
- Step S105 corresponds to an example of the "exposure operation” of the first aspect of the present invention
- Step S303 corresponds to an example of the "second main scanning drive” of the first aspect of the present invention
- Step S307 to S316 correspond to an example of the "correction information creating operation” of the first aspect of the present invention
- the straightness correction for the stage 2 moving in the exposure movement range Ye is the present invention. This corresponds to an example of the "first straightness correction operation" of the first aspect of Ming.
- the exposure apparatus 1 corresponds to an example of the "exposure apparatus” of the second aspect of the present invention
- the stage 2 is an example of the "stage” and “driving target” of the second aspect of the present invention.
- the stage driving mechanism 3 corresponds to an example of the “driving mechanism” of the second aspect of the present invention
- the exposure head 41 corresponds to an example of the "exposure head” of the second aspect of the present invention
- the control unit 8 corresponds to
- the integrated circuit 81 corresponds to an example of the "integrated circuit” of the second aspect of the present invention
- the Y-axis counter 811 corresponds to an example of the "control section” and the "storage section” of the second aspect of the present invention.
- the imaging timing output unit 812 corresponds to an example of the “imaging timing control unit” of the second aspect of the present invention
- the interrupt generation unit 814 corresponds to the second aspect of the present invention.
- the position measuring device 92 corresponds to an example of the "yaw measuring device” of the second aspect of the present invention
- the alignment mark Ma corresponds to the "correction timing control section” of the second aspect of the present invention.
- the irradiation range Re corresponds to an example of the "irradiation range” of the second aspect of the present invention
- the yawing correction table Ty for the exposure movement range Ye corresponds to the "first alignment mark" of the second aspect of the present invention.
- the straightness correction table Ts for the alignment movement range Ya corresponds to an example of the "second yawing correction information" of the second aspect of the present invention
- the substrate We corresponds to an example of the "second yawing correction information" of the second aspect of the present invention. It corresponds to an example of the "substrate”
- the Y direction corresponds to an example of the "main scanning direction” of the second aspect of the present invention
- the alignment movement range Ya is an example of the "second movement range” of the second aspect of the present invention.
- the exposure movement range Ye corresponds to an example of the "first movement range” of the second aspect of the present invention
- the rotation direction ⁇ corresponds to an example of the "yaw direction” of the second aspect of the present invention
- ⁇ The direction correction amount corresponds to an example of the "first yawing correction amount” and the “second yawing correction amount” of the second aspect of the present invention
- step S102 corresponds to the "second main scanning drive” of the second aspect of the present invention.
- step S103 corresponds to an example
- step S104 corresponds to an example of the "first main scanning drive” of the second aspect of the present invention
- step S105 corresponds to an example of the "exposure operation” of the second aspect of the present invention
- steps S201 to S206 correspond to "first correction information creating operation” and "second correction information creating operation” of the second aspect of the present invention.
- step S204 is an example of "first yawing measurement” and "second yawing measurement” of the second aspect of the present invention.
- the yawing correction executed in parallel with step S102 corresponds to an example of the "second yawing correction operation" of the second aspect of the present invention
- the yawing correction executed in parallel with step S104 corresponds to the yaw correction of the present invention. This corresponds to an example of the "first yawing correction operation" of the second mode.
- FIG. 13 is a block diagram showing a configuration for executing another example of the straightness correction table creation method
- FIG. 14 is a perspective view showing a configuration for carrying out another example of the straightness correction table creation method.
- the position of the stage 2 in the X direction is measured by a laser interferometer. That is, in addition to the configuration shown in FIG. 3, the position measuring instrument 92 includes a laser interferometer 925 attached to the side surface of the stage 2 in the X direction, and a laser interferometer 925 extending over the movement range of the stage 2 in the Y direction. and a mirror 926 .
- a laser interferometer 925 emits a laser beam parallel to the X direction
- a mirror 926 is a mirror surface perpendicular to the X direction
- the laser interferometer 925 and the mirror 926 face each other in the X direction.
- the laser interferometer 925 emits laser light toward the mirror 926 and measures the position of the stage 2 in the X direction based on the result of detecting the laser light reflected by the mirror 926 .
- the X-axis laser length measurer 92x is composed of a laser interferometer 925, and the X-axis laser length measurer 92x outputs the X-direction position of the stage 2 measured by the laser interferometer 925 to the control unit 8. Then, the control unit 8 creates a straightness correction table Ts based on the results of measuring the position of the stage 2 by the position measuring device 92 .
- the straightness correction table creation unit 856 of the control unit 8 calculates the count value output by the Y-axis counter 811 and the X direction of the stage 2 output by the X-axis laser length measuring device 92x. is associated with the position of , and acquired for each count of the Y-axis counter 811 .
- a straightness measurement result indicating the correspondence between the count value of the Y-axis counter 811 and the position in the X direction of the stage 2 positioned at the position indicated by the count value is obtained.
- the straightness correction table creation unit 856 obtains the error between the reference position X0 in the X direction and the measured position of the stage 2 in the X direction, and obtains the correction amount in the X direction necessary to eliminate the error.
- a straightness correction table Ts is created and stored in the Y-axis straightness correction table section 855 .
- the straightness correction table Ts is created based on the results of measuring the position in the X direction of the stage 2 moving in the Y direction in the exposure movement range Ye by a laser interferometer.
- the straightness of the stage 2 can be easily obtained by measurement with a laser interferometer.
- a straightness correction table Ts may be provided for each of a plurality of sub-scanning positions (in other words, a plurality of stripe regions Rs). Specifically, while changing the position of the stage 2 at a plurality of sub-scanning positions, the above-described operation of creating the straightness correction table Ts may be executed for each sub-scanning position.
- the position in the X direction of the stage 2 driven in the Y direction is Correction is performed based on the straightness correction table Ts provided for the one sub-scanning position (in other words, one stripe region Rs). This makes it possible to ensure the straightness of the stage 2 in the Y direction at each of the plurality of sub-scanning positions.
- the number of straightness correction tables Ts may be less than the number of stripe regions Rs.
- the straightness correction table Ts is provided for each of a plurality of set positions that are different in the X direction, and the plurality of set positions is smaller than the plurality of sub-scanning positions (in other words, the plurality of stripe regions Rs). .
- the stage 2 is positioned at one sub-scanning position corresponding to one stripe region Rs among the plurality of stripe regions Rs, the one sub-scanning position among the plurality of set positions is the closest.
- the X-direction position of the stage 2 driven in the Y-direction is corrected based on the straightness correction table Ts provided for the near set position. This makes it possible to secure the straightness of the stage 2 in the Y direction at each of the plurality of sub-scanning positions while suppressing memory resources required for storing the straightness correction table Ts.
- the correction amount of the X-direction position of the stage 2 driven in the Y-direction may be calculated by linear interpolation using the correction amounts obtained respectively from the straightness correction table Ts provided for .
- the yawing correction table Ty can also be configured to be provided for each of a plurality of sub-scanning positions or set positions.
- transformations other than the above can be added.
- the yawing of the stage 2 may not be corrected.
- a yawing correction table Ty may be provided for each of a plurality of sub-scanning positions (in other words, a plurality of stripe regions Rs). Specifically, while changing the position of the stage 2 at a plurality of sub-scanning positions, the above-described operation of creating the yaw correction table Ty may be executed for each sub-scanning position.
- the stage 2 when the stage 2 is positioned at one sub-scanning position corresponding to one stripe region Rs among the plurality of stripe regions Rs, the amount of rotation in the rotation direction ⁇ of the stage 2 driven in the Y direction is is corrected based on the yawing correction table Ty provided for the one sub-scanning position (in other words, one stripe region Rs). This makes it possible to suppress the yawing of the stage 2 in the Y direction at each of the plurality of sub-scanning positions.
- the number of yawing correction tables Ty may be less than the number of stripe regions Rs.
- the yawing correction table Ty is provided for each of a plurality of set positions that differ in the X direction, and the plurality of set positions is smaller than the plurality of sub-scanning positions (in other words, the plurality of stripe regions Rs). .
- the stage 2 is positioned at one sub-scanning position corresponding to one stripe region Rs among the plurality of stripe regions Rs, the one sub-scanning position among the plurality of set positions is the closest.
- the rotation amount in the rotation direction ⁇ of the stage 2 driven in the Y direction is corrected based on the yawing correction table Ty provided for the near set position.
- the stage 2 is positioned at one sub-scanning position corresponding to one stripe region Rs among the plurality of stripe regions Rs, the setting closest to the one sub-scanning position among the plurality of setting positions Y
- the amount of rotation in the rotation direction ⁇ of the stage 2 driven in the direction may be corrected. This makes it possible to suppress the yawing of the stage 2 at each of the plurality of sub-scanning positions while suppressing the memory resources required for storing the yawing correction table Ty.
- the straightness correction table Ts can also be configured to be provided for each of a plurality of sub-scanning positions or set positions.
- the exposure operation is performed while changing the position of the stage 2 at a plurality of sub-scanning positions, thereby exposing each of the plurality of stripe regions Rs.
- the position (exposure start position) of the stage 2 in the Y direction may vary among a plurality of sub-scanning positions (in other words, a plurality of stripe regions Rs).
- a correction table showing correction amounts for eliminating the variations may be created.
- this correction table by correcting the position of the stage 2 in the Y direction based on this correction table, it is possible to perform the exposure operation on the substrate We while suppressing variations in the exposure start position.
- information for straightness correction may be held in the form of a mathematical expression instead of a table format such as the straightness correction table Ts.
- information for performing yawing correction may be held in the form of a mathematical expression instead of a table format such as the yawing correction table Ty. The same applies to various information shown by other tables.
- the stage 2 may be moved relative to the alignment camera 51 and the exposure head 41 by driving the alignment camera 51 and the exposure head 41 instead of the stage 2 .
- the arrangement of the functional units 811 to 817 and 851 to 859 may be exchanged between the integrated circuit 81 and the control board 85 . Furthermore, it is not necessary to divide the control unit 8 into the integrated circuit 81 and the control board 85, and they may be constructed integrally. Also, the main PC 91 may be integrally attached to the exposure apparatus 1 .
- the mode of the test marks Mt provided on the test substrate Wt is not limited to the example of FIG.
- a single straight line extending parallel to the Y direction may be provided on the test substrate Wt as the test mark Mt.
- the present invention is suitable for the technical field of exposing a substrate, such as a semiconductor wafer or a glass substrate, to form a pattern on the substrate.
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Abstract
Description
2…ステージ(駆動対象)
3…ステージ駆動機構(駆動機構)
41…露光ヘッド
51…アライメントカメラ(カメラ)
8…制御部(制御部、記憶部)
81…集積回路
811…Y軸カウンタ(位置検出部)
812…撮像タイミング出力部(撮像タイミング制御部)
814…割込み生成部(補正タイミング制御部)
92…位置計測器(ヨーイング計測器)
Ma…アライメントマーク
Me…露光マーク
Mt…テストマーク(基準マーク)
Ts…真直補正テーブル(第1・第2真直補正情報)
Ty…ヨーイング補正テーブル(第1・第2ヨーイング補正情報)
Rc…撮像範囲
Re…照射範囲
We…基板
Wt…テスト基板
X…X方向(副走査方向)
Y…Y方向(主走査方向)
Ya…アライメント移動範囲(第2移動範囲)
Ye…露光移動範囲(第1移動範囲)
θ…回転方向(ヨー方向)
S102…ステップ(第2主走査駆動)
S103…ステップ(アライメントマーク取得動作)
S104、S307…ステップ(第1主走査駆動)
S105…ステップ(露光動作)
S303…ステップ(第2主走査駆動)
S307~S316…ステップ(補正情報作成動作)
S201~S206…ステップ(第1・第2補正情報作成動作)
S204…ステップ(第1・第2ヨーイング計測)
Claims (22)
- 基板が載置されるステージおよび照射範囲に光を照射する露光ヘッドのうちの一方の駆動対象を駆動機構により主走査方向へ駆動することで、前記駆動対象が前記主走査方向における第1移動範囲を移動するとともに、前記基板が前記照射範囲を相対的に前記主走査方向に通過する第1主走査駆動を実行する工程と、
前記第1移動範囲における前記駆動対象の前記主走査方向への位置に応じて前記第1主走査駆動の実行中に前記駆動対象の副走査方向への位置、および前記駆動対象のヨー方向への回転量の少なくとも一方を前記駆動機構によって補正する補正動作を実行する工程と、
前記第1主走査駆動の実行中に前記露光ヘッドから前記照射範囲に光を照射することで、前記基板において前記主走査方向に延びる領域を露光する露光動作を実行する工程と
を備えた露光方法。 - 前記補正動作は、前記駆動対象の前記副走査方向への位置を補正するための第1真直補正量を示す第1真直補正情報に基づき、前記第1主走査駆動の実行中に前記駆動対象の前記副走査方向への位置を前記駆動機構によって補正する第1真直補正動作を含む請求項1に記載の露光方法。
- 前記駆動機構によって前記第1移動範囲を前記主走査方向に移動する前記駆動対象の前記副走査方向における位置を求めた結果に基づき前記第1真直補正情報を作成する補正情報作成動作を実行する工程をさらに備え、
前記第1真直補正動作では、前記補正情報作成動作で作成された前記第1真直補正情報に基づき、前記駆動対象の前記副走査方向への位置を補正する請求項2に記載の露光方法。 - 前記補正情報作成動作では、前記第1移動範囲を前記主走査方向に移動する前記駆動対象の前記副走査方向への位置をレーザ干渉計によって測定した結果に基づき前記第1真直補正情報を作成する請求項3に記載の露光方法。
- 基準マークが付されたテスト基板が載置された前記ステージを前記駆動対象として、前記駆動機構により前記主走査方向へ駆動することで、前記ステージが前記主走査方向における第2移動範囲を移動するとともに、前記テスト基板がカメラの撮像範囲を前記主走査方向に通過する第2主走査駆動を実行する工程と、
前記第2主走査駆動の実行中に前記撮像範囲を通過する前記基準マークを前記カメラによって撮像して基準マーク画像を取得する工程と、
前記第2移動範囲における前記ステージの前記主走査方向への位置に応じて前記ステージの前記副走査方向への位置を補正するための第2真直補正量を示す第2真直補正情報を、前記基準マーク画像が示す前記基準マークの前記副走査方向への位置に基づき作成する工程と、
前記第1主走査駆動を実行しつつ、前記照射範囲を通過する前記テスト基板に前記露光ヘッドから光を照射することで、前記テスト基板に露光マークを描画する工程と、
前記第2真直補正情報に基づき前記ステージの前記副走査方向への位置を補正しつつ前記第2主走査駆動を実行して、前記撮像範囲を通過する前記露光マークを前記カメラで撮像して露光マーク画像を取得する工程と、
前記露光マーク画像が示す前記露光マークの前記副走査方向への位置に基づき、前記第1移動範囲を移動する前記ステージの前記副走査方向の位置を求めた結果に基づき前記第1真直補正情報を作成する工程と
を、前記補正情報作成動作において実行する請求項3に記載の露光方法。 - 前記駆動対象の前記主走査方向への位置を位置検出部によって検出して、カメラによる撮像の実行タイミングを制御する撮像タイミング制御部に送信する工程と、
前記撮像タイミング制御部が、前記位置検出部から受信した前記駆動対象の前記主走査方向への位置に応じたタイミングで、前記カメラに撮像を実行させることで、前記基板のアライメントマークを撮像する工程と
を備え、
前記位置検出部と前記撮像タイミング制御部とは、同一の集積回路内に設けられている請求項2ないし5のいずれか一項に記載の露光方法。 - 前記駆動対象の前記主走査方向への位置を位置検出部によって検出して、前記駆動機構による前記第1真直補正動作の実行タイミングを制御する補正タイミング制御部に送信する工程をさらに備え、
前記補正タイミング制御部が、前記位置検出部から受信した前記駆動対象の前記主走査方向への位置に応じたタイミングで、前記駆動機構に前記第1真直補正動作を実行させ、
前記位置検出部と前記補正タイミング制御部とは、同一の集積回路内に設けられている請求項2ないし6のいずれか一項に記載の露光方法。 - 前記基板に対しては、前記副走査方向において異なる複数の露光位置が設定され、前記複数の露光位置にそれぞれ対応する、前記副走査方向において異なる複数の副走査位置の間で、前記駆動対象の位置を前記駆動機構によって変更しつつ、前記第1主走査駆動、前記第1真直補正動作および前記露光動作を繰り返す請求項2ないし7のいずれか一項に記載の露光方法であって、
前記第1真直補正情報は、前記複数の副走査位置のそれぞれについて設けられ、
前記第1真直補正動作では、前記駆動対象が位置する前記副走査位置について設けられた前記第1真直補正情報に基づき前記駆動対象の前記副走査方向への位置を補正する露光方法。 - 前記基板に対しては、前記副走査方向において異なる複数の露光位置が設定され、前記複数の露光位置にそれぞれ対応する、前記副走査方向において異なる複数の副走査位置の間で、前記駆動対象の位置を前記駆動機構によって変更しつつ、前記第1主走査駆動、前記第1真直補正動作および前記露光動作を繰り返す請求項2ないし7のいずれか一項に記載の露光方法であって、
前記第1真直補正情報は、前記副走査方向において異なる複数の設定位置のそれぞれについて設けられ、
前記複数の設定位置は、前記複数の副走査位置よりも少なく、
前記第1真直補正動作では、前記複数の設定位置のうち、前記駆動対象が位置する前記副走査位置に最も近い前記設定位置について設けられた前記第1真直補正情報に基づいて、または前記駆動対象が位置する前記副走査位置に最も近い前記設定位置について設けられた前記第1真直補正情報および前記駆動対象が位置する前記副走査位置に二番目に近い前記設定位置について設けられた前記第1真直補正情報を用いた線形補間によって、前記駆動対象の前記副走査方向への位置を補正する露光方法。 - 前記補正動作は、前記駆動対象の前記ヨー方向への回転量を補正するための第1ヨーイング補正量を示す第1ヨーイング補正情報に基づき、前記第1主走査駆動の実行中に前記駆動対象の前記ヨー方向への回転量を前記駆動機構によって補正する第1ヨーイング補正動作を含む請求項1に記載の露光方法。
- 前記駆動機構によって前記第1移動範囲を前記主走査方向に移動する前記駆動対象の前記ヨー方向における回転量を求めた結果に基づき前記第1ヨーイング補正情報を作成する第1補正情報作成動作を実行する工程をさらに備え、
前記第1ヨーイング補正動作では、前記第1補正情報作成動作で作成された前記第1ヨーイング補正情報に基づき、前記駆動対象の前記ヨー方向への回転量を補正する請求項10に記載の露光方法。 - 前記ステージ、前記露光ヘッドおよび前記駆動機構を備えた露光装置に対して、前記ヨー方向への前記ステージの回転量をレーザ干渉計によって計測するヨーイング計測器を取り付ける工程と、
前記駆動対象を前記駆動機構により前記主走査方向へ駆動することで前記第1移動範囲を移動する前記駆動対象の前記ヨー方向への回転量を前記ヨーイング計測器によって計測して、前記駆動対象の前記主走査方向への位置と前記ヨー方向への回転量とを対応付けて取得する第1ヨーイング計測を実行する工程と、
前記第1ヨーイング補正情報を、前記第1ヨーイング計測の結果に基づき作成する工程と
を、前記第1補正情報作成動作において実行する請求項11に記載の露光方法。 - 前記駆動対象を前記駆動機構により前記主走査方向へ駆動することで、前記駆動対象が前記主走査方向における第2移動範囲を移動するとともに、前記基板がカメラの撮像範囲を相対的に前記主走査方向に通過する第2主走査駆動を実行する工程と、
前記第2移動範囲における前記駆動対象の前記主走査方向への位置に応じて前記駆動対象の前記ヨー方向への回転量を補正するための第2ヨーイング補正量を示す第2ヨーイング補正情報に基づき、前記第2主走査駆動の実行中に前記駆動対象の前記ヨー方向への回転量を前記駆動機構によって補正する第2ヨーイング補正動作を実行する工程と、
前記第2主走査駆動の実行中に前記撮像範囲を通過する前記基板のアライメントマークを前記カメラにより撮像することでアライメントマーク画像を撮像して、前記アライメントマーク画像が示す前記アライメントマークの位置を取得するアライメントマーク取得動作を実行する工程と
を前記露光動作の実行前に備え、
前記露光動作では、前記アライメントマーク取得動作で取得された前記アライメントマークの位置に応じて前記露光ヘッドから前記基板へ照射される光のパターンが調整される請求項10ないし12のいずれか一項に記載の露光方法。 - 前記駆動機構によって前記第2移動範囲を前記主走査方向に移動する前記駆動対象の前記ヨー方向における回転量を求めた結果に基づき前記第2ヨーイング補正情報を作成する第2補正情報作成動作を実行する工程をさらに備え、
前記第2ヨーイング補正動作では、前記第2補正情報作成動作で作成された前記第2ヨーイング補正情報に基づき、前記駆動対象の前記ヨー方向への回転量を補正する請求項13に記載の露光方法。 - 前記ステージ、前記露光ヘッドおよび前記駆動機構を備えた露光装置に対して、前記ヨー方向への前記ステージの回転量をレーザ干渉計によって計測するヨーイング計測器を取り付ける工程と、
前記駆動対象を前記駆動機構により前記主走査方向へ駆動することで前記第2移動範囲を移動する前記駆動対象の前記ヨー方向への回転量を前記ヨーイング計測器によって計測して、前記駆動対象の前記主走査方向への位置と前記ヨー方向への回転量とを対応付けて取得する第2ヨーイング計測を実行する工程と、
前記第2ヨーイング補正情報を、前記第2ヨーイング計測の結果に基づき作成する工程と
を、前記第2補正情報作成動作において実行する請求項14に記載の露光方法。 - 前記アライメントマーク取得動作では、前記駆動対象の前記主走査方向への位置を位置検出部によって検出して、前記カメラによる撮像の実行タイミングを制御する撮像タイミング制御部に送信し、前記撮像タイミング制御部が、前記位置検出部から受信した前記駆動対象の前記主走査方向への位置に応じたタイミングで、前記カメラに撮像を実行させることで前記アライメントマークを撮像し、
前記位置検出部と前記撮像タイミング制御部とは、同一の集積回路内に設けられている請求項13ないし15のいずれか一項に記載の露光方法。 - 前記駆動対象の前記主走査方向への位置を位置検出部によって検出して、前記駆動機構による前記第1ヨーイング補正動作の実行タイミングを制御する補正タイミング制御部に送信する工程をさらに備え、
前記補正タイミング制御部が前記位置検出部から受信した前記駆動対象の前記主走査方向への位置に応じたタイミングで、前記駆動機構に前記第1ヨーイング補正動作を実行させ、
前記位置検出部と前記補正タイミング制御部とは、同一の集積回路内に設けられている請求項10ないし16のいずれか一項に記載の露光方法。 - 前記基板に対しては、副走査方向において異なる複数の露光位置が設定され、前記複数の露光位置にそれぞれ対応する、前記副走査方向において異なる複数の副走査位置の間で、前記駆動対象の位置を前記駆動機構によって変更しつつ、前記第1主走査駆動、前記第1ヨーイング補正動作および前記露光動作を繰り返す請求項10ないし17のいずれか一項に記載の露光方法であって、
前記第1ヨーイング補正情報は、前記複数の副走査位置のそれぞれについて設けられ、
前記第1ヨーイング補正動作では、前記駆動対象が位置する前記副走査位置について設けられた前記第1ヨーイング補正情報に基づき前記駆動対象の前記副走査方向への位置を補正する露光方法。 - 前記基板に対しては、副走査方向において異なる複数の露光位置が設定され、前記複数の露光位置にそれぞれ対応する、前記副走査方向において異なる複数の副走査位置の間で、前記駆動対象の位置を前記駆動機構によって変更しつつ、前記第1主走査駆動、前記第1ヨーイング補正動作および前記露光動作を繰り返す請求項10ないし17のいずれか一項に記載の露光方法であって、
前記第1ヨーイング補正情報は、前記副走査方向において異なる複数の設定位置のそれぞれについて設けられ、
前記複数の設定位置は、前記複数の副走査位置よりも少なく、
前記第1ヨーイング補正動作では、前記複数の設定位置のうち、前記駆動対象が位置する前記副走査位置に最も近い前記設定位置ついて設けられた前記第1ヨーイング補正情報に基づき、または前記副走査位置に最も近い前記設定位置について設けられた前記第1ヨーイング補正情報と前記副走査位置に二番目に近い前記設定位置について設けられた前記第1ヨーイング補正情報を用いた線形補間により、前記駆動対象の前記副走査方向への位置を補正する露光方法。 - 基板が載置されるステージと、
照射範囲に光を照射する露光ヘッドと、
前記ステージおよび前記露光ヘッドのうちの一方の駆動対象を主走査方向へ駆動する駆動機構と、
前記駆動機構により前記駆動対象を前記主走査方向へ駆動することで、前記駆動対象が主走査方向における第1移動範囲を移動するとともに、前記基板が前記照射範囲を相対的に前記主走査方向に通過する第1主走査駆動を実行しつつ、前記露光ヘッドから前記照射範囲に光を照射することで、前記基板において前記主走査方向に延びる領域を露光する露光動作を実行する制御部と
を備え、
前記制御部は、前記第1移動範囲における前記駆動対象の主走査方向への位置に応じて、前記第1主走査駆動の実行中に前記駆動対象の副走査方向への位置、および前記駆動対象のヨー方向への回転量の少なくとも一方を前記駆動機構によって補正する補正動作を実行する露光装置。 - 前記第1移動範囲での前記駆動対象の前記主走査方向への位置に応じて前記駆動対象の副走査方向への位置を補正するための第1真直補正量を示す第1真直補正情報を記憶する記憶部をさらに備え、
前記補正動作は、前記第1真直補正情報に基づき、前記第1主走査駆動の実行中に前記駆動対象の前記副走査方向への位置を前記駆動機構によって補正する第1真直補正動作を含む請求項20に記載の露光装置。 - 前記第1移動範囲における前記駆動対象の前記主走査方向への位置に応じて前記駆動対象のヨー方向への回転量を補正するための第1ヨーイング補正量を示す第1ヨーイング補正情報を記憶する記憶部をさらに備え、
前記補正動作は、前記第1ヨーイング補正情報に基づき、前記第1主走査駆動の実行中に前記駆動対象の前記ヨー方向への回転量を前記駆動機構によって補正する第1ヨーイング補正動作を含む請求項20に記載の露光装置。
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