TWI353807B - Manufacturing method of mounting substrate withref - Google Patents
Manufacturing method of mounting substrate withref Download PDFInfo
- Publication number
- TWI353807B TWI353807B TW94133473A TW94133473A TWI353807B TW I353807 B TWI353807 B TW I353807B TW 94133473 A TW94133473 A TW 94133473A TW 94133473 A TW94133473 A TW 94133473A TW I353807 B TWI353807 B TW I353807B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- reflector
- mounting substrate
- manufacturing
- resin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005195610A JP3963923B2 (ja) | 2005-07-04 | 2005-07-04 | リフレクタ付き実装基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200704309A TW200704309A (en) | 2007-01-16 |
TWI353807B true TWI353807B (en) | 2011-12-01 |
Family
ID=37597689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94133473A TWI353807B (en) | 2005-07-04 | 2005-09-27 | Manufacturing method of mounting substrate withref |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3963923B2 (ko) |
KR (1) | KR101155693B1 (ko) |
CN (1) | CN1892979A (ko) |
TW (1) | TWI353807B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100958329B1 (ko) * | 2009-08-14 | 2010-05-17 | (주)참빛 | 마스크를 적용하여 측면 반사면을 금속 코팅한 발광 다이오드 패키지 기판 및 그 제조 방법 |
JP5780044B2 (ja) * | 2011-08-05 | 2015-09-16 | 大日本印刷株式会社 | リフレクタ付基板の製造方法 |
JP2013110179A (ja) * | 2011-11-18 | 2013-06-06 | Citizen Holdings Co Ltd | 半導体発光装置 |
KR101292197B1 (ko) * | 2012-04-10 | 2013-08-01 | 대덕전자 주식회사 | 발광다이오드 실장 회로기판에 반사판을 제조하는 방법 |
JP2014063777A (ja) * | 2012-09-19 | 2014-04-10 | Chang Wah Electromaterials Inc | 発光ダイオードパッケージの製造方法及びその構造 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11220178A (ja) * | 1998-01-30 | 1999-08-10 | Rohm Co Ltd | 半導体発光装置 |
-
2005
- 2005-07-04 JP JP2005195610A patent/JP3963923B2/ja active Active
- 2005-09-27 TW TW94133473A patent/TWI353807B/zh not_active IP Right Cessation
- 2005-10-06 KR KR1020050093775A patent/KR101155693B1/ko not_active IP Right Cessation
- 2005-10-31 CN CN 200510118761 patent/CN1892979A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR101155693B1 (ko) | 2012-06-12 |
KR20070004402A (ko) | 2007-01-09 |
CN1892979A (zh) | 2007-01-10 |
JP2007013067A (ja) | 2007-01-18 |
JP3963923B2 (ja) | 2007-08-22 |
TW200704309A (en) | 2007-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |