TWI351524B - Apparatus for planarizing a probe card and method - Google Patents

Apparatus for planarizing a probe card and method Download PDF

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Publication number
TWI351524B
TWI351524B TW093122605A TW93122605A TWI351524B TW I351524 B TWI351524 B TW I351524B TW 093122605 A TW093122605 A TW 093122605A TW 93122605 A TW93122605 A TW 93122605A TW I351524 B TWI351524 B TW I351524B
Authority
TW
Taiwan
Prior art keywords
probe
plane
probe card
plate
central portion
Prior art date
Application number
TW093122605A
Other languages
English (en)
Chinese (zh)
Other versions
TW200514181A (en
Inventor
Craig Z Foster
Ray Wakefield
Original Assignee
Nextest Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nextest Systems Corp filed Critical Nextest Systems Corp
Publication of TW200514181A publication Critical patent/TW200514181A/zh
Application granted granted Critical
Publication of TWI351524B publication Critical patent/TWI351524B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW093122605A 2003-07-28 2004-07-28 Apparatus for planarizing a probe card and method TWI351524B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49062103P 2003-07-28 2003-07-28

Publications (2)

Publication Number Publication Date
TW200514181A TW200514181A (en) 2005-04-16
TWI351524B true TWI351524B (en) 2011-11-01

Family

ID=34115416

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122605A TWI351524B (en) 2003-07-28 2004-07-28 Apparatus for planarizing a probe card and method

Country Status (5)

Country Link
US (2) US7098650B2 (https=)
JP (1) JP4571133B2 (https=)
KR (1) KR101181639B1 (https=)
TW (1) TWI351524B (https=)
WO (1) WO2005013332A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI593981B (zh) * 2012-06-06 2017-08-01 東京威力科創股份有限公司 Wafer inspection interface and wafer inspection device

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
JP4951523B2 (ja) * 2005-11-15 2012-06-13 株式会社アドバンテスト テストヘッド、電子部品試験装置、及び電子部品試験装置へのパフォーマンスボードの装着方法
WO2007057944A1 (ja) 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
US7746089B2 (en) * 2006-09-29 2010-06-29 Formfactor, Inc. Method and apparatus for indirect planarization
JP2010050437A (ja) * 2008-07-25 2010-03-04 Yokogawa Electric Corp Ｉｃテスタ
JP2010175507A (ja) 2009-02-02 2010-08-12 Micronics Japan Co Ltd 電気的接続装置
JPWO2011013231A1 (ja) * 2009-07-30 2013-01-07 株式会社アドバンテスト プローブカード保持装置及びプローバ
US8278956B2 (en) * 2010-04-08 2012-10-02 Advantest America, Inc Probecard system and method
EP2877831A4 (en) * 2012-06-29 2016-03-16 Hydrovision Asia Pte Ltd IMPROVED FABRIC MEASURING DEVICE
US9134343B2 (en) * 2012-09-28 2015-09-15 Intel Corporation Sort probe gripper
KR101255113B1 (ko) 2012-10-31 2013-04-19 주식회사 프로이천 완충부재를 구비한 프로브 블록의 제조방법
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
KR102566685B1 (ko) 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
US11022628B2 (en) 2019-09-13 2021-06-01 Reid-Ashman Manufacturing, Inc. Probe card support apparatus for automatic test equipment
CN116559506B (zh) * 2023-04-28 2025-11-18 强一半导体(苏州)股份有限公司 一种薄膜探针卡

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US3810016A (en) * 1971-12-17 1974-05-07 Western Electric Co Test probe for semiconductor devices
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
JPH0833433B2 (ja) * 1987-11-30 1996-03-29 東京エレクトロン株式会社 プローブ装置
US5081415A (en) * 1990-08-07 1992-01-14 United Microelectronics Corporation Load board insertion system
US5059898A (en) * 1990-08-09 1991-10-22 Tektronix, Inc. Wafer probe with transparent loading member
US5559446A (en) * 1993-07-19 1996-09-24 Tokyo Electron Kabushiki Kaisha Probing method and device
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
JP3135825B2 (ja) 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
US6798224B1 (en) * 1997-02-11 2004-09-28 Micron Technology, Inc. Method for testing semiconductor wafers
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
JPH1123615A (ja) 1997-05-09 1999-01-29 Hitachi Ltd 接続装置および検査システム
JP3315339B2 (ja) * 1997-05-09 2002-08-19 株式会社日立製作所 半導体素子の製造方法並びに半導体素子へのプロービング方法およびその装置
US6078186A (en) * 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
JP2001056346A (ja) 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
JP3343541B2 (ja) * 2000-02-18 2002-11-11 日本電子材料株式会社 プローブカード
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
KR100347765B1 (ko) * 2000-10-18 2002-08-09 삼성전자 주식회사 웨이퍼의 전기적 특성을 검사하는 방법 및 장치
TWI272394B (en) * 2004-02-24 2007-02-01 Mjc Probe Inc Multi-function probe card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI593981B (zh) * 2012-06-06 2017-08-01 東京威力科創股份有限公司 Wafer inspection interface and wafer inspection device

Also Published As

Publication number Publication date
KR101181639B1 (ko) 2012-09-13
TW200514181A (en) 2005-04-16
JP2007500945A (ja) 2007-01-18
JP4571133B2 (ja) 2010-10-27
US8120375B2 (en) 2012-02-21
US20060279302A1 (en) 2006-12-14
KR20060034718A (ko) 2006-04-24
US20050062464A1 (en) 2005-03-24
WO2005013332A3 (en) 2005-12-29
WO2005013332A2 (en) 2005-02-10
US7098650B2 (en) 2006-08-29

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