KR101181639B1 - 프로브 카드를 평탄화하는 장치 및 상기 장치를 사용하는방법 - Google Patents

프로브 카드를 평탄화하는 장치 및 상기 장치를 사용하는방법 Download PDF

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Publication number
KR101181639B1
KR101181639B1 KR1020067001928A KR20067001928A KR101181639B1 KR 101181639 B1 KR101181639 B1 KR 101181639B1 KR 1020067001928 A KR1020067001928 A KR 1020067001928A KR 20067001928 A KR20067001928 A KR 20067001928A KR 101181639 B1 KR101181639 B1 KR 101181639B1
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KR
South Korea
Prior art keywords
probe card
plane
reference member
probe
central portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020067001928A
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English (en)
Korean (ko)
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KR20060034718A (ko
Inventor
크래이그 지. 포스터
레이 웨이크필드
Original Assignee
넥스테스트 시스템즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20060034718A publication Critical patent/KR20060034718A/ko
Application granted granted Critical
Publication of KR101181639B1 publication Critical patent/KR101181639B1/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020067001928A 2003-07-28 2004-07-28 프로브 카드를 평탄화하는 장치 및 상기 장치를 사용하는방법 Expired - Lifetime KR101181639B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US49062103P 2003-07-28 2003-07-28
US60/490,621 2003-07-28
PCT/US2004/024574 WO2005013332A2 (en) 2003-07-28 2004-07-28 Apparatus for planarizing a probe card and method using same

Publications (2)

Publication Number Publication Date
KR20060034718A KR20060034718A (ko) 2006-04-24
KR101181639B1 true KR101181639B1 (ko) 2012-09-13

Family

ID=34115416

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067001928A Expired - Lifetime KR101181639B1 (ko) 2003-07-28 2004-07-28 프로브 카드를 평탄화하는 장치 및 상기 장치를 사용하는방법

Country Status (5)

Country Link
US (2) US7098650B2 (https=)
JP (1) JP4571133B2 (https=)
KR (1) KR101181639B1 (https=)
TW (1) TWI351524B (https=)
WO (1) WO2005013332A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101255113B1 (ko) 2012-10-31 2013-04-19 주식회사 프로이천 완충부재를 구비한 프로브 블록의 제조방법
US10295564B2 (en) 2016-07-18 2019-05-21 Samsung Electronics Co., Ltd. Apparatus for clamping a probe card and probe card including the same

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
JP4951523B2 (ja) * 2005-11-15 2012-06-13 株式会社アドバンテスト テストヘッド、電子部品試験装置、及び電子部品試験装置へのパフォーマンスボードの装着方法
WO2007057944A1 (ja) 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
US7746089B2 (en) * 2006-09-29 2010-06-29 Formfactor, Inc. Method and apparatus for indirect planarization
JP2010050437A (ja) * 2008-07-25 2010-03-04 Yokogawa Electric Corp Ｉｃテスタ
JP2010175507A (ja) 2009-02-02 2010-08-12 Micronics Japan Co Ltd 電気的接続装置
JPWO2011013231A1 (ja) * 2009-07-30 2013-01-07 株式会社アドバンテスト プローブカード保持装置及びプローバ
US8278956B2 (en) * 2010-04-08 2012-10-02 Advantest America, Inc Probecard system and method
JP5952645B2 (ja) * 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
EP2877831A4 (en) * 2012-06-29 2016-03-16 Hydrovision Asia Pte Ltd IMPROVED FABRIC MEASURING DEVICE
US9134343B2 (en) * 2012-09-28 2015-09-15 Intel Corporation Sort probe gripper
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
US11022628B2 (en) 2019-09-13 2021-06-01 Reid-Ashman Manufacturing, Inc. Probe card support apparatus for automatic test equipment
CN116559506B (zh) * 2023-04-28 2025-11-18 强一半导体(苏州)股份有限公司 一种薄膜探针卡

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US6359456B1 (en) * 1997-02-11 2002-03-19 Micron Technology, Inc. Probe card and test system for semiconductor wafers

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810016A (en) * 1971-12-17 1974-05-07 Western Electric Co Test probe for semiconductor devices
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
JPH0833433B2 (ja) * 1987-11-30 1996-03-29 東京エレクトロン株式会社 プローブ装置
US5081415A (en) * 1990-08-07 1992-01-14 United Microelectronics Corporation Load board insertion system
US5059898A (en) * 1990-08-09 1991-10-22 Tektronix, Inc. Wafer probe with transparent loading member
US5559446A (en) * 1993-07-19 1996-09-24 Tokyo Electron Kabushiki Kaisha Probing method and device
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
JP3135825B2 (ja) 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
US6798224B1 (en) * 1997-02-11 2004-09-28 Micron Technology, Inc. Method for testing semiconductor wafers
JPH1123615A (ja) 1997-05-09 1999-01-29 Hitachi Ltd 接続装置および検査システム
JP3315339B2 (ja) * 1997-05-09 2002-08-19 株式会社日立製作所 半導体素子の製造方法並びに半導体素子へのプロービング方法およびその装置
US6078186A (en) * 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
JP2001056346A (ja) 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
JP3343541B2 (ja) * 2000-02-18 2002-11-11 日本電子材料株式会社 プローブカード
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
KR100347765B1 (ko) * 2000-10-18 2002-08-09 삼성전자 주식회사 웨이퍼의 전기적 특성을 검사하는 방법 및 장치
TWI272394B (en) * 2004-02-24 2007-02-01 Mjc Probe Inc Multi-function probe card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US6359456B1 (en) * 1997-02-11 2002-03-19 Micron Technology, Inc. Probe card and test system for semiconductor wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101255113B1 (ko) 2012-10-31 2013-04-19 주식회사 프로이천 완충부재를 구비한 프로브 블록의 제조방법
US10295564B2 (en) 2016-07-18 2019-05-21 Samsung Electronics Co., Ltd. Apparatus for clamping a probe card and probe card including the same

Also Published As

Publication number Publication date
TW200514181A (en) 2005-04-16
JP2007500945A (ja) 2007-01-18
JP4571133B2 (ja) 2010-10-27
US8120375B2 (en) 2012-02-21
US20060279302A1 (en) 2006-12-14
KR20060034718A (ko) 2006-04-24
US20050062464A1 (en) 2005-03-24
WO2005013332A3 (en) 2005-12-29
WO2005013332A2 (en) 2005-02-10
US7098650B2 (en) 2006-08-29
TWI351524B (en) 2011-11-01

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