TWI348075B - - Google Patents

Info

Publication number
TWI348075B
TWI348075B TW095139378A TW95139378A TWI348075B TW I348075 B TWI348075 B TW I348075B TW 095139378 A TW095139378 A TW 095139378A TW 95139378 A TW95139378 A TW 95139378A TW I348075 B TWI348075 B TW I348075B
Authority
TW
Taiwan
Application number
TW095139378A
Other versions
TW200725178A (en
Inventor
Yoshiki Ajioka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200725178A publication Critical patent/TW200725178A/zh
Application granted granted Critical
Publication of TWI348075B publication Critical patent/TWI348075B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW095139378A 2005-10-25 2006-10-25 Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board TW200725178A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005310058 2005-10-25
JP2006101785 2006-04-03

Publications (2)

Publication Number Publication Date
TW200725178A TW200725178A (en) 2007-07-01
TWI348075B true TWI348075B (zh) 2011-09-01

Family

ID=37967631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139378A TW200725178A (en) 2005-10-25 2006-10-25 Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

Country Status (7)

Country Link
US (1) US8101339B2 (zh)
JP (1) JP4788716B2 (zh)
KR (2) KR101141841B1 (zh)
CN (2) CN103885290B (zh)
MY (1) MY148552A (zh)
TW (1) TW200725178A (zh)
WO (1) WO2007049519A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4586067B2 (ja) * 2005-05-30 2010-11-24 日立化成工業株式会社 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR101141841B1 (ko) 2005-10-25 2012-05-08 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트,레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
TW200745749A (en) * 2006-02-21 2007-12-16 Hitachi Chemical Co Ltd Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel
JP5743555B2 (ja) * 2010-02-02 2015-07-01 リンテック株式会社 ダイシングシート
TWI529486B (zh) * 2010-08-10 2016-04-11 日立化成股份有限公司 感光性樹脂組成物、感光性元件、光阻圖型之製造方法及印刷配線板之製造方法
JP5626574B2 (ja) * 2010-10-27 2014-11-19 日立化成株式会社 感光性樹脂組成物並びにこれを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP5707420B2 (ja) * 2010-12-24 2015-04-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
KR101504823B1 (ko) * 2012-05-31 2015-03-20 주식회사 엘지화학 열경화성 수지 조성물, 이로 제조된 열경화물, 이를 포함하는 디스플레이 장치 및 컬러 필터 제조방법
KR101603845B1 (ko) * 2013-06-18 2016-03-15 주식회사 엘지화학 공중합체, 이를 포함하는 감광성 수지 조성물, 상기 감광성 수지 조성물로 제조된 감광재 및 이를 포함하는 디스플레이 장치
JP6361191B2 (ja) * 2014-03-14 2018-07-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法
KR102097261B1 (ko) * 2015-08-25 2020-04-06 아사히 가세이 가부시키가이샤 감광성 수지 조성물
JP7246615B2 (ja) * 2017-12-20 2023-03-28 住友電気工業株式会社 プリント配線板の製造方法及び積層体

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JP4586067B2 (ja) * 2005-05-30 2010-11-24 日立化成工業株式会社 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4642076B2 (ja) 2005-07-22 2011-03-02 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体
KR101141841B1 (ko) 2005-10-25 2012-05-08 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트,레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
TW200745749A (en) 2006-02-21 2007-12-16 Hitachi Chemical Co Ltd Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel

Also Published As

Publication number Publication date
US8101339B2 (en) 2012-01-24
MY148552A (en) 2013-04-30
TW200725178A (en) 2007-07-01
JPWO2007049519A1 (ja) 2009-04-30
KR101190945B1 (ko) 2012-10-12
CN103885292A (zh) 2014-06-25
CN103885290B (zh) 2017-11-03
CN103885292B (zh) 2017-09-22
KR101141841B1 (ko) 2012-05-08
KR20100068303A (ko) 2010-06-22
JP4788716B2 (ja) 2011-10-05
KR20080042937A (ko) 2008-05-15
CN103885290A (zh) 2014-06-25
US20090317746A1 (en) 2009-12-24
WO2007049519A1 (ja) 2007-05-03

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