TWI347617B - Inductor devices - Google Patents

Inductor devices

Info

Publication number
TWI347617B
TWI347617B TW096138710A TW96138710A TWI347617B TW I347617 B TWI347617 B TW I347617B TW 096138710 A TW096138710 A TW 096138710A TW 96138710 A TW96138710 A TW 96138710A TW I347617 B TWI347617 B TW I347617B
Authority
TW
Taiwan
Prior art keywords
inductor devices
inductor
devices
Prior art date
Application number
TW096138710A
Other languages
English (en)
Other versions
TW200834613A (en
Inventor
Chang Lin Wei
Kuo Chiang Chin
Cheng Hua Tsai
Chin Sun Shyu
Chang Sheng Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Publication of TW200834613A publication Critical patent/TW200834613A/zh
Application granted granted Critical
Publication of TWI347617B publication Critical patent/TWI347617B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H01F30/08—Fixed transformers not covered by group H01F19/00 characterised by the structure without magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/02—Fixed inductances of the signal type  without magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW096138710A 2007-02-07 2007-10-16 Inductor devices TWI347617B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US90019907P 2007-02-07 2007-02-07
US11/852,094 US20080186123A1 (en) 2007-02-07 2007-09-07 Inductor devices

Publications (2)

Publication Number Publication Date
TW200834613A TW200834613A (en) 2008-08-16
TWI347617B true TWI347617B (en) 2011-08-21

Family

ID=39675661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096138710A TWI347617B (en) 2007-02-07 2007-10-16 Inductor devices

Country Status (5)

Country Link
US (2) US20080186123A1 (zh)
JP (1) JP4995062B2 (zh)
KR (1) KR100991872B1 (zh)
CN (1) CN101241795B (zh)
TW (1) TWI347617B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426846B (zh) * 2011-11-28 2014-02-11 Nat Univ Kaohsiung Multi - layer printed circuit board signal connection structure with electromagnetic energy gap

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JP2009302418A (ja) * 2008-06-17 2009-12-24 Nec Electronics Corp 回路装置及びその製造方法
US8855788B2 (en) 2009-03-04 2014-10-07 Imricor Medical Systems, Inc. MRI compatible electrode circuit
WO2010102122A1 (en) * 2009-03-04 2010-09-10 Imricor Medical Systems, Inc. Mri compatible electrode circuit
US8805540B2 (en) 2009-03-04 2014-08-12 Imricor Medical Systems, Inc. MRI compatible cable
US8831743B2 (en) 2009-03-04 2014-09-09 Imricor Medical Systems, Inc. MRI compatible electrode circuit
US9190201B2 (en) 2009-03-04 2015-11-17 Qualcomm Incorporated Magnetic film enhanced inductor
US8843213B2 (en) 2009-03-04 2014-09-23 Imricor Medical Systems, Inc. MRI compatible co-radially wound lead assembly
US8761899B2 (en) 2009-03-04 2014-06-24 Imricor Medical Systems, Inc. MRI compatible conductive wires
JP2010245371A (ja) * 2009-04-08 2010-10-28 Elpida Memory Inc 半導体装置および半導体装置の製造方法
TWI498928B (zh) * 2010-08-04 2015-09-01 Richwave Technology Corp 螺旋電感元件
EP2661757A1 (en) * 2011-01-04 2013-11-13 ÅAC Microtec AB Coil assembly comprising planar coil
US9305992B2 (en) * 2011-06-16 2016-04-05 Altera Corporation Integrated circuit inductors with intertwined conductors
US20140225706A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated In substrate coupled inductor structure
US10084503B2 (en) * 2014-10-15 2018-09-25 Skyworks Solutions, Inc. Surface-mount technology devices and related methods
US10878997B2 (en) * 2015-03-13 2020-12-29 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit having current-sensing coil
CN104934209B (zh) * 2015-06-24 2017-09-26 广州金升阳科技有限公司 超高频功率变换器的3d集成架构
KR20170059649A (ko) * 2015-11-23 2017-05-31 에스케이하이닉스 주식회사 높은 q-인자를 갖는 인덕터 및 이를 포함하는 알에프 집적회로
CN208589315U (zh) * 2015-12-14 2019-03-08 株式会社村田制作所 层叠型线圈
US10163557B2 (en) 2015-12-17 2018-12-25 Intel Corporation Helical plated through-hole package inductor
CN105552542A (zh) * 2016-01-14 2016-05-04 中国矿业大学(北京) 一种k波段电磁双负超材料
CN107046366B (zh) 2016-02-05 2019-06-04 台达电子企业管理（上海）有限公司 电源变换器及其制备方法
JP6838328B2 (ja) * 2016-09-15 2021-03-03 大日本印刷株式会社 インダクタおよびインダクタの製造方法
TWI679825B (zh) * 2019-01-10 2019-12-11 友達光電股份有限公司 顯示裝置以及無線傳輸裝置

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JP2005183646A (ja) 2003-12-19 2005-07-07 Nec Corp 多層基板インダクタおよびその製造方法
JP4464127B2 (ja) * 2003-12-22 2010-05-19 Ｎｅｃエレクトロニクス株式会社 半導体集積回路及びその製造方法
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US7262680B2 (en) * 2004-02-27 2007-08-28 Illinois Institute Of Technology Compact inductor with stacked via magnetic cores for integrated circuits
JP4867206B2 (ja) * 2005-06-14 2012-02-01 セイコーエプソン株式会社 半導体装置
TWI260075B (en) * 2005-10-24 2006-08-11 Via Tech Inc Embedded inductor element and chip package applying the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426846B (zh) * 2011-11-28 2014-02-11 Nat Univ Kaohsiung Multi - layer printed circuit board signal connection structure with electromagnetic energy gap

Also Published As

Publication number Publication date
JP2008193059A (ja) 2008-08-21
TW200834613A (en) 2008-08-16
KR20080074024A (ko) 2008-08-12
US20110169597A1 (en) 2011-07-14
US20080186123A1 (en) 2008-08-07
CN101241795B (zh) 2012-04-04
KR100991872B1 (ko) 2010-11-04
US8274352B2 (en) 2012-09-25
JP4995062B2 (ja) 2012-08-08
CN101241795A (zh) 2008-08-13

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees